Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/05/2003EP1289016A2 ESD protection for CMOS-output stage
03/05/2003EP1289013A1 A method for applying a semiconductor chip to a substrate and an assembly obtained thereby
03/05/2003EP1289012A1 Integrated circuit with microchannels for removing heat therefrom
03/05/2003EP1289011A2 Switching or control apparatus
03/05/2003EP1289010A1 Semiconductor device without use of chip carrier and method of making the same
03/05/2003EP1289009A2 Mechanical structuring of cover materials for use in electrical component assemblies
03/05/2003EP1289008A2 A semiconductor device and a manufacturing method thereof
03/05/2003EP1289004A2 Semiconductor device manufacturing method
03/05/2003EP1288717A2 Phase shift mask blank, phase shift mask, and method of manufacture
03/05/2003EP1288263A1 Polymer composition containing clean filler incorporated therein
03/05/2003EP1288251A2 Improved desiccants and desiccant packages for highly moisture-sensitive electronic devices
03/05/2003EP1287594A2 Laser system for processing target material
03/05/2003EP1287566A1 Thermoelectric element
03/05/2003EP1287560A1 Vertical electrical interconnections in a stack
03/05/2003EP1287558A1 Component assembly and method for producing the same
03/05/2003EP1287557A2 Semiconductor device with fuses and method of manufacturing same
03/05/2003EP1287553A1 Chip scale surface mounted device and process of manufacture
03/05/2003EP1287171A1 Hardened fe-ni alloy for making integrated circuit grids and method for making same
03/05/2003EP1287063A1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof
03/05/2003EP1286803A1 Method for producing a structural member from plates stacked on top of each other and soldered together
03/05/2003EP1038420B1 Method for making circuit elements for a z-axis interconnect
03/05/2003CN2539288Y Composite heat radiating structural member
03/05/2003CN2539221Y Fixer for radiating module
03/05/2003CN1401141A Vertical conduction flip chip device with bump contacts on single surface
03/05/2003CN1401138A Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
03/05/2003CN1401137A Electronic device and method of manufacturing the electronic device
03/05/2003CN1401136A Encapsulation for an electrical component and method for producing the same
03/05/2003CN1400993A Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
03/05/2003CN1400988A 热固性树脂组合物 A thermosetting resin composition
03/05/2003CN1400983A Polyalkylene polysulphides
03/05/2003CN1400861A Spring clip for heat sink
03/05/2003CN1400854A Electronic device and its design method and making process, circuit substrate and electronic equipment
03/05/2003CN1400697A Manufacture of electrical contact
03/05/2003CN1400696A Manufacture of electrical contact
03/05/2003CN1400693A Electrical contact
03/05/2003CN1400659A Semiconductor device and its manufacture
03/05/2003CN1400658A High-performance cooler
03/05/2003CN1400657A Pressure cast power device and its making process
03/05/2003CN1400609A Memory module
03/05/2003CN1400403A Fastener-holder assembly
03/04/2003US6530074 Apparatus for verification of IC mask sets
03/04/2003US6530068 Device modeling and characterization structure with multiplexed pads
03/04/2003US6530066 Method of computing wiring capacitance, method of computing signal propagation delay due to cross talk and computer-readable recording medium storing such computed data
03/04/2003US6529380 Structure of power module radiation
03/04/2003US6529379 Article exhibiting enhanced adhesion between a dielectric substrate and heat spreader and method
03/04/2003US6529378 Integrated circuit heat sink support and retention mechanism
03/04/2003US6529377 Integrated cooling system
03/04/2003US6529376 System processor heat dissipation
03/04/2003US6529375 Heat sink unit and electronic apparatus using the same
03/04/2003US6529063 Thermally stable cascode
03/04/2003US6529031 Integrated circuit configuration for testing transistors, and a semiconductor wafer having such a circuit configuration
03/04/2003US6528924 Electronic component, in particular a component operating with surface acoustic waves
03/04/2003US6528911 Rectifier assembly for automotive alternators
