Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/20/2003US20030051867 High heat flux heat sink and method of creating same
03/20/2003US20030051860 Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component
03/20/2003US20030051859 Modular capillary pumped loop cooling system
03/20/2003US20030051662 Thermal reactor for transport polymerization of low epsilon thin film
03/20/2003DE10159020C1 Power semiconductor circuit device incorporating function monitoring circuit within power semiconductor control circuit
03/20/2003DE10123686C1 Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines Speicherchips und dadurch hergestelltes elektronische Bauelement A method of manufacturing an electronic component, especially a memory chip, and thereby prepared electronic component
03/20/2003CA2776343A1 Sensor substrate and method of fabricating same
03/20/2003CA2459908A1 Apparatus with compliant electrical terminals, and methods for forming same
03/20/2003CA2459386A1 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same
03/20/2003CA2454845A1 Nanotube films and articles
03/19/2003EP1294023A2 Semiconductor integrated circuit modules, manufacturing methods and usage thereof
03/19/2003EP1294022A2 Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
03/19/2003EP1294017A2 Chip manufacturing method for cutting test pads from integrated circuits by sectioning circuit chips from circuit substrate
03/19/2003EP1293788A2 Integrated semiconductor device
03/19/2003EP1293492A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same
03/19/2003EP1292978A2 Dual damascene process utilizing a low-k dual dielectric
03/19/2003EP1292970A1 Thin film forming method
03/19/2003EP1292834A2 Systems for testing integrated circuits during burn-in
03/19/2003EP1292549A1 Material composite and production and use of the material composite
03/19/2003EP1127031A4 High performance embedded rf filters
03/19/2003EP0859378B1 Emi preventive part and active device with the same
03/19/2003CN1404628A Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
03/19/2003CN1404303A Image instrument module package
03/19/2003CN1404206A Power inverter
03/19/2003CN1404183A High frequency line inverter, parts. assembly and communication apparatus
03/19/2003CN1404157A Solid image detecting device
03/19/2003CN1404149A Semiconductor device with electrostatic discharge protective circuit
03/19/2003CN1404146A Semiconductor device and production method thereof
03/19/2003CN1404145A Heat transferring vane unit
03/19/2003CN1404144A Electronic element
03/19/2003CN1404143A Semiconductor device
03/19/2003CN1404138A Integrated radio-frequency circuit
03/19/2003CN1404135A Semiconductor device capable of depressing current concentration on welding pad and producing method thereof
03/19/2003CN1404134A Method for designing wiring connecting part and semiconductor device
03/19/2003CN1404133A Wiring design method
03/19/2003CN1404123A Semiconductor device and checkup apparatus thereof
03/19/2003CN1404121A Method for manufacturing a chip
03/19/2003CN1404111A Method for producing semiconductor device using low-dielectric constant film and chip structure
03/19/2003CN1403874A Photo-sensitive conducting resin, conductor pattern forming method and manufacturing method of ceramic laminated structural parts
03/19/2003CN1403816A 微阵列芯片 Microarray
03/19/2003CN1103499C Radiation sheet for remaking and replacing of lead-wire bonding chip and package structure thereof
03/19/2003CN1103498C 红外探测器 Infrared Detectors
03/19/2003CN1103496C Method for forming shielding wire adjacement to signal wire
03/18/2003USRE38037 Modular semiconductor power device
03/18/2003US6535533 Mounting substrate and heat sink for high-power diode laser bars
03/18/2003US6535453 Semiconductor memory device
03/18/2003US6535398 Multichip module substrates with buried discrete capacitors and components and methods for making
03/18/2003US6535393 Electrical device allowing for increased device densities
03/18/2003US6535389 Heat sink mounting assembly
03/18/2003US6535388 Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof
03/18/2003US6535386 Electronic assembly having a heat pipe that conducts heat from a semiconductor die
03/18/2003US6535385 High performance heat sink configurations for use in high density packaging applications
03/18/2003US6535383 Clamshell heatsink
03/18/2003US6535090 Compact high-frequency circuit device
03/18/2003US6535012 Universal wafer carrier for wafer level die burn-in
03/18/2003US6534879 Semiconductor chip and semiconductor device having the chip
03/18/2003US6534878 Optimizing the power connection between chip and circuit board for a power switch
03/18/2003US6534877 Semiconductor copper bond pad surface protection
03/18/2003US6534875 Semiconductor part for component mounting, mounting structure and mounting method
03/18/2003US6534874 Semiconductor device and method of producing the same
03/18/2003US6534873 Semiconductor package and printed wiring board for semiconductor package
03/18/2003US6534870 Apparatus and method for manufacturing a semiconductor device
03/18/2003US6534869 Method for reducing stress-induced voids for 0.25 μm micron and smaller semiconductor chip technology by annealing interconnect lines prior to ILD deposition and semiconductor chip made thereby
03/18/2003US6534868 Semiconductor device and method for fabricating the same
03/18/2003US6534866 Dual damascene interconnect
03/18/2003US6534865 Method of enhanced fill of vias and trenches
03/18/2003US6534863 Common ball-limiting metallurgy for I/O sites
03/18/2003US6534861 Ball grid substrate for lead-on-chip semiconductor package
03/18/2003US6534860 Thermal transfer plate
03/18/2003US6534859 Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
03/18/2003US6534858 Assembly and methods for packaged die on pcb with heat sink encapsulant
03/18/2003US6534857 Thermally balanced power transistor
03/18/2003US6534856 Sockets for “springed” semiconductor devices
03/18/2003US6534855 Miniaturized audio devices having integrated circuits and coaxial connections; signal transmitters and receivers; portable telephones
03/18/2003US6534854 Pin grid array package with controlled impedance pins
03/18/2003US6534853 Semiconductor wafer designed to avoid probed marks while testing
03/18/2003US6534852 Ball grid array semiconductor package with improved strength and electric performance and method for making the same
03/18/2003US6534851 Modular semiconductor substrates
03/18/2003US6534850 Hermetic sealed electrical and electronic apparatus having transistors formed on silicon, dielectric multilayer coverings and scavengers comprising metals and/or alloys
03/18/2003US6534849 Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same
03/18/2003US6534847 Semiconductor device
03/18/2003US6534846 Lead frame for semiconductor device and semiconductor device using same
03/18/2003US6534845 Semiconductor device
03/18/2003US6534844 Integrated decoupling networks fabricated on a substrate having shielded quasi-coaxial conductors
03/18/2003US6534841 Electrical and electronic apparatus having three-dimensional dielectric multilayers, used in computers
03/18/2003US6534835 Damascene structure with low dielectric constant insulating layers
03/18/2003US6534834 Polysilicon bounded snapback device
03/18/2003US6534803 Electronic device, semiconductor device, and electrode forming method
03/18/2003US6534792 Microelectronic device structure with metallic interlayer between substrate and die
03/18/2003US6534786 Testing
03/18/2003US6534785 Reduced terminal testing system
03/18/2003US6534726 Module substrate and method of producing the same
03/18/2003US6534725 High-frequency circuit board and semiconductor device using the high-frequency circuit board
03/18/2003US6534723 Multilayer printed-circuit board and semiconductor device
03/18/2003US6534711 Encapsulation package and method of packaging an electronic circuit module
03/18/2003US6534422 Integrated ESD protection method and system
03/18/2003US6534419 Method and apparatus for reducing IC die mass and thickness while improving strength characteristics
03/18/2003US6534406 Method for increasing inductance of on-chip inductors and related structure
03/18/2003US6534403 Method of making a contact and via structure
03/18/2003US6534392 Methods of making microelectronic assemblies using bonding stage and bonding stage therefor
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