Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/13/2003US20030048609 Stack of multilayer modules with heat-focussing metal layer
03/13/2003US20030048608 Radial folded fin heat sinks and methods of making and using same
03/13/2003US20030048518 Electro-optical component including a fluorinated poly(phenylene ether ketone) protective coating and related methods
03/13/2003US20030048378 Imaging device module package
03/13/2003US20030048013 Cooler for electronic devices
03/13/2003US20030047849 Method of modifying the temperature stability of a low temperature cofired ceramics (LTCC)
03/13/2003US20030047815 Resin mold semiconductor device
03/13/2003US20030047814 Method for manufacturing flip chip package devices with a heat spreader
03/13/2003US20030047812 Thin film aluminum alloy and sputtering target to form the same
03/13/2003US20030047811 Diffusion barrier layer for semiconductor device and fabrication method thereof
03/13/2003US20030047810 Electronic device having multilayer interconnection structure
03/13/2003US20030047809 Embedding resin and wiring substrate using the same
03/13/2003US20030047807 Electronic package having a thermal stretching layer
03/13/2003US20030047806 Component provided with a description
03/13/2003US20030047805 Substrate mapping
03/13/2003US20030047804 Semiconductor device
03/13/2003US20030047803 Bonding silicon die to a substrate; operably disposing a spacer on substrate about silicon die; placing a first thermal conductor on silicon die wherein the first thermal conductor and silicon die are in direct surface contact
03/13/2003US20030047802 Ceramic substrate for a semiconductor production/inspection device
03/13/2003US20030047801 Semiconductor device and manufacturing method of the same
03/13/2003US20030047800 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/13/2003US20030047799 Wafer level interconnection
03/13/2003US20030047798 Integrated circuits
03/13/2003US20030047797 Bow control in an electronic package
03/13/2003US20030047796 Narrow channel field effect transistor and method of making the same
03/13/2003US20030047794 Semiconductor device capable of suppressing current concentration in pad and its manufacture method
03/13/2003US20030047761 Micro array chip
03/13/2003US20030047759 Integrated circuit, portable device and method for manufacturing an integrated circuit
03/13/2003US20030047758 Semiconductor device having a condenser chip for reducing a noise
03/13/2003US20030047754 Multi-chip semiconductor package
03/13/2003US20030047731 Semiconductor device and test device for same
03/13/2003US20030047685 Microelectronic system with integral cryocooler, and its fabrication and use
03/13/2003US20030047356 Electronic assembly and a method of constructing an electronic assembly
03/13/2003US20030047353 Multilayer modules with flexible substrates
03/13/2003US20030047352 Substrate design of a chip using a generic substrate design
03/13/2003US20030047351 Thermal stable low elastic modulus material and device using the same
03/13/2003US20030047349 Integrated circuit package and printed circuit board arrangement
03/13/2003US20030047348 Grid array mounting arrangements
03/13/2003US20030047344 I-channel surface-mount connector with extended flanges
03/13/2003US20030047339 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same
03/13/2003US20030047304 Power feed and heat dissipating device for power semiconductor devices
03/13/2003US20030046967 Manufacturing process for a radial fin heat sink
03/13/2003US20030046810 Substrate mapping
03/13/2003US20030046809 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
03/13/2003DE20300301U1 Fan-less cooling device for extracting heat from electronic components by means of liquid cooler, uses stacked or integrated cooling laminations or fins
03/13/2003DE20300300U1 Fan-less chip- and/or processor- high capacity cooling-system for computer and controls, uses single-part and multi-part heat receiving/take-up plates
03/13/2003DE20300103U1 Heat-sink fixture arrangement e.g. for CPU-base, has torsion springs fixed on bent ends of springy wire rod
03/12/2003EP1291987A2 Compact laser package with integrated temperature control
03/12/2003EP1291918A2 Integrated radio frequency circuits
