Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/11/2003US6531806 Chip-type piezoelectric component
03/11/2003US6531786 Durable reference marks for use in charged-particle-beam (CPB) microlithography, and CPB microlithography apparatus and methods comprising same
03/11/2003US6531785 Semiconductor device
03/11/2003US6531784 Semiconductor package with spacer strips
03/11/2003US6531780 Via formation in integrated circuit interconnects
03/11/2003US6531779 Multi-layer interconnection structure in semiconductor device and method for fabricating same
03/11/2003US6531778 Semiconductor device and method of production thereof
03/11/2003US6531777 Barrier metal integrity testing using a dual level line to line leakage testing pattern and partial CMP
03/11/2003US6531776 Semiconductor device having reduced interconnect-line parasitic capacitance
03/11/2003US6531775 High-frequency module
03/11/2003US6531773 Semiconductor device
03/11/2003US6531772 Electronic system including memory module with redundant memory capability
03/11/2003US6531771 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
03/11/2003US6531770 Electronic part unit attached to a circuit board and including a cover member covering the electronic part
03/11/2003US6531769 Semiconductor integrated circuit package, semiconductor apparatus provided with a plurality of semiconductor integrated circuit packages, method of inspecting semiconductor integrated circuit package and method of fabricating semiconductor integrated circuit
03/11/2003US6531768 Semiconductor integrated circuit device with optical wave guides
03/11/2003US6531767 Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture
03/11/2003US6531766 Improved moisture resistance and high reliability; solder resist, encapsulating resin
03/11/2003US6531765 Interdigitated capacitor design for integrated circuit lead frames and method
03/11/2003US6531763 Semiconductor component packaging; attaching a semiconductor component to a circuit board
03/11/2003US6531762 Semiconductor package
03/11/2003US6531761 High density direct connect LOC assembly
03/11/2003US6531760 Semiconductor device
03/11/2003US6531759 Alpha particle shield for integrated circuit
03/11/2003US6531757 Defect detected is cut by a laser beam
03/11/2003US6531756 Laser fuse and antifuse structures formed over the active circuitry of an integrated circuit
03/11/2003US6531755 Semiconductor device and manufacturing method thereof for realizing high packaging density
03/11/2003US6531740 Integrated impedance matching and stability network
03/11/2003US6531737 Semiconductor device having an improved interlayer contact and manufacturing method thereof
03/11/2003US6531714 Silicon oxycarbide
03/11/2003US6531709 Semiconductor wafer and fabrication method of a semiconductor chip
03/11/2003US6531664 Controlling height of solder connections, and preventing shorting between adjacent connections
03/11/2003US6531412 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications
03/11/2003US6531407 Method, structure and process flow to reduce line-line capacitance with low-K material
03/11/2003US6531402 Method for etching organic film, method for fabricating semiconductor device and pattern formation method
03/11/2003US6531398 Method of depositing organosillicate layers
03/11/2003US6531395 Method for fabricating bitlines
03/11/2003US6531384 Method of forming a bond pad and structure thereof
03/11/2003US6531374 Overlay shift correction for the deposition of epitaxial silicon layer and post-epitaxial silicon layers in a semiconductor device
03/11/2003US6531357 Method of manufacturing a semiconductor device
03/11/2003US6531345 Method and apparatus for fabricating electronic device
03/11/2003US6531344 High frequency gallium arsenide MMIC die coating method
03/11/2003US6531343 Method of encapsulating a circuit assembly
03/11/2003US6531342 Method for transverse hybrid loc package
03/11/2003US6531341 Method of fabricating a microelectronic device package with an integral window
03/11/2003US6531338 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/11/2003US6531337 Method of manufacturing a semiconductor structure having stacked semiconductor devices
03/11/2003US6531335 Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
03/11/2003US6531334 Method for fabricating hollow package with a solid-state image device
