| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/19/2015 | US20150048481 Semiconductor device |
| 02/19/2015 | US20150048480 Integrated passive device (ipd) on subtrate |
| 02/19/2015 | US20150048479 Self-aligned via fuse |
| 02/19/2015 | US20150048471 Semiconductor module having an integrated waveguide for radar signals |
| 02/19/2015 | US20150048459 Device for detecting a laser attack in an integrated circuit chip |
| 02/19/2015 | US20150048457 Mask Optimization for Multi-Layer Contacts |
| 02/19/2015 | US20150048432 Meander Line Resistor Structure |
| 02/19/2015 | US20150048388 Flat panel display apparatus and method of manufacturing the same |
| 02/19/2015 | DE112013002431T5 Verfahren und Vorrichtung zur Steuerung der thermischen Wechselbeanspruchung Method and apparatus for controlling the thermal cycling |
| 02/19/2015 | DE112013001543T5 Vorrichtung und Verfahren zum Schutz von elektronischen Präzisions-Mischsignalschaltungen Apparatus and method for protecting electronic precision mixed-signal circuits |
| 02/19/2015 | DE10318921B4 Herstellungsverfahren für eine Halbleitereinrichtung Manufacturing method of a semiconductor device |
| 02/19/2015 | DE102014111533A1 Chipanordnung Chip system |
| 02/19/2015 | DE102014110933A1 Mehrchip-Gehäuse auf Glasbasis Multi-chip package on glass base |
| 02/19/2015 | DE102014102018B3 Leistungshalbleitermodul mit niederinduktiv ausgestalteten modulinternen Last- und Hilfsverbindungseinrichtungen Power semiconductor module with low inductance module configured internal load and auxiliary connecting devices |
| 02/19/2015 | DE102013216282A1 Elektrisches Bauteil mit einer elektrisch zu kontaktierenden Stelle sowie Verfahren zur Vorbereitung eines elektrischen Bauteils für einen Lötprozess Electrical component with an electrically contacting point, as well as process for preparing an electrical component for a soldering process |
| 02/19/2015 | DE102013216049A1 Vorrichtung zur Montage und Befestigung sowie Anordnung mit einer solchen Vorrichtung Device for mounting and fastening and assembly comprising such a device |
| 02/19/2015 | DE102013108805A1 Thermoelektrisches Modul sowie Verfahren zum Herstellen eines thermoelektrischen Moduls The thermoelectric module as well as method of making a thermoelectric module |
| 02/19/2015 | DE102008063407B4 Eine optoelektronische oberflächenmontierte Vorrichtung und ein Verfahren zum Bilden einer optoelektronischen oberflächenmontierten Vorrichtung A surface-mounted opto-electronic device and a method for forming a surface-mounted optoelectronic device |
| 02/19/2015 | DE102004004596B4 Verfahren zur Bestimmung des Programmierzustands einer Antifuse A method for determining the programming state of an antifuse |
| 02/18/2015 | EP2838329A1 Cooling structure, vortex-flow forming plate molding apparatus, and method of molding vortex-flow generating unit |
| 02/18/2015 | EP2838116A1 Stacked packaging structure |
| 02/18/2015 | EP2838115A1 Integrated circuit |
| 02/18/2015 | EP2838114A2 Chip package |
| 02/18/2015 | EP2837458A1 System for laser beam soldering having a soldering wire feeder system and a coated wire feeder system |
| 02/18/2015 | EP2837027A1 Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features |
| 02/18/2015 | EP2837026A2 Cte matched interposer and method of making |
| 02/18/2015 | EP2836773A2 Hot side management of thermoelectric cooling module |
| 02/18/2015 | EP2836629A1 Device for producing synthetic fibres |
| 02/18/2015 | EP2836333A1 Laser protection device in the shape of a flexible curtain-type element for detecting laser radiation |
| 02/17/2015 | US8958242 Thermal treatment of flash memories |
| 02/17/2015 | US8958229 Nonvolatile memory device and method of fabricating same |
| 02/17/2015 | US8958227 Accessing or interconnecting integrated circuits |
| 02/17/2015 | US8958225 Electric power converter |
| 02/17/2015 | US8958215 Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board |
| 02/17/2015 | US8958209 Electronic power module, and method for manufacturing said module |
| 02/17/2015 | US8958208 Semiconductor device |
| 02/17/2015 | US8958207 Heat radiation material, electronic device and method of manufacturing electronic device |
| 02/17/2015 | US8958203 Electronic device with air guiding apparatus |
| 02/17/2015 | US8957923 Light emitting device, light emitting element array, and image display device |
| 02/17/2015 | US8957695 Semiconductor device having plural semiconductor chip stacked with one another |
| 02/17/2015 | US8957532 Resin compact, method for producing resin compact, resin composition, method for producing resin composition and electronic component device |
| 02/17/2015 | US8957531 Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
| 02/17/2015 | US8957530 Integrated circuit packaging system with embedded circuitry and post |
