| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/2014 | WO2014002154A1 Semiconductor device and method for manufacturing same |
| 01/03/2014 | WO2014001290A1 Receiving structure for electrically connecting a nano-object on a surface thereof and re- establish electrical contact with the nano-object on the opposite surface, and methods for manufacturing the structure |
| 01/03/2014 | WO2014000394A1 Esd protecting system and x ray flat plate detector |
| 01/02/2014 | US20140005318 Epoxy resin composition, method for producing same, and semiconductor device using same |
| 01/02/2014 | US20140004663 Lead carrier with print-formed package components |
| 01/02/2014 | US20140004661 Method of manufacturing semiconductor device |
| 01/02/2014 | US20140004657 Method for producing chip stacks |
| 01/02/2014 | US20140003013 Power module package and method for manufacturing the same |
| 01/02/2014 | US20140003002 Semiconductor Device |
| 01/02/2014 | US20140002935 Sgs or gsgsg pattern for signal transmitting channel, and pcb assembly, chip package using such sgs or gsgsg pattern |
| 01/02/2014 | US20140002822 Overlay mark and method of measuring the same |
| 01/02/2014 | US20140002181 Low-power, high-voltage integrated circuits |
| 01/02/2014 | US20140002135 Semiconductor device capable of switching operation modes and operation mode setting method therefor |
| 01/02/2014 | US20140002120 Semiconductor integrated circuit and method for measuring internal voltage thereof |
| 01/02/2014 | US20140001657 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/02/2014 | US20140001656 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/02/2014 | US20140001655 Power transistor with heat dissipation and method therefor |
| 01/02/2014 | US20140001654 Adhesive film, method of manufacturing semiconductor device, and semiconductor device |
| 01/02/2014 | US20140001652 Package-on-package structure having polymer-based material for warpage control |
| 01/02/2014 | US20140001651 Package substrates with multiple dice |
| 01/02/2014 | US20140001650 Electronic device including interconnects with a cavity therebetween and a process of forming the same |
| 01/02/2014 | US20140001649 Semiconductor package and package on package having the same |
| 01/02/2014 | US20140001648 Wiring substrate and semiconductor device |
| 01/02/2014 | US20140001647 Flip-chip electronic device and production method thereof |
| 01/02/2014 | US20140001646 Solid hole array and manufacture method thereof |
| 01/02/2014 | US20140001645 3DIC Stacking Device and Method of Manufacture |
| 01/02/2014 | US20140001644 Package Structures and Methods for Forming the Same |
| 01/02/2014 | US20140001643 Hybrid package transmission line circuits |
| 01/02/2014 | US20140001642 Interposers including fluidic microchannels and related structures and methods |
| 01/02/2014 | US20140001641 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices |
| 01/02/2014 | US20140001639 Semiconductor device having silicon interposer on which semiconductor chip is mounted |
| 01/02/2014 | US20140001638 Semiconductor Devices and Methods of Manufacture Thereof |
| 01/02/2014 | US20140001637 Wiring board |
| 01/02/2014 | US20140001636 Electronic component and method of manufacturing electronic component |
| 01/02/2014 | US20140001635 Package with Passive Devices and Method of Forming the Same |
| 01/02/2014 | US20140001634 Chip package and methods for manufacturing a chip package |
| 01/02/2014 | US20140001633 Copper interconnect structure and method for fabricating thereof |
| 01/02/2014 | US20140001632 Semiconductor package structure having an air gap and method for forming |
| 01/02/2014 | US20140001631 Integrated wluf and sod process |
| 01/02/2014 | US20140001630 Pressure unit |
| 01/02/2014 | US20140001629 Packaged semiconductor die and cte-engineering die pair |
| 01/02/2014 | US20140001628 Air cavity packages having high thermal conductivity base plates and methods of making |
| 01/02/2014 | US20140001627 Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation |
| 01/02/2014 | US20140001626 Semiconductor apparatus and fabrication method of the same |
| 01/02/2014 | US20140001625 Semiconductor devices and methods of manufacturing the same |
| 01/02/2014 | US20140001624 Air cavity packages having high thermal conductivity base plates and methods of making |
| 01/02/2014 | US20140001623 Microelectronic structure having a microelectronic device disposed between an interposer and a substrate |
| 01/02/2014 | US20140001622 Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages |
| 01/02/2014 | US20140001621 Semiconductor packages having increased input/output capacity and related methods |
| 01/02/2014 | US20140001620 Method for manufacturing semiconductor device, and semiconductor device |
| 01/02/2014 | US20140001619 Power module package and method for manufacturing the same |
| 01/02/2014 | US20140001618 Solder flow impeding feature on a lead frame |
| 01/02/2014 | US20140001617 Method of using bonding ball array as height keeper and paste holder in semiconductor device package |
| 01/02/2014 | US20140001616 Semiconductor device package and method of manufacture |
