Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2003
02/27/2003US20030038347 Stackable-type semiconductor package
02/27/2003US20030038346 Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip
02/27/2003US20030038345 IC package substrate with over voltage protection function
02/27/2003US20030038344 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
02/27/2003US20030038343 Semiconductor device and method for manufacturing the same
02/27/2003US20030038342 Wafer level underfill and interconnect process
02/27/2003US20030038341 Low stress thermal and electrical interconnects for heterojunction bipolar transistors
02/27/2003US20030038339 Semiconductor devices
02/27/2003US20030038338 Semiconductor device incorporating a fuse
02/27/2003US20030038331 Semiconductor device having a barrier layer
02/27/2003US20030038330 Semiconductor Device
02/27/2003US20030038317 Semiconductor device
02/27/2003US20030038306 A signal line capacitance value is only slightly increased by increasing an auxiliary capacitance value; X-ray image sensor
02/27/2003US20030038304 Semiconductor devices
02/27/2003US20030038303 Method of manufacturing semiconductor integrated circuit device having capacitor element
02/27/2003US20030038278 Comprises boron nitride powder as filler dispersed into silicone rubber matrix; dielectrics; semiconductors
02/27/2003US20030038162 Method for forming a flip chip on leadframe semiconductor package
02/27/2003US20030037962 Ceramic electronic component
02/27/2003US20030037959 Bismaleimide- triazine copolymer and epoxy resin laminate having a plurality of solder pads on the surface and the solder pads contain no more than 20 weight % tin and has a reflow temperature of not greater than about 270 degree C.
02/27/2003US20030037948 Semiconductor device
02/27/2003US20030037947 Chip scale package with a small surface mounting area
02/27/2003US20030037908 Cooling apparatus
02/27/2003US20030037906 Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly
02/27/2003US20030037866 Method of bonding a heat radiating sheet
02/27/2003US20030037730 Processing system, evacuating system for processing system, low-pressure CVD system, and evacuating system and trapping device for low-pressure CVD system
02/27/2003US20030037677 Desiccants and desiccant packages for highly moisture-sensitive electronic devices
02/27/2003US20030037434 Method of manufacturing a metal-ceramic circuit board
02/27/2003US20030037433 Base for heat sink
02/27/2003DE20217299U1 Mounting clip is of thin spring metal and is used to press heat sink against an electronic CPU chip
02/27/2003DE10204875C1 IC chip with manipulation protection for use in chip card, is provided by layer structure with given electrical characteristics checked to verify chip integrity
02/27/2003CA2453156A1 Making contact with semiconductor chips in chip cards
02/26/2003EP1286579A1 Multilayer printed wiring board
02/26/2003EP1286575A2 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/26/2003EP1286394A2 Thermally conductive sheet
02/26/2003EP1286393A2 Circuit housing
02/26/2003EP1286356A2 One-time programmable memory
02/26/2003EP1285939A1 Epoxy resin compositions and solid state devices encapsulated therewith
02/26/2003EP1285938A1 Epoxy resin encapsulation compositions
02/26/2003EP1285463A2 Fuse link
02/26/2003EP1285462A2 Semiconductor component comprising a surface metallization
02/26/2003EP1285213A1 Microstructured heat exchanger and method for producing the same
02/26/2003EP1285104A1 Electrolyte and method for depositing tin-silver alloy layers
02/26/2003EP1285099A2 High conductivity copper/refractory metal composites and method for making same
02/26/2003EP1066489B1 Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms
02/26/2003EP0998724B1 Method for producing a chip module
02/26/2003EP0862788B1 Method of producing a vertically integrated semiconductor component
02/26/2003CN2538120Y Pivot heat radaition member lock
02/26/2003CN2538069Y Low noise integrated heat pipe radiator
02/26/2003CN2538068Y Fixer for computer CPU radiator
02/26/2003CN2538067Y Crystal covered package base
02/26/2003CN2538006Y Radiator
02/26/2003CN1399796A Method and apparatus for personalization of semiconductor
02/26/2003CN1399795A Wire for semiconductor and manufacturing method thereof
02/26/2003CN1399509A Prepn process of soldering bead lattice array board
02/26/2003CN1399508A Method and fixture for preparing high-performace soldering bead lattic array board
02/26/2003CN1399386A 静电放电保护电路 Electrostatic discharge protection circuit
02/26/2003CN1399338A Semiconductor device of laminated chips
02/26/2003CN1399337A Operation process of semiconductor device
02/26/2003CN1399336A Protecting circuit for memory array
02/26/2003CN1399335A Semiconductor device and its manufacture
02/26/2003CN1399334A Joint cushion structure for later stage of copper/low dielectrical constant material making process
02/26/2003CN1399333A Heat sink with high-density radiating fin and its assembly process
02/26/2003CN1399329A 半导体器件 Semiconductor devices
02/26/2003CN1399328A 半导体器件 Semiconductor devices
02/26/2003CN1399327A 半导体器件 Semiconductor devices
02/26/2003CN1399325A Semiconductor device and its manufacture
02/26/2003CN1399323A High temperature reliability measuring device and method for integrated semiconductor module
02/26/2003CN1399161A Film transistor substrate for liquid crystal display board and its manufacture
02/26/2003CN1398918A Thermosetting resin composition
02/26/2003CN1102295C Integrated circuit having integral decoupling capacitor
02/26/2003CN1102294C Bottom lead frame and bottom lead semiconductor package using the same
02/25/2003US6526540 Flip chip trace library generator
02/25/2003US6526191 Cladding layer and core formed in high aspect ratio aperture
02/25/2003US6525943 Heat sink with alignment and retaining features
02/25/2003US6525942 Heat dissipation ball grid array package
02/25/2003US6525941 Heat dissipating device with a pressing member that is rotatable to urge a fan module toward a circuit board
02/25/2003US6525940 Integrated apparatus for thermal dissipation
02/25/2003US6525939 Heat sink apparatus
02/25/2003US6525934 Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller
02/25/2003US6525922 Insulator between metallic plating; integrated circuits
02/25/2003US6525921 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
02/25/2003US6525916 Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device
02/25/2003US6525609 Large gain range, high linearity, low noise MOS VGA
02/25/2003US6525553 Ground pin concept for singulated ball grid array
02/25/2003US6525548 Check pattern for a semiconductor device
02/25/2003US6525429 Methods of making microelectronic assemblies including compliant interfaces
02/25/2003US6525428 Graded low-k middle-etch stop layer for dual-inlaid patterning
02/25/2003US6525427 BEOL decoupling capacitor
02/25/2003US6525426 Subresolution features for a semiconductor device
02/25/2003US6525425 Formed by depositing pure copper into lower portion of aperture and depositing doped copper in upper portion; high density semiconductors
02/25/2003US6525424 Semiconductor device and its manufacturing method
02/25/2003US6525422 Semiconductor device including bump electrodes
02/25/2003US6525421 Molded integrated circuit package
02/25/2003US6525420 Semiconductor package with lid heat spreader
02/25/2003US6525419 Thermally coupling electrically decoupling cooling device for integrated circuits
02/25/2003US6525418 Semiconductor device
02/25/2003US6525417 Integrated circuits having reduced step height by using dummy conductive lines
02/25/2003US6525416 Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them
02/25/2003US6525415 Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor
02/25/2003US6525414 Semiconductor device including a wiring board and semiconductor elements mounted thereon
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