| 02/17/2015 | US8957529 Power voltage supply apparatus for three dimensional semiconductor |
| 02/17/2015 | US8957528 Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance |
| 02/17/2015 | US8957527 Microelectronic package with terminals on dielectric mass |
| 02/17/2015 | US8957526 Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages |
| 02/17/2015 | US8957525 3D semiconductor interposer for heterogeneous integration of standard memory and split-architecture processor |
| 02/17/2015 | US8957524 Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure |
| 02/17/2015 | US8957523 Dielectric posts in metal layers |
| 02/17/2015 | US8957522 Semiconductor device and manufacturing method of semiconductor device |
| 02/17/2015 | US8957521 Mounted structure |
| 02/17/2015 | US8957520 Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts |
| 02/17/2015 | US8957519 Structure and metallization process for advanced technology nodes |
| 02/17/2015 | US8957518 Molded interposer package and method for fabricating the same |
| 02/17/2015 | US8957517 Semiconductor device including cooler |
| 02/17/2015 | US8957516 Low cost and high performance flip chip package |
| 02/17/2015 | US8957515 Integrated circuit package system with array of external interconnects |
| 02/17/2015 | US8957514 Operating and manufacturing a DC-DC converter |
| 02/17/2015 | US8957513 Semiconductor device with embedded interconnect pad |
| 02/17/2015 | US8957512 Oversized interposer |
| 02/17/2015 | US8957511 Apparatus and methods for high-density chip connectivity |
| 02/17/2015 | US8957510 Using an integrated circuit die configuration for package height reduction |
| 02/17/2015 | US8957509 Integrated circuit packaging system with thermal emission and method of manufacture thereof |
| 02/17/2015 | US8957508 Semiconductor device and method of manufacturing the same |
| 02/17/2015 | US8957507 Technology of reducing radiation noise of semiconductor device |
| 02/17/2015 | US8957506 Quad flat non-leaded package |
| 02/17/2015 | US8957505 Device substrate and fabrication method thereof |
| 02/17/2015 | US8957504 Integrated structure with a silicon-through via |
| 02/17/2015 | US8957503 Chip package and method of manufacturing the same |
| 02/17/2015 | US8957498 On-chip electronic device and method for manufacturing the same |
| 02/17/2015 | US8957497 Vertically integrated systems |
| 02/17/2015 | US8957492 Semiconductor device having grooves on a side surface and method of manufacturing the same |
| 02/17/2015 | US8957489 Component arrangement and method for producing a component arrangement |
| 02/17/2015 | US8957483 Electrically conductive lines and integrated circuitry comprising a line of recessed access devices |
| 02/17/2015 | US8957482 Electrical fuse and related applications |
| 02/17/2015 | US8957475 Bootstrap field effect transistor (FET) |
| 02/17/2015 | US8957434 Light emitting device, light emitting module, and method for manufacturing light emitting device |
| 02/17/2015 | US8957316 Electrical component assembly for thermal transfer |
| 02/17/2015 | US8957147 Resin-linear organosiloxane block copolymers |
| 02/17/2015 | US8957136 Epoxysilicone condensate, curable composition comprising condensate, and cured product thereof |
| 02/17/2015 | US8956977 Semiconductor device production method and rinse |
| 02/17/2015 | US8956968 Method for fabricating a metal silicide interconnect in 3D non-volatile memory |
| 02/17/2015 | US8956967 Method of forming an interconnection structure |
| 02/17/2015 | US8956966 TSV structures and methods for forming the same |
| 02/17/2015 | US8956958 Method for the production of a substrate comprising embedded layers of getter material |
| 02/17/2015 | US8956955 Manufacturing method of semiconductor device and semiconductor device |
| 02/17/2015 | US8956947 Method for manufacturing semiconductor substrate |
| 02/17/2015 | US8956946 Active pad patterns for gate alignment marks |
| 02/17/2015 | US8956922 Coating method for an optoelectronic chip-on-board module |
| 02/17/2015 | US8956920 Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe |
| 02/17/2015 | US8956919 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof |
| 02/17/2015 | US8956915 Method of manufacturing a three-dimensional packaging semiconductor device |
| 02/17/2015 | US8956914 Integrated circuit package system with overhang die |
| 02/17/2015 | US8956904 Apparatus and method of wafer bonding using compatible alloy |
| 02/17/2015 | US8956889 Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) |
| 02/17/2015 | US8956201 Correcting current crowding in row bar and vias for single pad bonding |
| 02/17/2015 | US8955983 Thermal management for handheld projectors |
| 02/17/2015 | US8955759 Inlays for security documents |
| 02/17/2015 | US8955218 Method for fabricating package substrate |