| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/08/2014 | CN102569095B Method for preparing LTCC (low-temperature co-fired ceramic) substrate with channels |
| 01/08/2014 | CN102165677B 动力工具 Power Tools |
| 01/08/2014 | CN102064136B 集成电路结构 Integrated circuit structure |
| 01/08/2014 | CN102034788B Substrate with built-in semiconductor element and method for manufacturing the same |
| 01/08/2014 | CN101946318B Semiconductor element module and method for manufacturing the same |
| 01/08/2014 | CN101036238B Light emitting device, lighting equipment or liquid crystal display device using such light emitting device |
| 01/07/2014 | US8625381 Stacked semiconductor device |
| 01/07/2014 | US8625324 Non-salicide polysilicon fuse |
| 01/07/2014 | US8625280 Cooling memory modules using cold plate blades coupled to the memory modules via clips |
| 01/07/2014 | US8625096 Method and system for increasing alignment target contrast |
| 01/07/2014 | US8624626 3D IC structure and method |
| 01/07/2014 | US8624408 Circuit device and method of manufacturing the same |
| 01/07/2014 | US8624406 Semiconductor device, and method for supplying electric power to same |
| 01/07/2014 | US8624404 Integrated circuit package having offset vias |
| 01/07/2014 | US8624403 Semiconductor device and a method of manufacturing the same |
| 01/07/2014 | US8624402 Mock bump system for flip chip integrated circuits |
| 01/07/2014 | US8624401 Semiconductor device having chip crack detection structure |
| 01/07/2014 | US8624400 Semiconductor device and method for manufacturing the same |
| 01/07/2014 | US8624399 Semiconductor device and method of manufacturing semiconductor device |
| 01/07/2014 | US8624398 Semiconductor circuit structure |
| 01/07/2014 | US8624396 Apparatus and method for low contact resistance carbon nanotube interconnect |
| 01/07/2014 | US8624395 Redundancy design with electro-migration immunity and method of manufacture |
| 01/07/2014 | US8624394 Integrated technology for partial air gap low K deposition |
| 01/07/2014 | US8624393 Methods and designs for localized wafer thinning |
| 01/07/2014 | US8624392 Electrical connection for chip scale packaging |
| 01/07/2014 | US8624391 Chip design with robust corner bumps |
| 01/07/2014 | US8624390 Packaging an electronic device |
| 01/07/2014 | US8624389 Light emitting diode module |
| 01/07/2014 | US8624388 Package carrier and manufacturing method thereof |
| 01/07/2014 | US8624387 Top port multi-part surface mount silicon condenser microphone package |
| 01/07/2014 | US8624386 Bottom port multi-part surface mount silicon condenser microphone package |
| 01/07/2014 | US8624385 Top port surface mount silicon condenser microphone package |
| 01/07/2014 | US8624384 Bottom port surface mount silicon condenser microphone package |
| 01/07/2014 | US8624383 Integrated circuit package and method for fabrication thereof |
| 01/07/2014 | US8624382 Packaging substrate and method of fabricating the same |
| 01/07/2014 | US8624381 Integrated antennas in wafer level package |
| 01/07/2014 | US8624379 Semiconductor device |
| 01/07/2014 | US8624378 Chip-housing module and a method for forming a chip-housing module |
| 01/07/2014 | US8624377 Method of stacking flip-chip on wire-bonded chip |
| 01/07/2014 | US8624375 Semiconductor package for selecting semiconductor chip from a chip stack |
| 01/07/2014 | US8624374 Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof |
| 01/07/2014 | US8624373 Miniature electronic component for microwave applications |
| 01/07/2014 | US8624372 Semiconductor component comprising an interposer substrate |
| 01/07/2014 | US8624371 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
| 01/07/2014 | US8624370 Integrated circuit packaging system with an interposer and method of manufacture thereof |
| 01/07/2014 | US8624369 Balance filter packaging chip having balun mounted therein and manufacturing method thereof |
| 01/07/2014 | US8624368 Quad flat non-leaded semiconductor package |
| 01/07/2014 | US8624367 Semiconductor device including semiconductor chip mounted on lead frame |
| 01/07/2014 | US8624366 Semiconductor package structure and method of fabricating the same |
| 01/07/2014 | US8624365 Interposer based capacitors for semiconductor packaging |
| 01/07/2014 | US8624364 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof |
