Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/03/2003US20030062111 Method of manufacturing glass ceramic multilayer substrate
04/03/2003US20030061824 Pumped liquid cooling system using a phase change refrigerant
04/03/2003DE20216065U1 Heat sink for cooling an apparatus where heat is generated with cooling projections
04/03/2003DE19655075C2 Semiconductor memory device for DRAM cell
04/03/2003DE10138278C1 Elektronisches Bauteil mit aufeinander gestapelten elektronischen Bauelementen und Verfahren zur Herstellung derselben An electronic part having stacked electronic components and methods for making same
04/03/2003CA2454895A1 Methods of nanotube films and articles
04/02/2003EP1298968A2 Metal/ceramic circuit board
04/02/2003EP1298733A1 Turn-off high-power semiconductor device
04/02/2003EP1298729A2 Memory cell
04/02/2003EP1298728A1 IC package with an electromagnetic interference screening device
04/02/2003EP1298727A2 Nano-circuits
04/02/2003EP1298726A2 Solder composition for semiconductor bumps
04/02/2003EP1298725A2 Semiconductor device of multi-wiring structure and method of manufacturing the same
04/02/2003EP1298724A2 Package for an electrical device
04/02/2003EP1298723A2 Electronic component in a plastic housing and components of a metallic support and method of manufacturing the same
04/02/2003EP1298548A2 Wiring modeling technique
04/02/2003EP1298474A1 A package for opto-electrical components
04/02/2003EP1298472A1 A package for opto-electrical components
04/02/2003EP1298108A2 Metal/ceramic bonding article
04/02/2003EP1297571A2 Layout and process for a device with segmented ball limited metallurgy for the inputs and outputs
04/02/2003EP1297570A1 Semiconductor device and method of manufacturing
04/02/2003CN2543206Y Internal storage chip stacking structure
04/02/2003CN2543205Y Separating phase-change radiator for electronic element and device and desk computer CPU chip
04/02/2003CN2543204Y Cooling fan
04/02/2003CN2543203Y Cooling fin
04/02/2003CN2543202Y Flexible encapsulation chip
04/02/2003CN2543201Y Cooling body for power semiconductor device
04/02/2003CN2543200Y Encapsulation structure for image sensing chip
04/02/2003CN2543199Y Encapsulation structure for image sensing chip
04/02/2003CN2543122Y 热管式散热器 Heat pipe radiator
04/02/2003CN2543120Y Cooling device capable of promoting cooling efficiency
04/02/2003CN1408197A Method, facility and device for producing electrical connecting element, product and semi-finished products thereof
04/02/2003CN1408126A Integrated component comprising metal-insulator-metal capacitor
04/02/2003CN1408125A Dual-die integrated circuit package
04/02/2003CN1407621A Electrostatic discharge protection for output of CMDS device
04/02/2003CN1407620A Semiconductor device and its manufacture
04/02/2003CN1407618A Integrated circuit modules and printing circuit board device
04/02/2003CN1407617A Manufacture of heat radiator with radiating element with high aspect ratio and products thereby
04/02/2003CN1407616A 电脑cpu散热器 Computer cpu heatsink
04/02/2003CN1407611A Laminated film and film carrying band for packaging electronic device
04/02/2003CN1407608A Compound semiconductor device manufacture
04/02/2003CN1407561A Conductive paste composition, conductive paste and its preparation
04/02/2003CN1407421A Desk computer with direct heat radiating layout system structure
04/02/2003CN1407141A Tinplating
04/02/2003CN1104742C Bottom lead semiconductor package and fabrication method thereof
04/02/2003CN1104741C Semiconductor package and method for fabricating same
04/02/2003CN1104647C Method for testing electronic devices attached to leadframe
04/02/2003CA2398831A1 Electronic component-mounting substrate and electronic components
04/01/2003US6542720 Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
04/01/2003US6542557 Method and apparatus for high speed signaling
04/01/2003US6542379 High density circuit
04/01/2003US6542376 High density packaging of electronic components
04/01/2003US6542371 Oil impregnated carbon fiber fabric
04/01/2003US6542370 Heat dissipating device for a CPU
04/01/2003US6542369 Fixing frame for CPU cooling devices
04/01/2003US6542368 Heat sink and power source unit employing the same
04/01/2003US6542367 Securing heat sinks
