Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/06/2003US20030045039 Method of fabricating a semiconductor device having reduced contact resistance
03/06/2003US20030045034 Method for manufacturing a programmable chalcogenide fuse within a semiconductor device
03/06/2003US20030045032 Leadframe, method of manufacturing the same, semiconductor device using the same, and method of manufacturing the device
03/06/2003US20030045030 Method of manufacturing a semiconductor device
03/06/2003US20030045029 Semiconductor device and method for manufacturing the same
03/06/2003US20030045028 Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
03/06/2003US20030045026 Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device
03/06/2003US20030045025 A plastic land-grid array package, a ball-grid array package, and a plastic leaded package or micromechanical components are fabricated
03/06/2003US20030045024 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
03/06/2003US20030045023 Method of fabricating package having metal runner
03/06/2003US20030045018 Semiconductor structure comprising substrate with antireflective coating comprising metal silicon nitride compound, metal being selected from scandium and cobalt, configured to minimize reflectivity of deep ultraviolet light
03/06/2003US20030045013 Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
03/06/2003US20030045010 Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
03/06/2003US20030044678 Polymer battery that also serves as a durable housing for portable electronic devices and microchips
03/06/2003US20030044614 Laminates prepared from impregnated flexible graphite sheets
03/06/2003US20030044057 Method of checking overlap accuracy of patterns on four stacked semiconductor layers
03/06/2003US20030043868 Compact laser package with integrated temperature control
03/06/2003US20030043565 Tape carrier package
03/06/2003US20030043558 Mounting structure of high-frequency wiring board
03/06/2003US20030043556 Wiring board and process for producing the same
03/06/2003US20030043546 Water-cooled system and method for cooling electronic components
03/06/2003US20030043544 Integrated cooling system
03/06/2003US20030043543 Multi-chip electronic package and cooling system
03/06/2003US20030043542 Multiple compressor refrigeration heat sink module for cooling electronic components
03/06/2003US20030043517 Electro-static discharge protecting circuit
03/06/2003US20030042993 High-frequency line transducer, component, module and communication apparatus
03/06/2003US20030042627 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials
03/06/2003US20030042626 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
03/06/2003US20030042624 Power semiconductor device
03/06/2003US20030042623 Semiconductor memory chip and semiconductor memory device using the same
03/06/2003US20030042622 Semiconductor device and wire bonding apparatus
03/06/2003US20030042621 Wire stitch bond on an integrated circuit bond pad and method of making the same
03/06/2003US20030042620 Pad- rerouting for integrated circuit chips
03/06/2003US20030042619 Configuration of conductive bumps and redistribution layer on a flip chip
03/06/2003US20030042618 Semiconductor device and a method of manufacturing the same
03/06/2003US20030042617 Microelectronic devices and methods of manufacture
03/06/2003US20030042614 Metal silicide adhesion layer for contact structures
03/06/2003US20030042613 Barrier dielectric covering copper wires
03/06/2003US20030042612 Method for producing cavities with submicrometer patterns in a semiconductor device using a freezing process liquid
03/06/2003US20030042611 Semiconductor device and method for manufacturing the same
03/06/2003US20030042610 Semiconductor device and a manufacturing method thereof
03/06/2003US20030042608 Silicon nitride adhesive
03/06/2003US20030042607 Diffusion barrier layer for semiconductor wafer fabrication
03/06/2003US20030042606 Semiconductor structure; filling contactor aperture; heating at high temperature; low pressure vapor deposition
03/06/2003US20030042605 Concentration graded carbon doped oxide
03/06/2003US20030042604 Power layout structure of main bridge chip substrate and motherboard
03/06/2003US20030042603 High frequency, low cost package for semiconductor devices
03/06/2003US20030042602 Multi-chip semiconductor device
03/06/2003US20030042601 Electronic module and communication module using the same
