Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/03/2003WO2003028072A1 Method for manufacturing semiconductor device
04/03/2003WO2003028044A2 Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
04/03/2003WO2003027690A1 Test structures for estimating dishing and erosion effects in copper damascene technology
04/03/2003WO2003027207A1 Thermoconductive composition
04/03/2003WO2003027043A1 Brazeable matallizations for diamond components
04/03/2003WO2003027003A2 Methods of nanotube films and articles
04/03/2003WO2003026856A1 Production method of laminated ceramic electronic component and electronic apparatus
04/03/2003WO2002103755A3 Semiconductor die including conductive columns
04/03/2003WO2002099850A3 Interchangeable microdeposition head apparatus and method
04/03/2003WO2002065475A3 Self-aligned conductive line for cross-point magnetic memory integrated circuits
04/03/2003WO2002050852A3 Capacitor with extended surface lands and method of fabrication therefor
04/03/2003WO2002023634A9 Cmos transceiver having an integrated power amplifier
04/03/2003WO2002007312A3 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
04/03/2003US20030066041 Adaptive power routing and shield sharing to reduce shield count
04/03/2003US20030066040 Built off self test (BOST) in the kerf
04/03/2003US20030065994 Semiconductor device with malfunction control circuit and controlling method thereof
04/03/2003US20030065367 Method and system of tape automated bonding
04/03/2003US20030065056 A five membered ring containing a ketone or thione group and having atleast 2 sulfur atom when its carbonate or one thio and one sulfur when its thione compound, and a compound having two or more acidic groups
04/03/2003US20030064601 Method for via etching in organo-silica-glass
04/03/2003US20030064584 Chip package enabling increased input/output density
04/03/2003US20030064583 Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode
04/03/2003US20030064582 Mask layer and interconnect structure for dual damascene semiconductor manufacturing
04/03/2003US20030064581 Process of making dual damascene structures using a sacrificial polymer
04/03/2003US20030064580 Dual-damascene interconnects without an etch stop layer by alternating ILDs
04/03/2003US20030064578 Method for fabricating semiconductor integrated circuit
04/03/2003US20030064577 Method of making air gaps copper interconnect
04/03/2003US20030064553 Method of producing semiconductor device and its structure
04/03/2003US20030064549 Method of manufacturing a semiconductor device
04/03/2003US20030064547 High density modularity for IC's
04/03/2003US20030064545 Low profile stacked multi-chip package and method of forming same
04/03/2003US20030064542 Methods of packaging an integrated circuit
04/03/2003US20030064531 Semiconductor wafer identification
04/03/2003US20030064265 Membrane electrode assemblies for use in fuel cells
04/03/2003US20030064171 Method for edge sealing barrier films
04/03/2003US20030063503 Composite integrated semiconductor device
04/03/2003US20030063450 Multiple die interconnect system
04/03/2003US20030063448 Electronic component package, printed circuit board, and method of inspecting the printed circuit board
04/03/2003US20030063442 Power module
04/03/2003US20030063441 Thermal diffuser and radiator
04/03/2003US20030063440 Package retention module coupled directly to a socket
04/03/2003US20030063439 Radial base heatsink
04/03/2003US20030063438 Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump
04/03/2003US20030063437 Information processing unit and method for cooling same
04/03/2003US20030063427 Variable capacitor and a variable inductor
04/03/2003US20030063247 Heat sink attachment
04/03/2003US20030062642 Leadframe and method for removing cleaning compound flash from mold vents
04/03/2003US20030062632 Semiconductor device having embedded array
04/03/2003US20030062631 Semiconductor device and method of fabricating the same
04/03/2003US20030062630 Heat resistant thermoplastic resin, epoxy resin and triphenol curing agent; reliable low temperatures bonding
04/03/2003US20030062629 Flip chip adaptor package for bare die
04/03/2003US20030062628 Multi-chip package having spacer that is inserted between chips and manufacturing method thereof
04/03/2003US20030062626 Efficiency
04/03/2003US20030062625 Semiconductor device and method of manufacturing the same
04/03/2003US20030062624 Component built-in module and method of manufacturing the same
04/03/2003US20030062623 Semiconductor device and manufacturing method and testing method of the same
04/03/2003US20030062622 Plural semiconductor devices in monolithic flip chip
04/03/2003US20030062621 Method of producing a biometric sensor
04/03/2003US20030062620 Semiconductor device
04/03/2003US20030062619 Heat transfer system with supracritical fluid
04/03/2003US20030062618 Arrangements to increase structural rigidity of semiconductor package
04/03/2003US20030062617 Electronic device
04/03/2003US20030062615 Support structure for power element
04/03/2003US20030062614 Used to achieve a high density semiconductor package
04/03/2003US20030062613 Semiconductor device and manufacturing method thereof
04/03/2003US20030062612 Stacked type semiconductor device
04/03/2003US20030062611 Semiconductor device
04/03/2003US20030062610 For protecting GaAs(gallium arsenide) circuitry sealed in an hermetic package; for chemically binding up hydrogen evolved from packaging materials
04/03/2003US20030062609 Identification of IC chip based on information formed on high-molecular film
04/03/2003US20030062608 Semiconductor device
04/03/2003US20030062607 Electronic component with external flat conductors and a method for producing the electronic component
04/03/2003US20030062606 Leadless semiconductor product packaging apparatus having a window lid and method for packaging
04/03/2003US20030062604 Lead frame
04/03/2003US20030062603 Leadframe and method for removing cleaning compound flash from mold vents
04/03/2003US20030062602 Arrangements to supply power to semiconductor package
04/03/2003US20030062601 Surface mount package
04/03/2003US20030062596 Metal-to-metal antifuse employing carbon-containing antifuse material
04/03/2003US20030062595 One time programmable fuse/anti-fuse combination based memory cell
04/03/2003US20030062594 Anti-fuse structure with low on-state resistance and low off-state leakage
04/03/2003US20030062592 Fuse element, semiconductor device and method for manufacturing the same
04/03/2003US20030062591 Method and apparatus for trimming integrated circuits
04/03/2003US20030062590 Vertically oriented nano-fuse and nano-resistor circuit elements
04/03/2003US20030062581 Pin diode and method for fabricating the diode
04/03/2003US20030062564 Suitable for analog circuit
04/03/2003US20030062550 Semiconductor device and method for patterning
04/03/2003US20030062541 High-frequency chip packages
04/03/2003US20030062535 Turn-off high power semiconductor device
04/03/2003US20030062533 Sealing for OLED devices
04/03/2003US20030062526 Substrates having increased thermal conductivity for semiconductor structures
04/03/2003US20030062521 Test element group structure
04/03/2003US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry
04/03/2003US20030062261 High purity zirconium or hafnium, sputtering target comprising the high purity zirconium of hafnium and thin film formed using the target, and method for producing high purity zirconium or hafnium and method for producing powder of high purity zirconium or hafnium
04/03/2003US20030062195 Soldered heat sink anchor and method of use
04/03/2003US20030062186 Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
04/03/2003US20030062185 Ceramic multilayer circuit boards mounted on a patterned metal support substrate and method of making
04/03/2003US20030062184 Package for an electrical device
04/03/2003US20030062151 Heat sink and electronic circuit module including the same
04/03/2003US20030062150 Temperature/strain control of fatigue vulnerable devices used in electronic circuits
04/03/2003US20030062149 Electroosmotic microchannel cooling system
04/03/2003US20030062123 Method of self-latching for adhesion during self-assembly of electronic or optical components
04/03/2003US20030062116 Method and apparatus for bonding protection film onto silicon wafer
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