Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2003
03/27/2003US20030057570 Method and apparatus for routing die interconnections using intermediate connection elements secured to the die face
03/27/2003US20030057569 Semiconductor device
03/27/2003US20030057568 Flip chip type semiconductor device and method of manufacturing the same
03/27/2003US20030057567 Semiconductor component and method for its production
03/27/2003US20030057566 Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same
03/27/2003US20030057563 Integrated package and methods for making same
03/27/2003US20030057562 Provided with a contact plug layer connected to a semiconductor substrate and a pad electrode
03/27/2003US20030057559 Methods of forming metallurgy structures for wire and solder bonding
03/27/2003US20030057558 Semiconductor device and method of fabricating the same
03/27/2003US20030057557 Semiconductor device of multi-wiring structure and method of manufacturing the same
03/27/2003US20030057556 Semiconductor device including a pad and a method of manufacturing the same
03/27/2003US20030057553 Fluorine diffusion barriers for fluorinated dielectrics in integrated circuits
03/27/2003US20030057552 Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
03/27/2003US20030057551 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
03/27/2003US20030057550 Ball grid array package enhanced with a thermal and electrical connector
03/27/2003US20030057549 Semiconductor integrated circuit device with I/O cell and connection member
03/27/2003US20030057548 Integrated power delivery and cooling system for high power microprocessors
03/27/2003US20030057547 Thermally conductive silk-screenable interface material
03/27/2003US20030057545 PBGA substrate for anchoring heat sink
03/27/2003US20030057544 Substrate for receipt of packaged components face down or face up in such manner as to allow interconnection of packaged components using photolithographic techniques or direct laser writing so as to provide a monolithic integrated structure
03/27/2003US20030057543 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
03/27/2003US20030057542 Leads of a no-lead type package of a semiconductor device
03/27/2003US20030057541 Un-packaged or semi-packaged electrically tested electronic device free from infantile mortality and process for manufacture thereof
03/27/2003US20030057540 Combination-type 3D stacked IC package
03/27/2003US20030057539 Bumping technology in stacked die configurations
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/27/2003US20030057537 Semiconductor device
03/27/2003US20030057534 Semiconductor package
03/27/2003US20030057532 Semiconductor assembly with package using cup-shaped lead frame
03/27/2003US20030057531 Post passivation interconnection schemes on top of the IC chips
03/27/2003US20030057529 Package for a discrete device and manufacturing method of the same
03/27/2003US20030057528 Semiconductor device with copper fuse section
03/27/2003US20030057527 Integration of barrier layer and seed layer
03/27/2003US20030057526 Integration of barrier layer and seed layer
03/27/2003US20030057525 Flexible integrated monolithic circuit
03/27/2003US20030057523 Semiconductor device and drive circuit using the semiconductor devices
03/27/2003US20030057519 Semiconductor device and manufacturing method therefor
03/27/2003US20030057515 Electronic interface structure comprising base, elastomeric island supported by base, patterned metallization overlying elastomeric island and including floating pad at least partially overlying elastomeric island
03/27/2003US20030057513 Membrane IC fabrication
03/27/2003US20030057511 Semiconductor device
03/27/2003US20030057508 Package for opto-electrical components
03/27/2003US20030057476 Semiconductor device
03/27/2003US20030057466 Semiconductor device
03/27/2003US20030057457 Semiconductor device having buried conductive layer and method of manufacturing thereof
03/27/2003US20030057452 Multilayer semiconductor wiring structure with reduced alignment mark area
03/27/2003US20030057446 Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device
03/27/2003US20030057426 Solid state device, method for producing the same, solid state imaging unit and method for producing the same, and imaging apparatus
03/27/2003US20030057423 Three-dimensional device
03/27/2003US20030057414 Wherein device is not subjected to attack by reactive ion etching gases; photolithography; patterning
03/27/2003US20030057252 Apparatus and method of clamping semiconductor devices using sliding finger supports
03/27/2003US20030057113 Surface package type semiconductor package and method of producing semiconductor memory
03/27/2003US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
03/27/2003US20030056981 Ceramic circuit board and method for manufacturing the same
03/27/2003US20030056976 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
03/27/2003US20030056967 Method of fabricating and using an image sensor package
03/27/2003US20030056941 Double heat exchange module for a portable computer
03/27/2003US20030056940 Transpiration cooled heat sink and a self contained coolant supply for same
03/27/2003US20030056939 Integrated cooling unit
03/27/2003US20030056938 Core plate embedded in said main body; and a plurality of thermally conductive fins connected to and emanating from said top surface.
