Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/04/2003US6528353 Chip stack-type semiconductor package and method for fabricating the same
03/04/2003US6528351 Integrated package and methods for making same
03/04/2003US6528350 Method for fabricating a metal plated spring structure
03/04/2003US6528349 Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability
03/04/2003US6528348 Semiconductor device having protruding electrodes higher than a sealed portion
03/04/2003US6528347 Manufacturing method for making a microwave semiconductor device with improved heat discharge and electric properties
03/04/2003US6528344 Chip scale surface-mountable packaging method for electronic and MEMS devices
03/04/2003US6528343 Semiconductor device its manufacturing method and electronic device
03/04/2003US6528330 Semiconductor device manufacturing method
03/04/2003US6528216 Phase shift mask and fabrication method thereof
03/04/2003US6528179 Reduction of chip carrier flexing during thermal cycling
03/04/2003US6528153 Low dielectric constant porous materials having improved mechanical strength
03/04/2003US6528145 Polymer and ceramic composite electronic substrates
03/04/2003US6527884 Hydrogen annealing process and apparatus therefor
03/04/2003US6527563 Grid interposer
03/04/2003US6527163 Methods of making bondable contacts and a tool for making such contacts
03/04/2003US6527045 Cooling apparatus boiling and condensing refrigerant
03/04/2003US6526768 Apparatus and method for controlling the temperature of an integrated circuit device
03/04/2003US6526655 Angled flying lead wire bonding process
03/04/2003US6526654 Method of producing double-sided circuit board
03/04/2003US6526653 Method of assembling a snap lid image sensor package
02/2003
02/28/2003CA2356791A1 Heat sink for power electronic devices
02/27/2003WO2003017742A1 Electrically isolated module
02/27/2003WO2003017479A2 Electronic device and method of testing and of manufacturing
02/27/2003WO2003017367A1 Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
02/27/2003WO2003017366A1 Method for forming a flip chip on leadframe semiconductor package
02/27/2003WO2003017365A2 Thermal transfer devices using heat pipes
02/27/2003WO2003017364A1 Electronic device and production method therefor
02/27/2003WO2003017361A1 Integrated circuit comprising dram memory cells and the production method therefor
02/27/2003WO2003017359A1 Semiconductor device and production method therefor, and plating solution
02/27/2003WO2003017350A2 Ic-chip with protective structure
02/27/2003WO2003017328A2 Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
02/27/2003WO2003017327A2 A method and apparatus for die stacking
02/27/2003WO2003017324A2 Structure and method for fabrication of a leadless chip carrier with embedded inductor
02/27/2003WO2003017323A2 Millimeter wave module (mmw) for microwave monolithic integrated circuit (mmic)
02/27/2003WO2003017290A1 Production method for conductive paste and production method for printed circuit board
02/27/2003WO2003017196A1 Bonding of semiconductor chips in chip cards
02/27/2003WO2003016811A2 Device using a medium having a high heat transfer rate
02/27/2003WO2003016394A1 Composition of bulk filler and epoxy-clay nanocomposite
02/27/2003WO2003016205A2 Mems and method of manufacturing mems
02/27/2003WO2002086971A3 Multichip module fabricated on a semiconductor or dielectric wafer and method for manufacturing same
02/27/2003WO2002082531A3 Structure and method for determining edges of regions in a semiconductor wafer
02/27/2003WO2002080228A3 Structure including cubic boron nitride films
02/27/2003WO2002078082A3 Electronic structure
02/27/2003WO2002056377A3 Electrical connection method, display module and chip card using said method
02/27/2003WO2002052644A3 Thermally enhanced microcircuit package and method of forming same
02/27/2003WO2002039241A3 Electrical component
02/27/2003US20030040229 Wire bonding surface
02/27/2003US20030040194 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
02/27/2003US20030040179 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography
02/27/2003US20030040176 Plurality of storage devices individually coupled with the plurality of tied and floating body devices; data processing; insulator on semiconductors
02/27/2003US20030040174 Method for preventing photoresist poisoning in semiconductor fabrication
02/27/2003US20030040166 Apparatus and method for stacking integrated circuits
02/27/2003US20030040161 Method of producing an integrated component with a metal-insulator-metal capacitor