03/04/2003US6528894 Use of nitrides for flip-chip encapsulation
03/04/2003US6528893 Low-pin-count chip package and manufacturing method thereof
03/04/2003US6528892 Land grid array stiffener use with flexible chip carriers
03/04/2003US6528885 Anti-deciphering contacts
03/04/2003US6528884 Semiconductor technology; efficiency
03/04/2003US6528883 Shapes-based migration of aluminum designs to copper damascene
03/04/2003US6528882 Thermal enhanced ball grid array package
03/04/2003US6528881 Semiconductor device utilizing a side wall to prevent deterioration between electrode pad and barrier layer
03/04/2003US6528880 Semiconductor package for power JFET having copper plate for source and ribbon contact for gate
03/04/2003US6528879 Semiconductor device and semiconductor module
03/04/2003US6528878 Device for sealing and cooling multi-chip modules
03/04/2003US6528877 Semiconductor component having a chip carrier with openings for making contact
03/04/2003US6528876 Semiconductor package having heat sink attached to substrate
03/04/2003US6528875 Vacuum sealed package for semiconductor chip
03/04/2003US6528872 Packaging structure for ball grid array
03/04/2003US6528871 Structure and method for mounting semiconductor devices
03/04/2003US6528869 Semiconductor package with molded substrate and recessed input/output terminals
03/04/2003US6528868 Lead frame device and method for producing the same
03/04/2003US6528867 Integrated circuit devices including connection components mechanically and electrically attached to semiconductor dice
03/04/2003US6528866 High-frequency module
03/04/2003US6528865 Thin amorphous fluorocarbon films
03/04/2003US6528848 Semiconductor device and a method of manufacturing the same
03/04/2003US6528825 Semiconductor emission apparatus
03/04/2003US6528818 Test structures and methods for inspection of semiconductor integrated circuits
03/04/2003US6528769 Connection of a junction to an electrical conductor track on a plate
03/04/2003US6528735 Substrate design of a chip using a generic substrate design
03/04/2003US6528734 Semiconductor device and process for fabricating the same
03/04/2003US6528732 Circuit device board, semiconductor component, and method of making the same
03/04/2003US6528723 Biometric sensor and method for its production
03/04/2003US6528722 Ball grid array semiconductor package with exposed base layer
03/04/2003US6528595 Adhesive of thiirane and oxirane-containing compound and oxirane-containing compound
03/04/2003US6528552 Permanent protective coating of a printed wiring board; aluminum hydroxide, inorganic molybdenum compound, zinc stannate or zinc hydroxystannate in a resin
03/04/2003US6528432 H2-or H2/N2-plasma treatment to prevent organic ILD degradation
03/04/2003US6528428 Method of forming dual damascene structure
03/04/2003US6528423 Process for forming composite of barrier layers of dielectric material to inhibit migration of copper from copper metal interconnect of integrated circuit structure into adjacent layer of low k dielectric material
03/04/2003US6528419 Process of fabricating an integrated circuit
03/04/2003US6528417 Metal patterned structure for SiN surface adhesion enhancement
03/04/2003US6528416 Semiconductor device and method of making utilizing hemispherical grain silicon technology
03/04/2003US6528414 Methods for forming wiring line structures in semiconductor devices
03/04/2003US6528412 Depositing an adhesion skin layer and a conformal seed layer to fill an interconnect opening
03/04/2003US6528411 Semiconductor device and method of its fabrication
03/04/2003US6528410 Method for manufacturing semiconductor device
03/04/2003US6528408 Method for bumped die and wire bonded board-on-chip package
03/04/2003US6528407 Process for producing electrical-connections on a semiconductor package, and semiconductor package
03/04/2003US6528400 Method of manufacturing a semiconductor device
03/04/2003US6528393 Method of making a semiconductor package by dicing a wafer from the backside surface thereof
03/04/2003US6528392 Dicing configuration for separating a semiconductor component from a semiconductor wafer
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