| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/13/2003 | US20030030982 Heat sink retention frame |
| 02/13/2003 | US20030030980 Electronics cooling subassembly |
| 02/13/2003 | US20030030968 Microelectronic assembly with stiffening member |
| 02/13/2003 | US20030030516 Connected construction of a high-frequency package and a wiring board |
| 02/13/2003 | US20030030497 Integrated VCO having an improved tuning range over process and temperature variations |
| 02/13/2003 | US20030030460 Integrated circuit phase partitioned power distribution for stress power reduction |
| 02/13/2003 | US20030030456 Method of measuring contact alignment in a semiconductor device including an integrated circuit |
| 02/13/2003 | US20030030155 Resin component for encapsulating semiconductor and semiconductor device using it |
| 02/13/2003 | US20030030154 Resin-sealed type semiconductor device |
| 02/13/2003 | US20030030153 Bond pad structure comprising multiple bond pads with metal overlap |
| 02/13/2003 | US20030030151 Semiconductor device and method for manufacturing the same |
| 02/13/2003 | US20030030148 Low resistivity titanium silicide on heavily doped semiconductor |
| 02/13/2003 | US20030030147 Low resistivity titanium silicide on heavily doped semiconductor |
| 02/13/2003 | US20030030146 Semiconductor integrated circuit device |
| 02/13/2003 | US20030030144 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same |
| 02/13/2003 | US20030030143 Electronic component with stacked electronic elements and method for fabricating an electronic component |
| 02/13/2003 | US20030030142 Semiconductor device and method of manufacturing the same |
| 02/13/2003 | US20030030141 Laminated radiation member, power semiconductor apparatus, and method for producing the same |
| 02/13/2003 | US20030030140 Semiconductor package and method for manufacturing the same |
| 02/13/2003 | US20030030139 Integral heatsink plastic ball grid array |
| 02/13/2003 | US20030030138 Semiconductor package and method for fabricating the same |
| 02/13/2003 | US20030030137 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 02/13/2003 | US20030030134 Semiconductor device |
| 02/13/2003 | US20030030133 Semiconductor package and method of fabricating same |
| 02/13/2003 | US20030030132 Semiconductor chip package and manufacturing method thereof |
| 02/13/2003 | US20030030131 Semiconductor package apparatus and method |
| 02/13/2003 | US20030030129 Semiconductor wafer |
| 02/13/2003 | US20030030124 Semiconductor device and process for the same |
| 02/13/2003 | US20030030122 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/13/2003 | US20030030116 Bipolar ESD protection structure |
| 02/13/2003 | US20030030107 Globally planarized backend compatible thin film resistor contact/interconnect process |
| 02/13/2003 | US20030030093 Capacitor forming methods and capacitor constructions |
| 02/13/2003 | US20030030088 Semiconductor device with copper wiring connected to storage capacitor |
| 02/13/2003 | US20030030084 Fabricating an embedded ferroelectric memory cell |
| 02/13/2003 | US20030030078 MOS transistor having aluminum nitrade gate structure and method of manufacturing same |
| 02/13/2003 | US20030030057 Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating |
| 02/13/2003 | US20030029839 Method of reducing wet etch rate of silicon nitride |
| 02/13/2003 | US20030029633 Interconnecting substrates for electrical coupling of microelectronic components |
| 02/13/2003 | US20030029602 Heat removal system |
| 02/13/2003 | US20030029601 Heat sink for convection cooling in horizontal applications |
| 02/13/2003 | US20030029540 Method for the manufacture of a smart label inlet web, and a smart label inlet web |
| 02/13/2003 | US20030029031 Electronic packaging device and method |
| 02/13/2003 | US20030029026 Integrated lead suspension with IC chip and method of manufacture |
| 02/13/2003 | DE20217122U1 Holder for retention of a heat sink of the frame of a processor module |
| 02/13/2003 | DE20215637U1 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform |
| 02/13/2003 | DE10132136C1 Halbleiterbauelement mit Ladungskompensationsstruktur sowie zugehöriges Herstellungsverfahren A semiconductor device having charge compensation structure and associated production method |
| 02/13/2003 | DE10130786C1 Laser-Programmierung integrierter Schaltkreise sowie zugehöriger integrierter Schaltkreis Laser-programming of integrated circuits and associated integrated circuit |
| 02/13/2003 | DE10127350C1 Halbleiterstruktur mit vergrabenen Leiterbahnen sowie Verfahren zur elektrischen Kontaktierung der vergrabenen Leiterbahnen Semiconductor structure with buried conductor tracks and to methods for making electrical contact with the buried conductor tracks |
| 02/13/2003 | CA2424557A1 Radiation sensitive dielectric constant changing composition and dielectric constant changing method |
