Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/17/2003US20030070835 Printed circuit board having permanent solder mask
04/17/2003US20030070791 Heat sink module
04/17/2003US20030070790 Heat sink/clip assembly for chip mounted on electronic card
04/17/2003US20030070292 Circuit board, method for manufacturing same, and high-output module
04/17/2003US20030070265 Clip for holding a heat sink on an enclosure surrounding a CPU
04/17/2003DE20300336U1 Plastic film for integrated circuit boards comprises vertical metal wires which connect an integrated circuit to a conductor plate via soldered joints
04/17/2003DE10158374C1 HF oscillation prevention circuit for power semiconductor module uses inductors and capacitors for de-tuning oscillator provided by parallel semiconductors
04/17/2003CA2391492A1 Circuit board, method for manufacturing same, and high-output module
04/16/2003EP1303174A2 Method and apparatus for removing heat from a component
04/16/2003EP1303171A2 Electronic circuit unit suitable for miniaturization
04/16/2003EP1302983A1 Leadframe having slots in a die pad
04/16/2003EP1301945A1 Multi-metal layer circuit
04/16/2003EP1301942A1 Electronic chip component comprising an integrated circuit and a method for producing the same
04/16/2003EP1301827A1 Photolithographically-patterned out-of-plane coil structures and method of making
04/16/2003EP1210690B1 Electronic device comprising a chip fixed on a support and method for making same
04/16/2003EP1057871B1 Polyarylene sulfide resin composition for electronic part encapsulation
04/16/2003EP0948430A4 Super conducting heat transfer medium
04/16/2003CN2545705Y Heat radiator fin
04/16/2003CN2545704Y Full-insulation electric electronic recitifier bridge arm
04/16/2003CN2545677Y General serial bus rapid flash memory IC with memory card access interface
04/16/2003CN1411611A Metal-insulator-metal capacitor and method for producing same
04/16/2003CN1411610A Multilayer capacitor structure having array of concentric ring-shaped plates for deep sub-micron CMOS
04/16/2003CN1411608A Power transistor module, power amplifier and fabrication method thereof
04/16/2003CN1411589A Reinforced integrated circuit
04/16/2003CN1411497A Preparations containing fine particulate inorganic oxides
04/16/2003CN1411332A Multiple heat radiating module set
04/16/2003CN1411067A Semiconductor device and mfg. method thereof
04/16/2003CN1411062A Stacked semiconductor device
04/16/2003CN1411060A Semiconductor device and mfg. method thereof
04/16/2003CN1411058A Semiconductor device
04/16/2003CN1411057A Fixed fastener of radiator
04/16/2003CN1411056A Film substrate, semiconductor device, circuit substrate and mfg. method thereof
04/16/2003CN1411055A Wiring substrate for small electronic unit and mfg. method thereof
04/16/2003CN1411053A Low conductivity rosistor and counter fuse of breaking leakage
04/16/2003CN1411052A Semiconductor integrated circuit and mfg. method thereof
04/16/2003CN1411051A Method for mfg. semiconductor device and structure thereof
04/16/2003CN1411045A Semiconductor device
04/16/2003CN1411043A Method for mounting semiconductor element
04/16/2003CN1411010A Method for mfg. laminated ceramic electronic device, assembly electronic device and laminated ceramic electronic device
04/16/2003CN1410860A Heat dissipating module of notebook computer
04/16/2003CN1410854A 信息处理单元及其冷却方法 The information processing unit and its cooling method
04/16/2003CN1410792A Solid image testing device
04/16/2003CN1106046C Thermal processing apparatus for sheet-like workpieces
04/16/2003CN1106043C Semiconductor device and fabri cation process thereof
04/16/2003CN1106037C Assembling and disassembling device and head for integrated circuit
04/16/2003CN1106036C Producing method for chip type semiconductor device
04/16/2003CN1106032C Method for fabricating semiconductor device
04/16/2003CN1106030C Method for increasing capacity of metal to resist fluorine and IC structure
04/15/2003US6550039 Circuit design method for designing conductive members with a multilayered structure to have antenna sized of proper values