03/27/2003US20030056892 Irradiating the surface using an excimer laser and applying a coupling agent to the irradiated surface.
03/27/2003US20030056890 Thin film forming apparatus and thin film forming method
03/27/2003US20030056392 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
03/27/2003DE20219779U1 Heat removing module for cooling computer CPU has thermally-conductive ceramic material with heat-removing ribs and fan
03/27/2003DE10145348C1 Intermediate carrier for electronic component has suction used for removal of excess solder at foot of contact projections formed integral with plastics carrier body
03/27/2003CA2442314A1 Photosemiconductor encapsulating resin composition
03/26/2003EP1296388A2 Sealing structure for highly moisture sensitive electronic device element and method for fabrication
03/26/2003EP1296387A2 Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
03/26/2003EP1296385A2 Highly moisture-sensitive electronic device and method for fabrication
03/26/2003EP1296375A2 Wire bonding surface
03/26/2003EP1296374A1 Process for bonding and electrically connecting microsystems integrated in several distinct substrates
03/26/2003EP1296373A2 Advanced microelectronic heat dissipation package and method for its manufacture
03/26/2003EP1296372A2 Heat dissipating material and manufacturing method thereof
03/26/2003EP1296371A2 Semiconductor device and method of making the same
03/26/2003EP1296370A2 Enclosure for a semiconductor device
03/26/2003EP1295924A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor
03/26/2003EP1295905A1 Silicone rubber compositions for the sealing and encapsulation of electric and electronic parts
03/26/2003EP1295370A1 Water getter devices for laser amplifiers and process for the manufacture thereof
03/26/2003EP1295339A2 Semiconductor chip package with embedded capacitors
03/26/2003EP1295338A2 Leadless semiconductor product packaging apparatus having a window lid and method for packaging
03/26/2003EP1295337A1 Process for the manufacture of printed circuit boards with plated resistors
03/26/2003EP1295336A2 System support for semiconductor chips and electronic components and method for producing a system support and electronic components
03/26/2003EP1295335A1 Miniature microdevice package and process for making thereof
03/26/2003EP1295334A2 Hermetic high frequency module and method for producing the same
03/26/2003EP1295328A2 Flip chip-in-leadframe package and process
03/26/2003EP1295078A1 Graphite-based heat sink
03/26/2003EP1294520A1 Improved apparatus and method for dispensing solder
03/26/2003EP1245138B1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
03/26/2003EP0858433B1 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board
03/26/2003EP0792519B1 Interconnection elements for microelectronic components
03/26/2003CN2541952Y Retainer of integrated circuit radiator
03/26/2003CN2541951Y Fan-free radiator of CPU
03/26/2003CN2541893Y CPU radiator with its fan rotary speed controlled by CPU temp
03/26/2003CN1406455A Multilayer printed wiring board and method ofr producing multilayer printed wiring board
03/26/2003CN1406262A Adhesive polyimide resin and adhesive laminate
03/26/2003CN1405893A Solid device and solid imaging unit and their production method and imaging device
03/26/2003CN1405885A 半导体器件 Semiconductor devices
03/26/2003CN1405884A Switching-through channel
03/26/2003CN1405883A Semiconductor device and manufacture method thereof
03/26/2003CN1405882A 半导体器件 Semiconductor devices
03/26/2003CN1405881A 半导体装置 Semiconductor device
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