| 02/12/2003 | EP1283589A2 Power converter module |
| 02/12/2003 | EP1283550A2 Cooling device for heat-generating elements |
| 02/12/2003 | EP1283548A1 Sealing resin for flip-flop mounting |
| 02/12/2003 | EP1283547A1 Packaging process for semiconductor package |
| 02/12/2003 | EP1283203A1 Crystalline form of 4-(5-methyl-3-phenylisoxazol-4-yl) benzene-sulfonamide |
| 02/12/2003 | EP1282922A1 Encapsulated microelectronic devices |
| 02/12/2003 | EP1282913A2 Wireless radio frequency testing method of integrated circuits and wafers |
| 02/12/2003 | EP1282660A1 Rheology-controlled epoxy-based compositions |
| 02/12/2003 | EP1019959B1 Interconnect structure with a low permittivity dielectric layer |
| 02/12/2003 | EP0909462B1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 02/12/2003 | CN2535925Y Fixing structure of radiating fin |
| 02/12/2003 | CN2535842Y 散热片 Heatsink |
| 02/12/2003 | CN1397154A Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 02/12/2003 | CN1397093A Flexible electronic device |
| 02/12/2003 | CN1396799A Printed circuit board with improved pad structure |
| 02/12/2003 | CN1396790A Power unit for driving magnetron and sink mounted on printed circuit board |
| 02/12/2003 | CN1396684A Method for welding unit on connection supporting seat without addition material |
| 02/12/2003 | CN1396662A Low voltage triggered SCR containing Si in insulating layer and protecting circuit for electrostatic discharge |
| 02/12/2003 | CN1396658A 半导体集成电路 The semiconductor integrated circuit |
| 02/12/2003 | CN1396657A Assembly semiconductor device with a bigger chip on an other chip |
| 02/12/2003 | CN1396655A Circuit board and its making method and high output module |
| 02/12/2003 | CN1396654A Circuit board and its making method and high-output module |
| 02/12/2003 | CN1396653A 半导体装置 Semiconductor device |
| 02/12/2003 | CN1396649A Method for making semiconductor device |
| 02/12/2003 | CN1396648A Immersion method of minute hole |
| 02/12/2003 | CN1396508A Cooling device containing fan and ventilation duct and electronic equipment containg cooling device |
| 02/12/2003 | CN1396507A Cooling device containing multiple radiating fins and fan for blowing and electronic equipment installed with the cooling device |
| 02/12/2003 | CN1396487A Pattern forming method and method for producing liquid crystal display using the method |
| 02/12/2003 | CN1101598C Substrate for semiconductor device, semiconductor device and method for maing it, circuit board and electronic device |
| 02/12/2003 | CN1101597C Lead-on-chip type semiconductor chip package and method for manufacturing the same |
| 02/12/2003 | CN1101594C Semiconductor unit package, method and encapsulant for the packaging thereof |
| 02/12/2003 | CN1101438C Die attach adhesive compositions |
| 02/11/2003 | USRE37982 Method for preventing electrostatic discharge failure in an integrated circuit package |
| 02/11/2003 | US6519543 A method of calibrating an analytical tool, comprising: preparing a calibration standard having a known concentration of obtaining a portion of the calibration standard with a polishing process, the portion being representative of the |
| 02/11/2003 | US6519161 Molded electronic package, method of preparation and method of shielding-II |
| 02/11/2003 | US6519155 Retainer device for heat sink assembly |
| 02/11/2003 | US6519154 Thermal bus design to cool a microelectronic die |
| 02/11/2003 | US6519153 Heat sink retention frame |
| 02/11/2003 | US6519151 Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
| 02/11/2003 | US6519150 Linkage-type fixing device for heat-radiator of central processor |
| 02/11/2003 | US6518885 Ultra-thin outline package for integrated circuit |
| 02/11/2003 | US6518835 Semiconductor integrated circuit device having an optimal circuit layout to ensure stabilization of internal source voltages without lowering circuit functions and/or operating performance |
| 02/11/2003 | US6518824 Antifuse programmable resistor |
| 02/11/2003 | US6518785 Method for monitoring an amount of heavy metal contamination in a wafer |
| 02/11/2003 | US6518679 Capacitive alignment structure and method for chip stacking |
| 02/11/2003 | US6518678 Apparatus and method for reducing interposer compression during molding process |
| 02/11/2003 | US6518677 Semiconductor flip-chip package and method for the fabrication thereof |
| 02/11/2003 | US6518676 Metal interconnections and active matrix substrate using the same |
| 02/11/2003 | US6518675 Wafer level package and method for manufacturing the same |
| 02/11/2003 | US6518672 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate |
| 02/11/2003 | US6518671 An etch-stop layer is selectively provided between layers of a multiple-layered circuit in a selective manner so as to allow for outgassing of impurities during subsequent fabrication processes. The etch-stop layer is formed over an underlying |