Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2003
02/11/2003US6518670 Electrically porous on-chip decoupling/shielding layer
02/11/2003US6518669 Semiconductor device including a pad and a method of manufacturing the same
02/11/2003US6518668 Multiple seed layers for metallic interconnects
02/11/2003US6518667 Semiconductor package using micro balls and production method thereof
02/11/2003US6518666 Circuit board reducing a warp and a method of mounting an integrated circuit chip
02/11/2003US6518664 Semiconductor integrated circuit device and manufacturing method of that
02/11/2003US6518663 Constant impedance routing for high performance integrated circuit packaging
02/11/2003US6518662 Method of assembling a semiconductor chip package
02/11/2003US6518661 Apparatus for metal stack thermal management in semiconductor devices
02/11/2003US6518660 Semiconductor package with ground projections
02/11/2003US6518659 Stackable package having a cavity and a lid for an electronic device
02/11/2003US6518658 Surface-mounting type electronic circuit unit suitable for miniaturization
02/11/2003US6518657 Semiconductor device and lead frame assembly/lead frame for making a semiconductor device
02/11/2003US6518655 Multi-chip package-type semiconductor device
02/11/2003US6518654 Packages for semiconductor die
02/11/2003US6518653 Lead frame and semiconductor device
02/11/2003US6518652 Semiconductor package
02/11/2003US6518651 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
02/11/2003US6518650 Tape under frame for lead frame IC package assembly
02/11/2003US6518649 Tape carrier type semiconductor device with gold/gold bonding of leads to bumps
02/11/2003US6518648 Superconductor barrier layer for integrated circuit interconnects
02/11/2003US6518647 Plated aluminum leadframes for semiconductor devices, including two nickel layers, and method of fabrication
02/11/2003US6518646 Semiconductor device with variable composition low-k inter-layer dielectric and method of making
02/11/2003US6518643 Tri-layer dielectric fuse cap for laser deletion
02/11/2003US6518642 Contact to passive device of a semiconductor circuit device, the passive device being, for example, a resistor, an inductor, a fuse or the like. Adjacent, spaced, elevated, so-called dummy pattern (shoulder) regions are formed under
02/11/2003US6518630 Thin film transistor array substrate for liquid crystal display and method for fabricating same
02/11/2003US6518627 Semiconductor device and method of manufacturing the same
02/11/2003US6518622 Vertical replacement gate (VRG) MOSFET with a conductive layer adjacent a source/drain region and method of manufacture therefor
02/11/2003US6518606 Semiconductor device permitting electrical measurement of contact alignment error
02/11/2003US6518518 Resin substrate
02/11/2003US6518516 Multilayered laminate
02/11/2003US6518510 Bump-attached wiring circuit board and method for manufacturing same
02/11/2003US6518508 A lead frame for a semiconductor package consisting of: a base metal layer made of copper (Cu), Cu alloy or iron-nickel (Fe-Ni) alloy; an underlying plating layer formed on at least one surface of the base metal layer and made of Ni or Ni
02/11/2003US6518507 Readily attachable heat sink assembly
02/11/2003US6518502 Ceramic multilayer circuit boards mounted on a patterned metal support substrate
02/11/2003US6518501 Electronic part and method of assembling the same
02/11/2003US6518392 Encapped oligomeric polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid esters as precursors for dielectric compounds
02/11/2003US6518390 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
02/11/2003US6518332 Good flow and curing properties, reliability, do not pose hazard to human health or environment
02/11/2003US6518204 Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition
02/11/2003US6518198 Electroless deposition of doped noble metals and noble metal alloys
02/11/2003US6518191 Method for etching organic film, method for fabricating semiconductor device and pattern formation method
02/11/2003US6518181 Conductive material for integrated circuit fabrication
02/11/2003US6518177 Method of manufacturing a semiconductor device
02/11/2003US6518176 Method of selective formation of a barrier layer for a contact level via
02/11/2003US6518170 Multilayer dielectric
02/11/2003US6518169 Semiconductor device and method for fabricating the same
02/11/2003US6518165 Method for manufacturing a semiconductor device having a metal layer floating over a substrate
