Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2003
02/20/2003US20030034566 Reduction of chip carrier flexing during thermal cycling
02/20/2003US20030034565 Flip chip substrate with metal columns
02/20/2003US20030034563 Method and apparatus for die stacking
02/20/2003US20030034561 Semiconductor device and fabricating method thereof
02/20/2003US20030034560 Wiring structure of semiconductor device, electrode, and method for forming them
02/20/2003US20030034559 Ball grid array package with electrically-conductive bridge
02/20/2003US20030034558 Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure
02/20/2003US20030034557 Chip carrier for a semiconductor chip module
02/20/2003US20030034556 Integrated semiconductor circuit, method of cooling a microwave circuit area and method of producing an integrated semiconductor circuit
02/20/2003US20030034555 Mold
02/20/2003US20030034554 Composite ceramic board, method of producing the same, optical/electronic-mounted circuit substrate using said board, and mounted board equipped with said circuit substrate
02/20/2003US20030034553 Low profile ball-grid array package for high power
02/20/2003US20030034552 Semiconductor device and a method of manufacturing the same
02/20/2003US20030034550 Semiconductor device and method of manufacturing the same
02/20/2003US20030034539 Semiconductor integrated circuit device
02/20/2003US20030034498 Light emitting module and the method of the producing the same
02/20/2003US20030034490 Technique for attaching die to leads
02/20/2003US20030034489 Apparatus and method for a production testline to monitor CMOS SRAMs
02/20/2003US20030034485 Semiconductor device
02/20/2003US20030034436 Semiconductor photo-detecting apparatus
02/20/2003US20030034173 Bump-attached wiring circuit board and method for manufacturing same
02/20/2003US20030034168 Bump layout on silicon chip
02/20/2003US20030034150 Radial folded fin heat sink
02/20/2003US20030034148 Telecommunication device including a housing having improved heat conductivity
02/20/2003US20030034120 Device transferring method, device arraying method, and image display fabrication method using the same
02/20/2003DE20219316U1 Cooling wall for a computer housing has an integrated cololing system for electronic chips that does not require air flow
02/20/2003DE20219315U1 Cooling system for air flow free acceleration insensitive electronic chip or processor
02/20/2003DE20218872U1 Construction of a heat sink for electronics cooling is formed of parallel metal plates in a holder
02/20/2003CA2456992A1 Electronics cooling subassembly
02/20/2003CA2456980A1 Heat removal system
02/20/2003CA2453338A1 Sheet for sealing electric wiring
02/20/2003CA2449052A1 Flame retardant molding compositions
02/19/2003EP1284592A2 Telecommunication device including a housing having improved heat conductivity
02/19/2003EP1284505A2 Semiconductor integrated circuit device
02/19/2003EP1284503A1 Semiconductor power module
02/19/2003EP1284502A1 Device having resin package and method of producing the same
02/19/2003EP1284501A1 Device having resin package and method of producing the same
02/19/2003EP1284500A2 Semiconductor device and method of manufacturing the same
02/19/2003EP1284499A2 Apparatus and method for a production testline to monitor cmos srams
02/19/2003EP1284250A1 A method for manufacturing a composite material
02/19/2003EP1284015A1 Semiconductor device having a low dielectric film and fabrication process thereof
02/19/2003EP1284012A1 Method for substrate noise distribution
02/19/2003EP0778249B1 Highly heat-conductive silicon nitride sinter and press-contacted body
02/19/2003CN2537125Y High-efficiency radiator
02/19/2003CN2537124Y 散热器 Heat sink
02/19/2003CN2537123Y Case radiator for microprocessor and chip
02/19/2003CN1398448A Contact structure and prodn. method thereof and probe contact assembly using same
02/19/2003CN1398431A Semiconductor device
02/19/2003CN1398407A 半导体集成电路器件 The semiconductor integrated circuit device
02/19/2003CN1398274A Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound
02/19/2003CN1398153A Mfg. method of circuit device
02/19/2003CN1398152A Method for mfg. printed circuit board
02/19/2003CN1398149A Printed circuit board with radiating element, its mfg. method and device contg. it
02/19/2003CN1398000A Packing of single chip IC
02/19/2003CN1397999A Radiating fin and plasma indicating panel
02/19/2003CN1397998A Fixer of radaitor
02/19/2003CN1397990A Mfg. method of semiconductor and treatment liquid
02/19/2003CN1397988A Semiconductor device and mfg. method thereof
02/19/2003CN1397944A Assembly of optical semiconductor parts and optical pick-up device
02/19/2003CN1397595A Low permittivity insulating film compsn., insulating film forming process and electronic parts
02/19/2003CN1102017C Mounted base board
02/18/2003US6522555 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
02/18/2003US6522545 Securing heat sinks
02/18/2003US6522544 Power module
02/18/2003US6522543 IC heat radiation structure and display device
02/18/2003US6522528 Electric power distributor for use in motor vehicle
02/18/2003US6522370 Liquid crystal display units
02/18/2003US6522173 Electronic device
02/18/2003US6522022 Mounting structure for semiconductor devices
02/18/2003US6522021 Semiconductor device
02/18/2003US6522020 Wafer-level package
02/18/2003US6522019 Ball grid array chip packages having improved testing and stacking characteristics
02/18/2003US6522018 Ball grid array chip packages having improved testing and stacking characteristics
02/18/2003US6522017 Wiring board and semiconductor device
02/18/2003US6522016 Interconnection structure with film to increase adhesion of the bump
02/18/2003US6522014 Fabrication of a metalized blind via
02/18/2003US6522013 Punch-through via with conformal barrier liner
02/18/2003US6522012 Semiconductor device with HIHG resistivity
02/18/2003US6522011 Low capacitance wiring layout and method for making same
02/18/2003US6522010 Semiconductor constructions comprising aluminum-containing layers
02/18/2003US6522007 Semiconductor device having dummy patterns for metal CMP
02/18/2003US6522006 Low dielectric constant material in integrated circuit
02/18/2003US6522005 Integrated circuit device comprising low dielectric constant material for reduced cross talk
02/18/2003US6522004 Semiconductor integrated circuit device
02/18/2003US6522003 Semiconductor device and method of manufacturing the same
02/18/2003US6522002 Semiconductor device and method of manufacturing the same
02/18/2003US6521997 Chip carrier for accommodating passive component
02/18/2003US6521996 Ball limiting metallurgy for input/outputs and methods of fabrication
02/18/2003US6521995 Wafer-level package
02/18/2003US6521994 Multi-chip module having content addressable memory
02/18/2003US6521993 Semiconductor memory module having double-sided stacked memory chip layout
02/18/2003US6521990 Ball grid array package comprising a heat sink
02/18/2003US6521989 Methods and apparatus for hermetically sealing electronic packages
02/18/2003US6521988 Device for packaging electronic components
02/18/2003US6521987 Plastic integrated circuit device package and method for making the package
02/18/2003US6521986 Slot apparatus for programmable multi-chip module
02/18/2003US6521984 Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrate
02/18/2003US6521982 Packaging high power integrated circuit devices
02/18/2003US6521981 Semiconductor device and manufacturing method thereof
02/18/2003US6521980 Controlling packaging encapsulant leakage
1 ... 1676 1677 1678 1679 1680 1681 1682 1683 1684 1685 1686 1687 1688 1689 1690 1691 1692 1693 1694 1695 1696 ... 2262