03/11/2003US6531326 Method to calibrate the wafer transfer for oxide etcher (with clamp)
03/11/2003US6531232 System for assembling substrates to bonding zones provided with cavities
03/11/2003US6531226 Brazeable metallizations for diamond components
03/11/2003US6531022 Mounting method of semiconductor element
03/11/2003US6530972 Highly chrystallized; via pyrolysis of metal compound dispersed in inert gas; reducing atmosphere; conductor paste for thick film carmaic electronics
03/11/2003US6530419 Cooling system for electronic packages
03/11/2003US6530113 Apparatus for selective removal of material from wafer alignment marks
03/10/2003CA2402055A1 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
03/06/2003WO2003019999A1 Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards
03/06/2003WO2003019670A1 Method for making a colour image sensor with support substrate welded connection-on-connection
03/06/2003WO2003019657A2 Integrated circuit device with bump bridges and method for making the same
03/06/2003WO2003019656A2 Interconnect module with reduced power distribution impedance
03/06/2003WO2003019655A1 Radiation plate and power semiconductor module, ic package
03/06/2003WO2003019654A1 Stacked chip assembly with stiffening layer
03/06/2003WO2003019653A2 Method for producing contacts and printed circuit packages
03/06/2003WO2003019652A2 Method for fixing an electrical element and a module with an electrical element fixed thus
03/06/2003WO2003019651A2 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
03/06/2003WO2003019650A1 Semiconductor device and production method therefor
03/06/2003WO2003019649A2 Strip conductor arrangement and method for producing a strip conductor arrangement
03/06/2003WO2003019641A1 Dummy structures to reduce metal recess in electropolishing process
03/06/2003WO2003019628A1 Wafer level underfill and interconnect process
03/06/2003WO2003019620A2 Technique to minimize crosstalk in electronic packages
03/06/2003WO2003019619A2 A low-k pre-metal dielectric semiconductor structure
03/06/2003WO2003019591A2 Housing for electrical components, in particular for capacitors
03/06/2003WO2003019456A1 Predicting chip yields through critical area matching
03/06/2003WO2003018881A1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition
03/06/2003WO2003001588A3 Method for producing an electronic component, especially a memory chip
03/06/2003WO2002099871A3 Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-moulding mould
03/06/2003WO2002080258A9 Integrated circuit structure
03/06/2003WO2002071483A3 Conductor track arrangement and method for producing a conductor track arrangement
03/06/2003WO2002061805A3 High power radiation emitter device and heat dissipating package for electronic components
03/06/2003WO2002052643A3 Semiconductor wafer manufacturing process
03/06/2003WO2002029892A3 High-density metal capacitor using dual-damascene copper interconnect
03/06/2003WO2002023625A3 Semiconductor device and fabrication method therefor
03/06/2003WO2002021596A3 Semiconductor chip with a protective covering and associated production method
03/06/2003US20030046647 Wiring designing method
03/06/2003US20030045121 Fabrication method and wafer structure of semiconductor device using low-k film
03/06/2003US20030045096 Semiconductor device manufacturing method
03/06/2003US20030045093 Method for metal fill by treatment of mobility layers
03/06/2003US20030045091 Method of forming a contact for a semiconductor device
03/06/2003US20030045090 Method of manufacturing semiconductor device
03/06/2003US20030045088 Method for manufacturing semiconductor integrated circuit device
03/06/2003US20030045087 Method of manufacturing semiconductor device
03/06/2003US20030045086 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
03/06/2003US20030045085 Thin-film circuit substrate and manufacturing method thereof, and a via formed substrate and manufacturing method thereof
03/06/2003US20030045084 Method of production of semiconductor module
03/06/2003US20030045083 Low cost microelectronic circuit package
03/06/2003US20030045072 Methods of thinning microelectronic workpieces
03/06/2003US20030045059 Method for fabricating a silicide layer of flat cell memory
03/06/2003US20030045047 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
03/06/2003US20030045044 Package with integrated inductor and/or capacitor
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