| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/25/2003 | US6525412 Semiconductor device having chip scale package |
| 02/25/2003 | US6525411 Plurality of wires connecting pads with lead bars |
| 02/25/2003 | US6525409 CCD mold package with improved heat radiation structure |
| 02/25/2003 | US6525407 Integrated circuit package |
| 02/25/2003 | US6525406 Half-etched die pad; plating layer of nickel, gold, copper, tin, or palladium or alloy |
| 02/25/2003 | US6525405 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 02/25/2003 | US6525404 Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method |
| 02/25/2003 | US6525402 Semiconductor wafer, method of manufacturing the same and semiconductor device |
| 02/25/2003 | US6525399 Junctionless antifuses and systems containing junctionless antifuses |
| 02/25/2003 | US6525398 Semiconductor device capable of preventing moisture-absorption of fuse area thereof |
| 02/25/2003 | US6525397 Extended drain MOSFET for programming an integrated fuse element to high resistance in low voltage process technology |
| 02/25/2003 | US6525385 Semiconductor device with inductance element |
| 02/25/2003 | US6525372 P-N rectifying junction; quad arrangement |
| 02/25/2003 | US6525359 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 02/25/2003 | US6525354 FET circuit block with reduced self-heating |
| 02/25/2003 | US6525318 Methods of inspecting integrated circuit substrates using electron beams |
| 02/25/2003 | US6525275 High densification of solder pads; reduced wiring layers; mounting of flip chips |
| 02/25/2003 | US6525160 Epoxy resin composition and process for producing silane-modified epoxy resin |
| 02/25/2003 | US6524989 Tetraorganophosponium dicyclic tetraorganoborate catalyst |
| 02/25/2003 | US6524972 Method for forming an interlayer insulating film, and semiconductor device |
| 02/25/2003 | US6524962 Method for forming dual-damascene interconnect structure |
| 02/25/2003 | US6524957 Method of forming in-situ electroplated oxide passivating film for corrosion inhibition |
| 02/25/2003 | US6524953 Asymmetric, double-sided self-aligned silicide and method of forming the same |
| 02/25/2003 | US6524942 Forming lower metal layer over predetermined area, forming dielectric layer over lower metal layer, etching partially the dielectric layer to form via openings, forming diffusion barrier, depositing metal overlays |
| 02/25/2003 | US6524941 Sub-minimum wiring structure |
| 02/25/2003 | US6524933 Methods of manufacturing semiconductor devices that protect interconnect wirings during processing of back substrate surface |
| 02/25/2003 | US6524905 Semiconductor device, and thin film capacitor |
| 02/25/2003 | US6524898 Method of fabricating a protective element in an SOI substrate |
| 02/25/2003 | US6524892 Method of fabricating multilayer flexible wiring boards |
| 02/25/2003 | US6524891 Method of pressure curing for reducing voids in a die attach bondline and applications thereof |
| 02/25/2003 | US6524889 Method of transcribing a wiring pattern from an original substrate to a substrate with closely matched thermal expansion coefficients between both substrates for dimensional control of the transcribed pattern |
| 02/25/2003 | US6524887 Embedded recess in polymer memory package and method of making same |
| 02/25/2003 | US6524886 Method of making leadless semiconductor package |
| 02/25/2003 | US6524885 Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
| 02/25/2003 | US6524881 Method and apparatus for marking a bare semiconductor die |
| 02/25/2003 | US6524873 Continuous movement scans of test structures on semiconductor integrated circuits |
| 02/25/2003 | US6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 02/25/2003 | US6524654 Method of controlling the spread of an adhesive on a circuitized organic substrate |
| 02/25/2003 | US6524524 Method for making a heat dissipating tube |
| 02/25/2003 | US6524517 Polymerization of hydrogel solution; solidification |
| 02/25/2003 | US6524429 Method of forming buried wiring, and apparatus for processing substratum |
| 02/25/2003 | US6524376 Anticorrosive agent |
| 02/25/2003 | US6524352 Printed circuit boards |
| 02/25/2003 | US6524346 High degree of precision; protective and alignment structures to a substrate |
| 02/25/2003 | US6523446 Punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive |
| 02/25/2003 | US6523362 Support for components used in microsystems technology |
| 02/25/2003 | US6523259 Method of manufacturing a heat pipe |
| 02/20/2003 | WO2003015488A1 Electronics cooling subassembly |