02/27/2003US20030040155 Methods of electrically contacting to conductive plugs, methods of forming contact openings, and methods of forming dynamic random access memory circuitry
02/27/2003US20030040146 Mask for forming polysilicon and a method for fabricating thin film transistor using the same
02/27/2003US20030040145 Method for transferring and stacking of semiconductor devices
02/27/2003US20030040143 Method of fabricating a substrate-based semiconductor package without mold flash
02/27/2003US20030040142 Substrate-on-chip packaging process
02/27/2003US20030040140 Semiconductor memory device and method of manufacturing semiconductor device with chip on chip structure
02/27/2003US20030040131 Semiconductor chip, semiconductor integrated circuit device using the same, and method of selecting semiconductor chip
02/27/2003US20030039901 Precision fiducial
02/27/2003US20030039897 Semiconductor device manufacturing mask substrate and semiconductor device manufacturing method
02/27/2003US20030039825 Method of forming a phase change thermal interface
02/27/2003US20030039571 Enclosure for a semiconductor device
02/27/2003US20030039545 Small cooling fan
02/27/2003US20030039282 Integrated arrays of modulators and lasers on electronics
02/27/2003US20030039161 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system
02/27/2003US20030039106 Double-sided wiring board and its manufacture method
02/27/2003US20030039102 Semiconductor chip mounting substrate and semiconductor device using it
02/27/2003US20030039101 Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module component
02/27/2003US20030038903 Substrate having buried structure, display device including the substrate, method of making the substrate and method for fabricating the display device
02/27/2003US20030038647 Probe card for probing wafers with raised contact elements
02/27/2003US20030038383 Semiconductor substrate and process for its production
02/27/2003US20030038382 Molded plastic package with heat sink and enhanced electrical performance
02/27/2003US20030038381 Interposer utilizing a perimeter wall to underfill the area between a flip chip and the interposer
02/27/2003US20030038380 Apparatus for packing semiconductor die
02/27/2003US20030038379 Laminate film for mounting electronic devices and film carrier tape for mounting electronic devices
02/27/2003US20030038377 Flip chip semiconductor integrated circuit
02/27/2003US20030038376 Semiconductor die packages with standard ball grid array footprint and method for assembling the same
02/27/2003US20030038374 Multi-chip package (MCP) with spacer
02/27/2003US20030038372 Electronic component and production method thereof
02/27/2003US20030038371 Method of forming a metallic interconnect structure with a metallic spacer
02/27/2003US20030038369 Forming a tungsten nucleation layer by plasma vapor deposition, and covering with an intermediate layer titanium nitride; micro-miniaturization of semiconductor devices
02/27/2003US20030038368 Production apparatus of planer type semiconductor device and fabrication method of planer type semiconductor device
02/27/2003US20030038367 Semiconductor device and method for manufacturing the same
02/27/2003US20030038366 Three-dimensional semiconductor device having plural active semiconductor components
02/27/2003US20030038365 Substrate mapping
02/27/2003US20030038364 Internal hydrogen sources for heat conductive packaging of low dielectric constant semiconductor chips, and method of providing hydrogen therefor
02/27/2003US20030038362 Semiconductor device having semiconductor element housed in package with heat sink
02/27/2003US20030038361 Semiconductor apparatus and method for fabricating the same
02/27/2003US20030038360 Semiconductor device and a method of manufacturing the same
02/27/2003US20030038359 Forming a thin semiconductor device of high packaging density type, resin-encapsulated type, and smaller in size
02/27/2003US20030038358 Semiconductor package without outer leads
02/27/2003US20030038356 Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods
02/27/2003US20030038352 Electronic component with a semiconductor chip and fabrication method
02/27/2003US20030038351 Chip carrier, semiconductor package and fabricating method thereof
02/27/2003US20030038350 Semiconductor device
02/27/2003US20030038349 Glycogen phosphorylase inhibitor
02/27/2003US20030038348 Dual die package
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