Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/01/2003US6541370 Composite microelectronic dielectric layer with inhibited crack susceptibility
04/01/2003US6541369 Method and apparatus for reducing fixed charges in a semiconductor device
04/01/2003US6541367 Very low dielectric constant plasma-enhanced CVD films
04/01/2003US6541366 Method for improving a solder bump adhesion bond to a UBM contact layer
04/01/2003US6541363 Antifuse manufacturing process
04/01/2003US6541358 Method of fabricating a semiconductor device by filling gaps between gate electrodes with HSQ
04/01/2003US6541352 Semiconductor die with contoured bottom surface and method for making same
04/01/2003US6541340 Method of manufacturing a semiconductor device with a concave trench
04/01/2003US6541335 Semiconductor device and method for manufacturing the same
04/01/2003US6541314 Semiconductor device with SOI structure and method of manufacturing the same
04/01/2003US6541312 Formation of antifuse structure in a three dimensional memory
04/01/2003US6541311 Method of positioning a component mounted on a lead frame in a test socket
04/01/2003US6541310 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
04/01/2003US6541308 Process for producing semiconductor package and structure thereof
04/01/2003US6541307 Multimedia chip package
04/01/2003US6541306 Resin-sealed semiconductor device and method of manufacturing the device
04/01/2003US6541303 Method for conducting heat in a flip-chip assembly
04/01/2003US6541301 Low RF loss direct die attach process and apparatus
04/01/2003US6541290 Architecture of laser fuse box of semiconductor integrated circuit and method for fabricating the same
04/01/2003US6541118 Insulator having a porcelain body and a hydrophobic coating
04/01/2003US6540927 Semiconductor packaging part and method producing the same
04/01/2003US6539725 Efficiency thermoelectrics utilizing thermal isolation
04/01/2003US6539626 Electroconductive path parallel to the surface are provided internally
04/01/2003US6539625 Chromium adhesion layer for copper vias in low-k technology
04/01/2003US6539624 Method for forming wafer level package
04/01/2003US6539623 Multimediacard fabrication method
03/2003
03/27/2003WO2003026370A1 Surface mounting package
03/27/2003WO2003026369A1 Latching micro magnetic relay packages and methods of packaging
03/27/2003WO2003026366A1 Flexible wiring board and liquid crystal display unit using the same
03/27/2003WO2003026016A2 Image sensor with recessed planarizing layers and method for making same
03/27/2003WO2003026010A1 Thin electronic label and method for making same
03/27/2003WO2003026009A2 Power electronics component
03/27/2003WO2003026008A2 Power electronics component
03/27/2003WO2003026006A2 Arrangement of a semiconductor in a housing, chip card and chip module
03/27/2003WO2003025998A2 Method of forming a bond pad and structure thereof
03/27/2003WO2003025996A1 Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
03/27/2003WO2003025985A1 Notched compound semiconductor wafer
03/27/2003WO2003025976A2 Embedded inductor for semiconductor device circuit
03/27/2003WO2003025975A2 Integrated circuit having a reduced spacing between a bus and adjacent circuitry
03/27/2003WO2003025974A2 Intermediate support for electronic components and method for solder contacting such an intermediate support
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025476A2 Microelectronic system with integral cyrocooler, and its fabrication and use
03/27/2003WO2003025475A2 Modular capillary pumped loop cooling system
03/27/2003WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
03/27/2003WO2003025243A2 Metal nitride deposition by ald using gettering reactant
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003WO2003025043A1 Resin composition for optical-semiconductor encapsulation
03/27/2003WO2003024724A2 Dry thermal interface material
03/27/2003WO2003024620A1 Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
03/27/2003WO2003007368A3 Method of forming nitride capped cu lines with reduced electromigration along the cu/nitride interface
03/27/2003WO2002058147A3 Method and structure to reduce the damage associated with programming electrical fuses
03/27/2003WO2002045164A3 Thermally and electrically enhanced ball grid array packaging
03/27/2003WO2002023620A3 Connection for conducting high frequency signal between a circuit and a discrete electrical component
03/27/2003US20030061579 Integrated circuit having a reduced spacing between a bus and adjacent circuitry
03/27/2003US20030060567 Polyalkylene polysulphides
03/27/2003US20030060172 Radio frequency module
03/27/2003US20030060108 Thermal spreader using thermal conduits
03/27/2003US20030060066 Solder ball and interconnection structure using the same
03/27/2003US20030060064 Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus
03/27/2003US20030060053 Method for manufacturing semiconductor device
03/27/2003US20030060041 Dual-stack, ball-limiting metallurgy and method of making same
03/27/2003US20030060036 Method of fabricating copper interconnects with very low-k inter-level insulator
03/27/2003US20030060035 Semiconductor device
03/27/2003US20030060034 Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
03/27/2003US20030060023 Manufacturing method for semiconductor apparatus
03/27/2003US20030060013 Method of manufacturing trench field effect transistors with trenched heavy body
03/27/2003US20030060009 Integrated capacitor and fuse
03/27/2003US20030060000 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
03/27/2003US20030059982 Methods of and apparatus for manufacturing ball grid array semiconductor device packages
03/27/2003US20030059980 Copper interconnect barrier layer structure and formation method
03/27/2003US20030059979 Semiconductor device-manufacturing method
03/27/2003US20030059978 Flip chip mounting method
03/27/2003US20030059976 Integrated package and methods for making same
03/27/2003US20030059965 Method for screening semiconductor devices for contact coplanarity
03/27/2003US20030059964 Electric-circuit fabricating method and system, and electric-circuit fabricating program
03/27/2003US20030059726 Method of recording identifier and set of photomasks
03/27/2003US20030059721 Forming copper wire on heat resistant tape; overcoating with photoresist; imaging with light source; packaging using epoxy resin
03/27/2003US20030059628 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor
03/27/2003US20030059176 Assembly of opto-electronic module with improved heat sink
03/27/2003US20030059174 Optical communication module
03/27/2003US20030058630 Multilayer circuit board and semiconductor device using the same
03/27/2003US20030058629 Wiring substrate for small electronic component and manufacturing method
03/27/2003US20030058621 Method and apparatus for retaining cooling apparatus and bus bar
03/27/2003US20030058620 Method to compensate for stress between heat spreader and thermal interface material
03/27/2003US20030058619 Adaptive heat sink for electronics applications
03/27/2003US20030058616 Method and apparatus for removing heat from a component
03/27/2003US20030058592 CMOS whole chip low capacitance ESD protection circuit
03/27/2003US20030058230 Flat-panel type display apparatus
03/27/2003US20030058028 Unit-architecture with implemented limited bank-column-select repairability
03/27/2003US20030058027 Circuits and methods for electrostatic discharge protection in integrated circuits
03/27/2003US20030058020 Semiconductor device capable of reducing noise to signal line
03/27/2003US20030057993 Apparatus and method for testing of microscale to nanoscale thin films
03/27/2003US20030057974 Arrangement of vias in a substrate to support a ball grid array
03/27/2003US20030057885 Electronic equipment
03/27/2003US20030057575 Alignment tool is used to align spacer with silicon die; thermal conductor facilitates heat transfer from silicon die after silicon die is bonded to substrate
03/27/2003US20030057574 Highly moisture-sensitive electronic device element and method for fabrication
03/27/2003US20030057573 Semiconductor device
03/27/2003US20030057572 Encapsulation of pin solder for maintaining accuracy in pin position
03/27/2003US20030057571 Wiring modeling technique
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