03/12/2003EP1291917A2 Electric circuit element, especially power module and associated process of manufacturing
03/12/2003EP1291916A2 Electric module
03/12/2003EP1291915A2 Bonding pad for optical semiconductor device and fabrication method thereof
03/12/2003EP1291914A1 Pressure-contactable power semiconductor module
03/12/2003EP1291913A2 Morphing fillers and thermal interface materials
03/12/2003EP1291912A2 Overmolded circuit board with underfilled surface-mount component and method therefor
03/12/2003EP1291911A1 Method having resin package and method of producing the same
03/12/2003EP1291909A2 Semiconductor device and method of making the same
03/12/2003EP1291908A2 Method of fabrication of heat sinks
03/12/2003EP1291906A1 Semiconductor device and fabrication method therefor
03/12/2003EP1291793A2 Method for designing wiring connecting section and semiconductor device
03/12/2003EP1291792A2 Wiring designing method
03/12/2003EP1291722A2 Method of recording identifier and set of photomasks
03/12/2003EP1291375A1 Functional groups for thermal crosslinking of polymeric systems
03/12/2003EP1290928A1 Heatsink and heatsink device using the heatsink
03/12/2003EP1290731A2 Semiconductor arrangement
03/12/2003EP1290730A1 Method for producing input/output permutation of several conductive strips with parallel branches of an integrated circuit and resulting circuit
03/12/2003EP1290724A1 Method and device for bleed out control in solder bonding
03/12/2003EP1289728A2 Encapsulation using microcellular foamed materials
03/12/2003EP1131784B1 Self-adhesive electronic circuit
03/12/2003EP1027739B1 Housing for piezoelectric transformer device
03/12/2003EP0858578B1 Liquid cooled heat sink for cooling electronic components
03/12/2003CN1402750A Poly (phenylene ether)-polyvinyl thermosetting resin
03/12/2003CN1402606A Printed circuit board with protruding end on electroplated conductive layer and mfg. method thereof
03/12/2003CN1402604A Wiring layer of silver or silver alloy, mfg. method thereof and display screen substrate therewith
03/12/2003CN1402354A 半导体存储装置 The semiconductor memory device
03/12/2003CN1402349A Semiconductor device and mfg. method thereof
03/12/2003CN1402348A Semiconductor device and mfg. method thereof
03/12/2003CN1402347A Semiconductor chip, semiconductor IC and method for selecting semiconductor chip
03/12/2003CN1402346A 静电放电保护装置 ESD protection device
03/12/2003CN1402345A Electromagnetic interference inverter circuit embedded in integrated circuit
03/12/2003CN1402344A Semiconductor device with multiple wiring layers and mfg. method thereof
03/12/2003CN1402343A Gate electrode device body of electric power electronic power device
03/12/2003CN1402342A Composite material and its use
03/12/2003CN1402340A Semiconductor packaging element with heat sink structure
03/12/2003CN1402333A Semiconductor apparatus and mfg. method thereof
03/12/2003CN1402321A Semiconductor device and mfg. method thereof, circuit substrate and electronic apparatus
03/12/2003CN1402319A IC chip installing structure and display apparatus
03/12/2003CN1402304A laser repair process
03/12/2003CN1402066A Substrate with embedded structure, display device comprising same, method for mfg. said substrate and method for mfg. display device
03/12/2003CN1401727A Sealing resin, resin sealed semiconductor and packaging assembly system thereof
03/12/2003CN1401720A Binding thin film for semiconductor, lead wire frame using same and semiconductor device
03/12/2003CN1103179C Microelectronic connecting element and module contg. same
03/12/2003CN1103118C Method for fabricating self assembling microstructures
03/11/2003US6532568 Apparatus and method for conditioning polysilicon circuit elements
03/11/2003US6532439 Method for determining the desired decoupling components for power distribution systems
03/11/2003US6532423 Method for determining fluid flow characteristic curves of heat-dissipating system
03/11/2003US6532162 Reference plane of integrated circuit packages
03/11/2003US6532153 Heat sink mounting structure
03/11/2003US6532141 Heat-dissipating device for electronic component
03/11/2003US6531928 High-frequency module
03/11/2003US6531911 Low-power band-gap reference and temperature sensor circuit
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