Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/10/2003US20030067264 Light-emitting diode and method for its production
04/10/2003US20030067084 Semiconductor device and manufacturing method thereof
04/10/2003US20030067082 Apparatus and methods for stacking integrated circuit devices with interconnected stacking structure
04/10/2003US20030067080 Sockets for "springed" semiconductor devices
04/10/2003US20030067079 Semiconductor integrated circuit device and a method of manufacturing the same
04/10/2003US20030067078 Semiconductor device and method of manufacturing the same
04/10/2003US20030067076 Semiconductor device
04/10/2003US20030067075 Semiconductor device having a multiple layer wiring structure, wiring method, wiring device, and recording medium
04/10/2003US20030067074 Circuit boards containing vias and methods for producing same
04/10/2003US20030067073 Multilayer; connecting using solder
04/10/2003US20030067072 Semiconductor device and manufacturing method and testing method of the same
04/10/2003US20030067071 Semiconductor device package with improved cooling
04/10/2003US20030067070 Semiconductor package
04/10/2003US20030067069 Method of improving thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
04/10/2003US20030067068 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component
04/10/2003US20030067067 Semiconductor integrated circuit device and method of manufacturing the same
04/10/2003US20030067066 Semiconductor device
04/10/2003US20030067065 Three-dimensional power semiconductor module and method of manufacturing the same
04/10/2003US20030067064 Stack package using flexible double wiring substrate
04/10/2003US20030067062 Electronic component with at least one semiconductor chip and method for producing the electronic component
04/10/2003US20030067061 Leadframe and method for reducing mold compound adhesion problems
04/10/2003US20030067060 Routing element for use in multichip modules, multichip modules including the routing element, and methods
04/10/2003US20030067059 Leads under chip in conventional IC package
04/10/2003US20030067058 Lead frame and method of manufacturing the same
04/10/2003US20030067057 Lead frame and flip chip semiconductor package with the same
04/10/2003US20030067056 Multilayer interconnect board and multilayer semiconductor device
04/10/2003US20030067055 Thermally conductive silk-screenable interface material
04/10/2003US20030067053 Semiconductor device with capacitor and method of manufacturing thereof
04/10/2003US20030067052 Integrated circuit device and method of manufacturing the same
04/10/2003US20030067048 Integrated circuit device
04/10/2003US20030067040 ESD protection devices and methods to reduce trigger voltage
04/10/2003US20030067039 Electrostatic discharge protection structure
04/10/2003US20030067021 Semiconductor device and manufacturing method of the same
04/10/2003US20030067020 Semiconductor device
04/10/2003US20030067018 System with meshed power and signal buses on cell array
04/10/2003US20030067014 Semiconductor substrate for a one-chip electronic device and related manufacturing method
04/10/2003US20030067002 Wafer with additional circuit parts in the kerf area for testing integrated circuits on the wafer
04/10/2003US20030067001 Apparatus and method for packaging circuits
04/10/2003US20030066747 Pressure modulation method to obtain improved step coverage of seed layer
04/10/2003US20030066679 Electrical circuit and method of formation
04/10/2003US20030066638 Devices using a medium having a high heat transfer rate
04/10/2003US20030066637 Method and apparatus for removing heat from a protection region within a tamper responsive package
04/10/2003US20030066634 Heat exchanger
04/10/2003US20030066629 Heat-radiating device
04/10/2003US20030066628 Tower type finned heat pipe type heat sink
04/10/2003US20030066627 Heat dissipation device
04/10/2003US20030066626 Cooling system having independent fan location
04/10/2003US20030066625 Mems microcapillary pumped loop for chip-level temperature control
04/10/2003US20030066621 Aluminum or alloy substrate coupled to acrylic acid-ethylene layer filled with flux material
04/10/2003US20030066554 Modular thermoelectric couple and stack