| 01/02/2014 | US20140001615 Package-In-Packages and Methods of Formation Thereof |
| 01/02/2014 | US20140001614 Thermally Enhanced Semiconductor Package |
| 01/02/2014 | US20140001613 Semiconductor package |
| 01/02/2014 | US20140001612 Multiple Die Packaging Interposer Structure and Method |
| 01/02/2014 | US20140001611 Semiconductor package |
| 01/02/2014 | US20140001610 Wireless module |
| 01/02/2014 | US20140001609 Interposer and semiconductor package with noise suppression features |
| 01/02/2014 | US20140001604 Semiconductor structures including fluidic microchannels for cooling and related methods |
| 01/02/2014 | US20140001582 Film-assist molded gel-fill cavity package with overflow reservoir |
| 01/02/2014 | US20140001527 Semiconductor device having buried bit lines and method for fabricating the same |
| 01/02/2014 | US20140001491 Electrostatic Discharge Protection Element and Electrostatic Discharge Protection Chip and Method of Producing the Same |
| 01/02/2014 | US20140001482 Semiconductor device and method of manufacturing semiconductor device |
| 01/02/2014 | US20140001481 Semiconductor device |
| 01/02/2014 | US20140001480 Lead Frame Packages and Methods of Formation Thereof |
| 01/02/2014 | US20140001476 Semiconductor device and manufacturing method thereof |
| 01/02/2014 | US20140001471 Conformal shielding module |
| 01/02/2014 | US20140000955 Conformal Coating Capable of Scavenging a Corrosive Agent |
| 01/02/2014 | DE102013207552A1 Halbleitermodul Semiconductor module |
| 01/02/2014 | DE102013200944A1 Verfahren zum Herstellen einer Halbleitervorrichtung und Halbleitervorrichtung A method of manufacturing a semiconductor device and semiconductor device |
| 01/02/2014 | DE102013106932A1 Leadframe-Gehäuse und Verfahren zu ihrer Herstellung Leadframe housing and processes for their preparation |
| 01/02/2014 | DE102013106668A1 Diodenkette Diode chain |
| 01/02/2014 | DE102013106667A1 Halbleiterbauelemente und Halbleiterstrukturen Semiconductor devices and semiconductor structures |
| 01/02/2014 | DE102013106577A1 Package-in-Packages und Verfahren zu ihrer Herstellung Package in packages and methods for their preparation |
| 01/02/2014 | DE102013106438A1 Chipgehäuse, Chipanordnungen, eine Leiterplatte und Verfahren zur Herstellung von Chipgehäusen Chip package, chip assemblies, a printed circuit board and process for the production of chip packages |
| 01/02/2014 | DE102012211446A1 Semiconductor module, has bonding wire bonded at load terminal and connected with upper contact piece, and explosion protection unit arranged between load terminals and upper contact piece and embedded in bonding wire at specific length |
| 01/02/2014 | DE102012211335A1 Klebeband für die Kapselung einer organischen elektronischen Anordnung Tape for the encapsulation of an organic electronic device |
| 01/02/2014 | DE102012211220A1 Elektrisches Bauteil und Verfahren zum Herstellen von elektrischen Bauteilen Electrical component and method for manufacturing of electrical components |
| 01/02/2014 | DE102012107502A1 Verfahren und Waferlevelpackage für heterogene Integrationstechnologie Process and wafer level package for heterogeneous integration technology |
| 01/02/2014 | DE102011002170B4 Verfahren zur Herstellung eines Elektronikbauelement-Packages, Elektronikbauelement-Package und Verriegelungssystem A process for producing an electronic component package, the electronic component package and locking system |
| 01/02/2014 | DE102010055557B4 Halbleitergehäuse Semiconductor package |
| 01/02/2014 | DE102007050433B4 Halbleitermodul, Verfahren zum Herstellen eines Halbleitermoduls und Board mit einem Halbleitermodul A semiconductor module, method for manufacturing a semiconductor module and board with a semiconductor module |
| 01/02/2014 | DE102006046790B4 Integriertes Bauelement und Verfahren zum Trennen einer elektrisch leitfähigen Verbindung An integrated device and method for separating an electrically conductive connection |
| 01/02/2014 | DE102006012429B4 Halbleitervorrichtung Semiconductor device |
| 01/02/2014 | DE102004044547B4 Kühlkörper und Verfahren zur Herstellung desselben Of the same heat sink and method for the production |
| 01/01/2014 | EP2680308A2 Metal-oxide-metal capacitor |
| 01/01/2014 | EP2680307A2 Semiconductor device package and method of manufacture |
| 01/01/2014 | EP2680306A1 Power transistor with heat dissipation and method therefore |
| 01/01/2014 | EP2680305A2 Semiconductor package |
| 01/01/2014 | EP2680304A2 Film-assist molded gel-fill cavity package with overflow reservoir |
| 01/01/2014 | EP2680303A1 Electric circuit suitable for direct connection to high voltage |
| 01/01/2014 | EP2679651A1 Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component |
| 01/01/2014 | CN203378198U Heat dissipation sheet |
| 01/01/2014 | CN203377214U Integrated circuit |
| 01/01/2014 | CN203377213U Novel CPU (central processing unit) radiating fin |
| 01/01/2014 | CN203377212U Radiating fin assembly applied to CPU (central processing unit) |
| 01/01/2014 | CN203377211U Convenient-to-install heat dissipation fin |