03/06/2003US20030042600 Method and apparatus for wafer level testing of semiconductor using sacrificial on die power and ground metalization
03/06/2003US20030042598 Hermetic seal
03/06/2003US20030042597 Semiconductor device
03/06/2003US20030042596 Semiconductor package
03/06/2003US20030042595 Spring bias electrical contactors; lamination sheet
03/06/2003US20030042594 Semiconductor package and method of manufacturing lead
03/06/2003US20030042593 Pad grid array leadless package and method of use
03/06/2003US20030042589 Stack chip module
03/06/2003US20030042588 TAB type semiconductor device
03/06/2003US20030042587 IC packaging and manufacturing methods
03/06/2003US20030042586 Substrate for carrying a semiconductor chip and semiconductor device using same
03/06/2003US20030042585 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
03/06/2003US20030042584 Semiconductor device and method of manufacturing the same
03/06/2003US20030042583 Quad flat non-leaded semiconductor package and method of fabricating the same
03/06/2003US20030042582 Semiconductor package
03/06/2003US20030042581 Packaged microelectronic devices and methods of forming same
03/06/2003US20030042580 Elimination of via-resistance-shift by increasing via size at a last level
03/06/2003US20030042579 Semiconductor structure and method for determining critical dimensions and overlay error
03/06/2003US20030042571 Chip-scale coils and isolators based thereon
03/06/2003US20030042566 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
03/06/2003US20030042564 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
03/06/2003US20030042553 Semiconductor memory device
03/06/2003US20030042523 Semiconductor integrated circuit device having link element
03/06/2003US20030042499 ESD protection for a CMOS output stage
03/06/2003US20030042497 Thermoelectric element
03/06/2003US20030042494 Opto-coupler based on integrated forward biased silicon diode LED
03/06/2003US20030042483 Method and apparatus for wafer level testing of semiconductor using sacrificial on die power and ground metalization
03/06/2003US20030042482 Thin film transistor array substrate having laser illumination indicator
03/06/2003US20030042469 Mixture of solvent and metal particles
03/06/2003US20030042431 Fuse and anti-fuse concept using a focused ion beam writing technique
03/06/2003US20030042247 Ceramic heater
03/06/2003US20030042224 Method for preparing ball grid array board
03/06/2003US20030042047 Solder bonding method, and electronic device and process for fabricating the same
03/06/2003US20030042043 Structure and method for shadow mask electrode
03/06/2003US20030042035 Overmolded circuit board with underfilled surface-mount component and method therefor
03/06/2003US20030042009 Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
03/06/2003US20030042006 Advanced microelectronic heat dissipation package and method for its manufacture
03/06/2003US20030042004 Interchangeable cartridges for cooling electronic components
03/06/2003US20030042003 Method and system for cooling electronic components
03/06/2003US20030041456 Method for the manufacture of cooling devices
03/06/2003US20030041451 Microelectronic joining processes
03/06/2003US20030041442 Method of applying phase change thermal interface materials
03/06/2003DE20219750U1 Mounting frame for electronic processor cooling heat sink elements
03/06/2003DE20217828U1 Contactless transponder for adhesive foil for goods and packaging has semiconductor chip and transponder antenna embedded in adhesive material
03/06/2003DE20212804U1 Heat sink for CPU chips are held in carrier secured to circuit board
03/06/2003DE20117526U1 Electromagnetic screening arrangement for use with a microprocessor
03/06/2003DE10147927C1 New poly-o-hydroxyamides, used for producing polybenzoxazoles e.g. dielectric of electronic device, has di(2-hydroxyphenyl)alkane-1,1'-diyl and diphenylalkane-1,1'-diyl groups in chain and unsaturated acyl end-cap groups
03/06/2003CA2456769A1 Interconnect module with reduced power distribution impedance
03/06/2003CA2456301A1 Dummy structures to reduce metal recess in electropolishing process
03/05/2003EP1289355A1 Method for producing ceramic substrate
03/05/2003EP1289025A1 Method to deposit an oxyde layer on a substrate and photovoltaic cell using such substrate
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