Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/26/2003CN1405867A Semiconductor chip, semiconductor device and manufacture method thereof
03/26/2003CN1405858A Method for generating mask data, mask and recording medium and method for manufacturing semiconductor device
03/26/2003CN1405779A One-time programmable storage device using fuse/anti-fuse and vertical-orientation fuse specific storage unite
03/26/2003CN1405261A Resin composition, film with adhesive for semiconductor device and semiconductor device with laminated film of metal foil and using same
03/26/2003CN1104182C Terminal installation structure for printed circuit board
03/26/2003CN1104051C Semiconductor device and manufacture method thereof
03/26/2003CN1104045C Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
03/26/2003CN1104044C Method for producing semiconductor package in chip size
03/26/2003CN1103684C Laminate product and method of manufacture thereof
03/25/2003USRE38043 Lead frame
03/25/2003US6539531 Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes
03/25/2003US6539276 Semiconductor circuit having surface features and method of adjusting a tool with respect to this surface
03/25/2003US6538898 Method and apparatus of die attachment for BOC and F/C surface mount
03/25/2003US6538896 Surface mount type electronic component
03/25/2003US6538893 Securing device for a locking member of a heat dissipating element of a CPU
03/25/2003US6538892 Radial finned heat sink
03/25/2003US6538891 Heat sink clip assembly
03/25/2003US6538888 Radial base heatsink
03/25/2003US6538884 Method and apparatus for removing heat from a component
03/25/2003US6538390 Organic LED display device of active matrix drive type and fabrication method therefor
03/25/2003US6538337 Ball grid array package for providing constant internal voltage via a PCB substrate routing configuration
03/25/2003US6538336 Wirebond assembly for high-speed integrated circuits
03/25/2003US6538335 Semiconductor apparatus and a semiconductor device mounting method
03/25/2003US6538334 High density flip chip memory arrays
03/25/2003US6538332 Semiconductor device and method of production of same
03/25/2003US6538331 Semiconductor device and a method of manufacturing the same
03/25/2003US6538329 Semiconductor integrated circuit device and method for making the same
03/25/2003US6538328 Structure including metal film formed on entire surface of front face, film including external gold layer resistant to reactive agent and forming protective layer against etching of at least one zone by potassium hydroxide reactive agent
03/25/2003US6538326 Semiconductor device and manufacturing method thereof
03/25/2003US6538325 Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics
03/25/2003US6538324 Multi-layered wiring layer and method of fabricating the same
03/25/2003US6538323 Semiconductor device having an electrode structure comprising a conductive fine particle film
03/25/2003US6538322 Semiconductor device in a recess of a semiconductor plate
03/25/2003US6538321 Heat sink with collapse structure and semiconductor package with heat sink
03/25/2003US6538320 Heat spreader comprising plurality of sidewalls extending from upper portion, and flange extending from sidewalls having plurality of holes adapted to allow adhesive to flow through to establish riveted connection to integrated circuit
03/25/2003US6538319 Semiconductor device
03/25/2003US6538317 Substrate for resin-encapsulated semiconductor device, resin-encapsulated semiconductor device and process for fabricating the same
03/25/2003US6538316 High frequency semiconductor device housing package
03/25/2003US6538315 Semiconductor device and method of manufacturing same
03/25/2003US6538314 Power grid wiring for semiconductor devices having voltage islands
03/25/2003US6538313 IC package with integral substrate capacitor
03/25/2003US6538312 Multilayered microelectronic device package with an integral window
03/25/2003US6538311 Two-stage transfer molding method to encapsulate MMC module
03/25/2003US6538310 LSI package with internal wire patterns to connect and mount bare chip to substrate
03/25/2003US6538309 Semiconductor device and circuit board for mounting semiconductor element
03/25/2003US6538308 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element
03/25/2003US6538307 Packaging substrate comprising staggered vias
03/25/2003US6538306 Electronic part
03/25/2003US6538305 BGA type semiconductor device having a solder-flow damping/stopping pattern
03/25/2003US6538304 Corner bonding to lead frame
03/25/2003US6538303 Lead frame and semiconductor device using the same
03/25/2003US6538301 Semiconductor device and method with improved flat surface
03/25/2003US6538291 Input protection circuit
03/25/2003US6538264 Semiconductor reliability test chip
03/25/2003US6538214 Method for manufacturing raised electrical contact pattern of controlled geometry
03/25/2003US6538213 High density design for organic chip carriers
03/25/2003US6538212 Circuit board for semiconductor device and manufacturing method thereof
03/25/2003US6538210 Circuit component built-in module, radio device having the same, and method for producing the same
03/25/2003US6538209 Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin
03/25/2003US6538208 Package base for mounting electronic element, electronic device and method of producing the same
03/25/2003US6538200 Underfill coating for LOC package
03/25/2003US6538196 Electric module structure formed with a polymer shrunk material
03/25/2003US6537923 Process for forming integrated circuit structure with low dielectric constant material between closely spaced apart metal lines
03/25/2003US6537905 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug
03/25/2003US6537904 Method for manufacturing a semiconductor device having a fluorine containing carbon inter-layer dielectric film
03/25/2003US6537883 Method for reducing plasma damage to a gate oxide of a metal-oxide semiconductor wafer
03/25/2003US6537859 Semiconductor device baking method
03/25/2003US6537858 Method for manufacturing semiconductor device
03/25/2003US6537857 Enhanced BGA grounded heatsink
03/25/2003US6537856 Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
03/25/2003US6537855 Semiconductor device and method of manufacturing the same
03/25/2003US6537854 Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
03/25/2003US6537853 Overmolding encapsulation process
03/25/2003US6537850 Method for fabricating semiconductor components with terminal contacts having alternate electrical paths
03/25/2003US6537849 Seal ring structure for radio frequency integrated circuits
03/25/2003US6537848 Super thin/super thermal ball grid array package
03/25/2003US6537836 Semiconductor structures and manufacturing methods
03/25/2003US6537713 Multilayer alignment keys and alignment method using the same
03/25/2003US6537613 Process for metal metalloid oxides and nitrides with compositional gradients
03/25/2003US6537482 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
03/25/2003US6537093 Socket for a semiconductor device
03/25/2003US6537051 Encapsulation mold with a castellated inner surface
03/25/2003US6536509 Diamond body
03/25/2003CA2273222C Three-dimensional component stacking using high density multichip interconnect decals
03/25/2003CA2155091C Bonding material and bonding method for electric element
03/24/2003WO2003010867A1 Optical semiconductor module and method of producing the same
03/24/2003CA2423609A1 Optical semiconductor module and method of producing the same
03/21/2003CA2399898A1 Method and apparatus for removing heat from a component
03/20/2003WO2003024177A1 Electronic apparatus
03/20/2003WO2003024170A1 An electronic assembly and a method of constructing an electronic assembly
03/20/2003WO2003024168A1 Ceramic electronic component and production method therefor
03/20/2003WO2003024166A1 Heat dissipating element for electronic components
03/20/2003WO2003024165A1 Heat dissipating element for electronic components
03/20/2003WO2003023856A2 Semiconductor structures with cavities, and methods of fabrication
03/20/2003WO2003023855A2 Semiconductor device with compliant electrical terminals, apparatus including the semiconductor device, and methods for forming same
03/20/2003WO2003023854A1 Pressure-contactable power semiconductor module
03/20/2003WO2003023853A2 Electronic assemblies with high capacity heat sinks and methods of manufacture
03/20/2003WO2003023852A1 Semiconductor package
03/20/2003WO2003023851A1 Semiconductor device and voltage regulator
03/20/2003WO2003023850A1 Semiconductor package
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