| 01/07/2014 | US8624362 IC wafer having electromagnetic shielding effects and method for making the same |
| 01/07/2014 | US8624360 Cooling channels in 3DIC stacks |
| 01/07/2014 | US8624359 Wafer level chip scale package and method of manufacturing the same |
| 01/07/2014 | US8624352 Mitigation of detrimental breakdown of a high dielectric constant metal-insulator-metal capacitor in a capacitor bank |
| 01/07/2014 | US8624346 Exclusion zone for stress-sensitive circuit design |
| 01/07/2014 | US8624323 BEOL structures incorporating active devices and mechanical strength |
| 01/07/2014 | US8624322 High voltage device with a parallel resistor |
| 01/07/2014 | US8624321 Thin film transistor including a microcrystalline semiconductor layer and amorphous semiconductor layer and display device including the same |
| 01/07/2014 | US8624300 Contact integration for three-dimensional stacking semiconductor devices |
| 01/07/2014 | US8624299 Stacked bit line dual word line nonvolatile memory |
| 01/07/2014 | US8624298 Display device including thin film transistor |
| 01/07/2014 | US8624286 Semiconductor device |
| 01/07/2014 | US8624253 Contact structure and semiconductor device |
| 01/07/2014 | US8624243 Display panel |
| 01/07/2014 | US8624242 Semiconductor integrated circuit |
| 01/07/2014 | US8624241 Semiconductor chip, stack-type semiconductor package |
| 01/07/2014 | US8624134 Package of environmental sensitive element and encapsulation method of the same |
| 01/07/2014 | US8623711 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
| 01/07/2014 | US8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
| 01/07/2014 | US8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages |
| 01/07/2014 | US8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug |
| 01/07/2014 | US8623704 Adhesive/spacer island structure for multiple die package |
| 01/07/2014 | US8623703 Silicon device and silicon device manufacturing method |
| 01/07/2014 | US8623691 Solid state image pickup device and method of producing solid state image pickup device |
| 01/07/2014 | US8623686 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same |
| 01/07/2014 | US8623136 Asymmetrical wafer configurations and method for creating the same |
| 01/07/2014 | US8622906 Analyte monitoring device and methods of use |
| 01/07/2014 | US8621926 Wiring substrate, piezoelectric oscillator and gyrosensor |
| 01/07/2014 | CA2689346C Microwave integrated circuit package and method for forming such package |
| 01/03/2014 | WO2014004969A1 Polyorganometallosiloxane, curable polymer compositions, cured product thereof, and optical semiconductor device |
| 01/03/2014 | WO2014004527A1 Package substrates with multiple dice |
| 01/03/2014 | WO2014004520A1 Integrated circuit package having offset vias |
| 01/03/2014 | WO2014004504A1 Three-dimensional electronic packages utilizing unpatterned adhesive layer |
| 01/03/2014 | WO2014004147A1 Microelectronic structure having a microelectronic device disposed between an interposer and a substrate |
| 01/03/2014 | WO2014004009A1 Semiconductor package with mechanical fuse |
| 01/03/2014 | WO2014003976A1 An integrated heat spreader that maximizes heat transfer from a multi-chip package |
| 01/03/2014 | WO2014003960A1 Sensor assembly for use in medical position and orientation tracking |
| 01/03/2014 | WO2014003533A1 Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same |
| 01/03/2014 | WO2014003477A1 Nested module package, and method for manufacturing same |
| 01/03/2014 | WO2014003314A1 Multi-clip magazine |
| 01/03/2014 | WO2014002949A1 Bonded substrate, method for manufacturing same, semiconductor module using bonded substrate, and method for manufacturing same |
| 01/03/2014 | WO2014002921A1 Package for housing semiconductor element, and semiconductor device |
| 01/03/2014 | WO2014002852A1 Semiconductor device, manufacturing method for semiconductor device, and electronic device |
| 01/03/2014 | WO2014002807A1 Can package structure of electronic component |
| 01/03/2014 | WO2014002672A1 Semiconductor device and method for manufacturing same |
| 01/03/2014 | WO2014002663A1 Interposer, printed circuit board, and semiconductor device |
| 01/03/2014 | WO2014002625A1 Semiconductor device |
| 01/03/2014 | WO2014002353A1 Solid-state image sensing device and production method for same |
| 01/03/2014 | WO2014002306A1 Alumina ceramic, and ceramic wiring substrate and ceramic package using same |