04/10/2003US20030066188 Method and apparatus for connecting at least one chip to an external wiring configuration
04/10/2003DE10141354C1 Gehäuse für elektrische Bauelemente, insbesondere Kondensatoren Housing for electrical components, especially capacitors
04/10/2003CA2462444A1 Cooling system having independent fan location
04/09/2003EP1301062A2 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
04/09/2003EP1300929A1 Rectifier device
04/09/2003EP1300905A2 Electronic component-mounting substrate and electronic components
04/09/2003EP1300884A2 Apparatus and method for electromagnetic shielding of a device
04/09/2003EP1300883A2 Thermal dissipation assembly for electronic components
04/09/2003EP1300882A2 Semiconductor integrated circuit and method of manufacture thereof
04/09/2003EP1300881A2 Method of manufacturing semiconductor packaging
04/09/2003EP1300378A1 Process for improving the adhesive properties of a ceramic substrate
04/09/2003EP1299907A1 Electronic device with heat conductive encasing device
04/09/2003EP1299906A2 Electronic component
04/09/2003EP1299904A2 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
04/09/2003EP1299568A1 Fe-ni or fe-ni-co or fe-ni-co-cu alloy strip with improved cuttability
04/09/2003EP1042389B1 Use of a silicone rubber for producing an absorber material
04/09/2003EP0912335B1 Conductive elastomers and methods for fabricating the same
04/09/2003EP0680082B1 Structure for mounting semiconductor device and liquid crystal display device
04/09/2003CN2544497Y Snap fastener for heat sink
04/09/2003CN2544415Y Fan connection holder structure for heat sink
04/09/2003CN2544414Y CPU heat sink with heat conductive pipe
04/09/2003CN2544333Y Heat sink and flow guider thereof
04/09/2003CN2544332Y Snap fastener structure for heat sink
04/09/2003CN2544329Y Snap fastener for heat sink
04/09/2003CN1409874A Interposer device
04/09/2003CN1409873A Power transistor module, power amplifier and method in fabrication thereof
04/09/2003CN1409872A Integrated circuit package formed at wafer level
04/09/2003CN1409869A Method for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
04/09/2003CN1409435A High frequency module
04/09/2003CN1409406A Large power switchable semiconductor device
04/09/2003CN1409405A Semiconductor chip of semiconductor discharge tube
04/09/2003CN1409399A Storage unit based on once programmable fuse/anti-fuse combination
04/09/2003CN1409396A Vertical-oriented super small fuse and circuit element of super small resistor
04/09/2003CN1409394A Semiconductor integrated circuit device, mounting substrate and mounting body
04/09/2003CN1409393A Integreted circuit bearing base with overvoltage protective function
04/09/2003CN1409392A Method of packaging spherical grid array for base on chip
04/09/2003CN1409391A High wet sensitive electronic device part using air ventilation hole and gap and its producing method
04/09/2003CN1409390A Seal structure used for high wet sensitive electronic device element and its producing method
04/09/2003CN1409387A Method for producing semiconductor integrated circuit
04/09/2003CN1409188A Heat radiator of computer adaptive card and its radiation method
04/09/2003CN1408765A Resin composition for insulation and laminated body using said composition
04/09/2003CN1105483C 半导体器件封装 The semiconductor device package
04/09/2003CN1105416C Balance integrated semiconductor device worked with parallel resonant circuit
04/09/2003CN1105399C Bumpless method of attaching inner leads to semiconductor integrated circuits
04/09/2003CN1105398C Method for manufacturing semiconductor apparstus
04/09/2003CN1105397C Process for producing contacts on electrical components suitable for flip-chip assemble
04/09/2003CN1105132C 环氧树脂组合物和半导体器件 Epoxy resin composition and a semiconductor device
04/08/2003US6546540 Method of automatic layout design for LSI, mask set and semiconductor integrated circuit manufactured by automatic layout design method, and recording medium storing automatic layout design program
04/08/2003US6545870 Screwless retention of heatsink load to chassis
04/08/2003US6545869 Adjusting fillet geometry to couple a heat spreader to a chip carrier
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