Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/15/2003US6548576 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
04/15/2003US6548575 High temperature underfilling material with low exotherm during use
04/15/2003US6548402 Method of depositing a thick titanium nitride film
04/15/2003US6548400 Method of fabricating interlevel connectors using only one photomask step
04/15/2003US6548397 Electrical and thermal contact for use in semiconductor devices
04/15/2003US6548392 Methods of a high density flip chip memory arrays
04/15/2003US6548391 Method of vertically integrating electric components by means of back contacting
04/15/2003US6548386 Method for forming and patterning film
04/15/2003US6548376 Methods of thinning microelectronic workpieces
04/15/2003US6548365 Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit
04/15/2003US6548358 Electrically blowable fuse with reduced cross-sectional area
04/15/2003US6548338 Integrated high-performance decoupling capacitor and heat sink
04/15/2003US6548330 Semiconductor apparatus and method of fabricating semiconductor apparatus
04/15/2003US6548329 Amorphous hydrogenated carbon hermetic structure fabrication method
04/15/2003US6548328 Circuit device and manufacturing method of circuit device
04/15/2003US6548327 Low cost electroless plating process for single chips and wafer parts and products obtained thereof
04/15/2003US6548326 Semiconductor device and process of producing same
04/15/2003US6548315 Manufacture method for semiconductor inspection apparatus
04/15/2003US6548314 Method for enabling access to micro-sections of integrated circuits on a wafer
04/15/2003US6548189 Epoxidized cashew nutshell liquid, a catalyst, and bisphenol a diglycidyl ether
04/15/2003US6548152 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
04/15/2003US6547452 Alignment systems for subassemblies of overmolded optoelectronic modules
04/15/2003US6547409 Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
04/15/2003US6547124 Method for forming a micro column grid array (CGA)
04/15/2003US6547001 Flexible glove-like heat sink
04/15/2003US6546623 Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
04/15/2003US6546622 Printed-wiring substrate and method for fabricating the same
04/15/2003US6546620 Flip chip integrated circuit and passive chip component package fabrication method
04/10/2003WO2003030608A1 Cooling system having independent fan location
04/10/2003WO2003030604A1 Socket and contact of semiconductor package
04/10/2003WO2003030602A1 Multi-layered circuit wiring plate, ic package, and production method of multi-layered circuit wiring plate
04/10/2003WO2003030601A1 Electronic circuit comprising conductive bridges and method for making such bridges
04/10/2003WO2003030600A1 Printed wiring board and production method for printed wiring board
04/10/2003WO2003030275A1 Improved sealing for oled devices
04/10/2003WO2003030260A1 Semiconductor device and semiconductor device manufacturing method
04/10/2003WO2003030259A1 Semiconductor device and method of manufacturing the device
04/10/2003WO2003030258A1 Plural semiconductor devices in monolithic flip chip
04/10/2003WO2003030257A2 Soldered heat sink anchor and method of use
04/10/2003WO2003030256A2 Arrangements to increase structural rigidity of semiconductor package
04/10/2003WO2003030255A2 Multiple die interconnect system
04/10/2003WO2003030252A2 Process for producing interconnects
04/10/2003WO2003030248A2 Method of mounting an electronic device on a substrate by a laser beam
04/10/2003WO2003030247A2 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
04/10/2003WO2003030245A2 Method for assembly of complementary-shaped receptacle site and device microstructures
04/10/2003WO2003030225A2 Semiconductor chip with multiple rows of bond pads
04/10/2003WO2003030217A2 Metal-to-metal antifuse employing carbon-containing antifuse material
04/10/2003WO2003030214A2 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
04/10/2003WO2003030081A2 Semiconductor wafer identification
04/10/2003WO2003029772A2 Imaging array
04/10/2003WO2003029731A2 Electroosmotic microchannel cooling system
04/10/2003WO2003029510A1 Aluminum alloy thin film and wiring circuit having the thin film and target material for forming the tin film
04/10/2003WO2003029323A1 Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
04/10/2003WO2003029322A1 Curing agent composition for epoxy resins, epoxy resin composition and use thereof
04/10/2003WO2003029321A1 Epoxy resin compositions and semiconductor devices
04/10/2003WO2003029166A2 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
04/10/2003WO2003028903A2 Method for edge sealing barrier films
04/10/2003WO2003028553A1 Fingerprint sensor
04/10/2003WO2003009318A8 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
04/10/2003WO2003005489A3 Socket connector
04/10/2003WO2003005415A3 Super gto-based power blocks
04/10/2003WO2003002918A3 Cooler for electronic devices
04/10/2003WO2003001133A3 Graphite-based thermal dissipation component
04/10/2003WO2002091467A3 Protective housing for memory
04/10/2003WO2002071447A3 Ruthenium silicide wet etch
04/10/2003WO2002058135A3 Interconnect structures and a method of electroless introduction of interconnect structures
04/10/2003WO2002027784A3 Making of fuses and antifuses with a vertical dram process
04/10/2003US20030070149 Semiconductor integrated circuit having a plurality of circuit regions where different power supply voltages are used and method of manufacturing the same
04/10/2003US20030069654 Folded interposer
04/10/2003US20030069357 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom
04/10/2003US20030069349 Liquid epoxy resin composition and semiconductor device
04/10/2003US20030069331 Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
04/10/2003US20030068907 Hermetically sealed package
04/10/2003US20030068906 Connection components with anisotropic conductive material interconnection
04/10/2003US20030068885 Method of forming a contact plug for a semiconductor device
04/10/2003US20030068882 Method of manufacturing a contact plug for a semiconductor device
04/10/2003US20030068880 Method of manufacturing semiconductor device and semiconductor device
04/10/2003US20030068877 Circuit boards containing vias and methods for producing same
04/10/2003US20030068858 Integrated circuit fabrication dual plasma process with separate introduction of different gases into gas flow
04/10/2003US20030068853 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications
04/10/2003US20030068850 Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system
04/10/2003US20030068847 Semiconductor device and manufacturing method
04/10/2003US20030068843 Method of manufacturing semiconductor packaging
04/10/2003US20030068842 Method of manufacturing a semiconductor device
04/10/2003US20030068840 Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
04/10/2003US20030068835 Test wafer and method for producing the test wafer
04/10/2003US20030068537 Metal/ceramic circuit board
04/10/2003US20030068533 For use in moisture sensitive electronic and microelectronic devices such as screens containing electroluminescent materials
04/10/2003US20030068532 Metal/ceramic bonding article
04/10/2003US20030068522 Hillock-free aluminum wiring layer and method of forming the same
04/10/2003US20030068519 Method for assembly of complementary-shaped receptacle site and device microstructures
04/10/2003US20030068487 Crosslinkable rubber compound, amine resin and a thermally conductive filler
04/10/2003US20030068479 Enhancements in sheet processing and lead formation
04/10/2003US20030067757 Apparatus and method for shielding a device
04/10/2003US20030067755 Electronic component with flexible contacting pads and method for producing the electronic component
04/10/2003US20030067750 Wirebonded microelectronic packages including heat dissipation devices for heat removal from active surfaces thereof
04/10/2003US20030067749 Water cooled inverter
04/10/2003US20030067748 Water cooled inverter
04/10/2003US20030067746 Cooling device capable of contacting target with smaller urging force
04/10/2003US20030067730 Universial energy conditioning interposer with circuit architecture
04/10/2003US20030067313 Electronic device and coupler
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