04/15/2003US6549766 System and method for on-chip filter tuning
04/15/2003US6549421 Stackable ball grid array package
04/15/2003US6549413 Tape ball grid array semiconductor package structure and assembly process
04/15/2003US6549411 Flexible heat sinks and method of attaching flexible heat sinks
04/15/2003US6549410 Heatsink mounting system
04/15/2003US6549408 CPU cooling device using thermo-siphon
04/15/2003US6549407 Heat exchanger retention mechanism
04/15/2003US6549404 Semiconductor module apparatus and cooling apparatus
04/15/2003US6549250 Structure capable of preventing damage caused by static electricity
04/15/2003US6549114 Protection of electrical devices with voltage variable materials
04/15/2003US6549077 Integrated inductor for RF transistor
04/15/2003US6549063 Evaluation circuit for an anti-fuse
04/15/2003US6549028 Configuration and process for testing a multiplicity of semiconductor chips on a wafer plane
04/15/2003US6548912 Semicoductor passivation using barrier coatings
04/15/2003US6548911 Multimedia chip package
04/15/2003US6548910 Integrated circuit element, printed circuit board and electronic device having input/output terminals for testing and operation
04/15/2003US6548909 Method of interconnecting electronic components using a plurality of conductive studs
04/15/2003US6548907 Semiconductor device having a matrix array of contacts and a fabrication process thereof
04/15/2003US6548906 Method for reducing a metal seam in an interconnect structure and a device manufactured thereby
04/15/2003US6548905 Semiconductor device having multi-layer copper line and method of forming the same
04/15/2003US6548904 Reliable; high yield; reduced interconnect breakage
04/15/2003US6548903 Semiconductor integrated circuit
04/15/2003US6548902 Semiconductor integrated circuit device, circuit design apparatus, and circuit design method
04/15/2003US6548901 Cu/low-k BEOL with nonconcurrent hybrid dielectric interface
04/15/2003US6548900 Semiconductor device and fabrication method thereof
04/15/2003US6548899 Decontaminated, demoisturized cured dielectric films
04/15/2003US6548898 External connection terminal and semiconductor device
04/15/2003US6548897 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
04/15/2003US6548896 Method of reducing shear stresses on IC chips and structure formed thereby
04/15/2003US6548895 Packaging of electro-microfluidic devices
04/15/2003US6548894 Reliable, efficient; eliminates wiring outside module
04/15/2003US6548893 Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages
04/15/2003US6548892 Low k dielectric insulator and method of forming semiconductor circuit structures
04/15/2003US6548891 Semiconductor device and production process thereof
04/15/2003US6548890 Press-contact type semiconductor device
04/15/2003US6548889 Hydrogen getter for integrated microelectronic assembly
04/15/2003US6548887 Wire bond pad
04/15/2003US6548883 Reduced RC between adjacent substrate wiring lines
04/15/2003US6548882 Power transistor cell
04/15/2003US6548881 Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products
04/15/2003US6548879 Semiconductor device having heat detecting element and insulating cavity and method of manufacturing the same
04/15/2003US6548873 Semiconductor device and manufacturing method of the same
04/15/2003US6548871 Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer
04/15/2003US6548869 Voltage limiting protection for high frequency power device
04/15/2003US6548847 Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal film
04/15/2003US6548845 Having a capacitor over bit line structure; dielectric prevents wiring from being oxidized
04/15/2003US6548827 Electroconductivity; positioning; accuracy
04/15/2003US6548765 Mounting structure of electronic component on substrate board
04/15/2003US6548759 Pre-drilled image sensor package
04/15/2003US6548757 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
04/15/2003US6548620 Epoxy resin composition and process for producing the same