02/11/2003US6518163 Method for forming bumps, semiconductor device, and solder paste
02/11/2003US6518161 Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die
02/11/2003US6518158 Method of manufacturing a semiconductor device including a fuse
02/11/2003US6518140 Manufacturing methods for defect removable semiconductor devices
02/11/2003US6518099 Plated leadframes with cantilevered leads
02/11/2003US6518098 IC package with dual heat spreaders
02/11/2003US6518095 Process for producing semiconductor device
02/11/2003US6518094 Center bond flip-chip semiconductor device and method of making it
02/11/2003US6518093 Semiconductor device and method for manufacturing same
02/11/2003US6518092 Semiconductor device and method for manufacturing
02/11/2003US6518091 Method of making anisotropic conductive elements for use in microelectronic packaging
02/11/2003US6518090 Semiconductor device and manufacturing method thereof
02/11/2003US6518089 Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly
02/11/2003US6518088 Polymer stud grid array
02/11/2003US6517662 Placing an adhesive comprising a microporous film substrate and a curable adhesive, over flexible substrate, disposing a stiffener over adhesive and placing a compression plate over it, and curing curable adhesive
02/11/2003US6517362 Spiral contactor, semiconductor device inspecting apparatus and electronic part using same, and method of manufacturing the same
02/11/2003US6516994 Wire bonding apparatus for connecting semiconductor devices
02/11/2003US6516867 Heat sink manufacturing device and manufacturing method
02/11/2003US6516808 Hermetic feedthrough for an implantable device
02/11/2003US6516516 Semiconductor chip package having clip-type outlead and fabrication method of same
02/11/2003US6516515 Semiconductor integrated circuit
02/11/2003US6516513 Method of making a CTE compensated chip interposer
02/11/2003CA2288605C Compliant leads for area array surface mounted components
02/11/2003CA2164901C Organic chip carriers for wire bond-type chips
02/06/2003WO2003010824A1 Semiconductor device
02/06/2003WO2003010818A1 Integrated circuit
02/06/2003WO2003010816A1 Chip stack with differing chip package types
02/06/2003WO2003010815A2 Method of fabricating an alloy film on a face of a heat exchanger for an integrated circuit
02/06/2003WO2003010813A2 Grid interposer
02/06/2003WO2003010797A2 Test structures for electrical linewidth measurement and processes for their formation
02/06/2003WO2003010796A2 Structure and method for fabrication of a leadless chip carrier with embedded antenna
02/06/2003WO2003010646A1 Integrated circuit cooling apparatus
02/06/2003WO2003010580A1 Tooling fixture for packaged optical micro-mechanical devices
02/06/2003WO2003010480A2 Compact fluid to fluid heat exchanger
02/06/2003WO2003010478A1 Apparatus and method for controlling the temperature of an integrated circuit device
02/06/2003WO2003010366A1 Apparatus for plating treatment
02/06/2003WO2002096164A3 Method for shielding an electric circuit created on a printed circuit board and a corresponding combination of a printed circuit board and a shield
02/06/2003WO2002071480A3 Electronic package with improved cap design for reduced interfacial stresses
02/06/2003WO2002069380A3 Atomically thin highly resistive barrier layer in a copper via
02/06/2003WO2002054489A3 Temperature measurement system and method
02/06/2003WO2002054486A3 Self-passivating cu laser fuse
02/06/2003WO2002052642A3 Method for eliminating reaction between photoresist and organosilicate glass
02/06/2003WO2002051222A3 Parallel plane substrate
02/06/2003WO2002049107A9 Method for stacking semiconductor die within an implanted medical device
02/06/2003WO2002045142A9 Copper alloy interconnections for integrated circuits and methods of making same
02/06/2003WO2002044011A3 Offshor platform for hydrocarbon production and storage
02/06/2003US20030028853 Wiring layout method of integrated circuit
02/06/2003US20030027918 Contains a filler of spherical fused silica having a maximum particle size of not larger than 45 mu m and may contain metal impurities having a particle size of not larger than 53 mu m.
02/06/2003US20030027910 Thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at below 120 degrees C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste
02/06/2003US20030027899 Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device
02/06/2003US20030027703 Zero thermal expansion material and practical component parts making use of the same
02/06/2003US20030027437 Leadframe interposer
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