| 02/20/2003 | WO2003015485A1 Welded leadframe |
| 02/20/2003 | WO2003015232A1 Active power/ground esd trigger |
| 02/20/2003 | WO2003015169A1 Semiconductor device and ic card |
| 02/20/2003 | WO2003015168A1 Optically and electrically programmable silicided polysilicon fuse device |
| 02/20/2003 | WO2003015167A2 Semiconductor module |
| 02/20/2003 | WO2003015166A2 Sheet for sealing electric wiring |
| 02/20/2003 | WO2003015165A2 Electronic component with a plastic housing and method for production thereof |
| 02/20/2003 | WO2003015164A2 Damping of high frequency bond wire vibration |
| 02/20/2003 | WO2003015155A1 Method of manufacturing thin film sheet with bumps and thin film sheet with bumps |
| 02/20/2003 | WO2003015146A1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 02/20/2003 | WO2003015110A1 Planar inductive component and a planar transformer |
| 02/20/2003 | WO2003014633A2 Heat removal system |
| 02/20/2003 | WO2003014210A1 Flame retardant molding compositions |
| 02/20/2003 | WO2003013845A1 A high solids hbn slurry hbn paste spherical hbn powder, and methods of making and using them |
| 02/20/2003 | WO2003001590A3 System and method to form a composite film stack utilizing sequential deposition techniques |
| 02/20/2003 | WO2002069372A8 Self-coplanarity bumping shape for flip chip |
| 02/20/2003 | WO2002063686A3 High performance silicon contact for flip chip |
| 02/20/2003 | WO2002059967A3 Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations |
| 02/20/2003 | WO2002035897A9 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 02/20/2003 | WO2001073883A3 Low-temperature fabrication of thin-film energy-storage devices |
| 02/20/2003 | US20030037216 Memory module |
| 02/20/2003 | US20030036317 Method for applying a semiconductor chip to a substrate and an assembly obtained thereby |
| 02/20/2003 | US20030036303 Dual thermoelectric cooler optoelectronic package and manufacture process |
| 02/20/2003 | US20030036292 Process for producing a semiconductor device |
| 02/20/2003 | US20030036261 Semiconductor device and fabricating method thereof |
| 02/20/2003 | US20030036260 Method for manufacturing a semiconductor device |
| 02/20/2003 | US20030036257 Semiconductor device manufacturing method |
| 02/20/2003 | US20030036256 Integrated circuit with bonding layer over active circuitry |
| 02/20/2003 | US20030036254 Semiconductor processing methods, and semiconductor assemblies |
| 02/20/2003 | US20030036245 Wafer and production thereof |
| 02/20/2003 | US20030036229 Chip package and method for manufacturing the same |
| 02/20/2003 | US20030036221 Thin film transistor array panel for liquid crystal display and method for manufacturing the same |
| 02/20/2003 | US20030036220 Printed circuit board having plating conductive layer with bumps and its manufacturing method |
| 02/20/2003 | US20030036219 Semiconductor device manufacturing method |
| 02/20/2003 | US20030036218 Three-dimensional multichip module |
| 02/20/2003 | US20030036211 Laser repair operation |
| 02/20/2003 | US20030036020 Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element |
| 02/20/2003 | US20030035948 Reflow resistance; for use in tape automated bonding; electrical properties; mechanical properties |
| 02/20/2003 | US20030035937 Thick film paste systems for circuits on diamond substrates |
| 02/20/2003 | US20030035270 Semiconductor chip package with cooling arrangement |
| 02/20/2003 | US20030035269 Thermal bus design to cool a microelectronic die |
| 02/20/2003 | US20030035267 Heat sink for cooling an electronic component of a computer |
| 02/20/2003 | US20030035257 Bi-directional EOS/ESD protection device |
| 02/20/2003 | US20030034867 Coil and coil system for integration into a micro-electronic circuit and microelectronic circuit |
| 02/20/2003 | US20030034861 Microwave monolithic integrated circuit (MMIC) carrier interface |
| 02/20/2003 | US20030034844 Crosstalk suppression in differential AC coupled multichannel IC amplifiers |
| 02/20/2003 | US20030034821 Integrated circuit including active components and at least one passive component and associated fabrication method |
| 02/20/2003 | US20030034796 Flat group-delay low-pass filter, mounting structure thereof, flat group-delay low-pass filter device, and optical signal receiver |
| 02/20/2003 | US20030034571 Semiconductor memory device |
| 02/20/2003 | US20030034569 Electronic package and method of forming |
| 02/20/2003 | US20030034568 Semiconductor package with flash preventing mechanism and fabrication method thereof |
| 02/20/2003 | US20030034567 Semiconductor device |