04/01/2003US6542366 Circuit board support
04/01/2003US6542365 Coolant cooled type semiconductor device
04/01/2003US6542360 Electronic apparatus containing heat generating component, and extension apparatus for extending the function of the electronic apparatus
04/01/2003US6542351 Capacitor structure
04/01/2003US6542346 High-voltage tolerance input buffer and ESD protection circuit
04/01/2003US6541897 Piezoelectric device and package thereof
04/01/2003US6541873 90 degree bump placement layout for an integrated circuit power grid
04/01/2003US6541872 Multi-layered adhesive for attaching a semiconductor die to a substrate
04/01/2003US6541871 Method for fabricating a stacked chip package
04/01/2003US6541870 Semiconductor package with stacked chips
04/01/2003US6541868 Interconnecting conductive links
04/01/2003US6541867 Microelectronic connector with planar elastomer sockets
04/01/2003US6541865 Porous dielectric material and electronic devices fabricated therewith
04/01/2003US6541864 Thickness of a first insulation film corresponds to the depth of a contact hole and a surface of a second insulation film serves as a bottom face of a wire groove; prevents short circuiting even when an interval between wires is reduced
04/01/2003US6541863 Layer of porous silicon having lower density than the solid silicon starting material, and having conductive interconnections formed therein; stray capacitance of adjacent wiring lines is reduced
04/01/2003US6541862 Semiconductor device including a plurality of interconnection layers, manufacturing method thereof and method of designing semiconductor circuit used in the manufacturing method
04/01/2003US6541861 Semiconductor device manufacturing method including forming step of SOI structure and semiconductor device having SOI structure
04/01/2003US6541860 Barrier-to-seed layer alloying in integrated circuit interconnects
04/01/2003US6541859 Methods and structures for silver interconnections in integrated circuits
04/01/2003US6541858 Interconnect alloys and methods and apparatus using same
04/01/2003US6541857 Method of forming BGA interconnections having mixed solder profiles
04/01/2003US6541855 Printed board unit
04/01/2003US6541854 Super low profile package with high efficiency of heat dissipation
04/01/2003US6541852 Flexible sheet bonded in tension on a rigid frame so that the sheet spans an aperture in the frame; frame and sheet have different coefficients of thermal expansion; use making microelectronics
04/01/2003US6541851 Lead frame for a semiconductor device
04/01/2003US6541850 Utilization of die active surfaces for laterally extending die internal and external connections
04/01/2003US6541849 Memory device power distribution
04/01/2003US6541848 Semiconductor device including stud bumps as external connection terminals
04/01/2003US6541847 Packaging for multi-processor shared-memory system
04/01/2003US6541846 Dual LOC semiconductor assembly employing floating lead finger structure
04/01/2003US6541845 Components with releasable leads and methods of making releasable leads
04/01/2003US6541844 Semiconductor device having substrate with die-bonding area and wire-bonding areas
04/01/2003US6541842 Metal barrier behavior by SiC:H deposition on porous materials
04/01/2003US6541841 Semiconductor device including high frequency circuit with inductor
04/01/2003US6541770 Charged particle system error diagnosis
04/01/2003US6541710 Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns
04/01/2003US6541709 Inherently robust repair process for thin film circuitry using uv laser
04/01/2003US6541702 Semiconductor device
04/01/2003US6541398 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device containing the same
04/01/2003US6541396 Method of manufacturing a semiconductor device using a low dielectric constant organic film grown in a vacuum above an inlaid interconnection layer
04/01/2003US6541379 Wiring forming method for semiconductor device
04/01/2003US6541378 High density connectors; connecting copper to dielectric; precleaning with argon; polyimide silicone epoxy adhesive
04/01/2003US6541373 Manufacture method for semiconductor with small variation in MOS threshold voltage
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