Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/23/2003CN1412842A Lead frame and method for manufacturing semiconductor device using said lead frame
04/23/2003CN1412841A Lead frame and method for manufacturing said lead frame
04/23/2003CN1412840A Flexible radiating device
04/23/2003CN1412839A Radiating method and its structure
04/23/2003CN1412838A High frequency semiconductor device
04/23/2003CN1412837A 电子元件 Electronic component
04/23/2003CN1412836A Circuit board and its manufacturing method and high output module
04/23/2003CN1412835A Method for mfg. semiconductor device
04/23/2003CN1412796A Cross capacitor with spherical grid array terminals
04/23/2003CN1412786A Method for making semiconductor packaging conductor and its product
04/23/2003CN1411986A Distinguished parts for calibration, and method for making other devices therewith
04/23/2003CN1106692C Photosensor
04/23/2003CN1106691C Packaging for stacked semiconductor chip and its producing method
04/23/2003CN1106690C Semiconductor packaging and its socket
04/23/2003CN1106689C Semiconductor package lead deflash method
04/23/2003CN1106688C Interconnection structure for integrated circuit and forming method thereof
04/23/2003CN1106576C Top load socket for ball grid array devices
04/23/2003CN1106418C Sealant use in welding flux connecting piece of sealed electron package device and sealing method
04/22/2003US6553545 Process parameter extraction
04/22/2003US6553332 Process control; inexpensive, fast, reliable, accurate
04/22/2003US6553277 Method and apparatus for vacuum treatment
04/22/2003US6553274 Simultaneously patterning interconnection and dummy layers; uniform thickness and flatting insulating film
04/22/2003US6552910 Interface coupling; durable; low cost
04/22/2003US6552907 BGA heat ball plate spreader, BGA to PCB plate interface
04/22/2003US6552906 Radiator for electronic parts, electronic device, electric circuit device, and computer
04/22/2003US6552905 Heat sink retention apparatus
04/22/2003US6552903 Electronic module
04/22/2003US6552902 Turbinate heat sink
04/22/2003US6552901 Apparatus and system for cooling electronic circuitry, heat sinks, and related components
04/22/2003US6552883 Devices comprising thin films having temperature-independent high electrical conductivity and methods of making same
04/22/2003US6552564 Technique to reduce reflections and ringing on CMOS interconnections
04/22/2003US6552527 Wafer map display apparatus and method for semiconductor test system
04/22/2003US6552438 Crack free
04/22/2003US6552437 Semiconductor device and method of manufacture thereof
04/22/2003US6552436 Nonsoldermask defined bonding pads; attaching to printed circuit board with improved bending reliability and temperature cycling tolerance
04/22/2003US6552435 Integrated circuit with conductive lines disposed within isolation regions
04/22/2003US6552434 Semiconductor device and manufacturing method thereof
04/22/2003US6552433 Contact pad structures that resist intermetal dielectric cracking and increase circuit density on integrated circuit chips
04/22/2003US6552432 Mask on a polymer having an opening width less than that of the opening in the polymer
04/22/2003US6552430 Ball grid array substrate with improved traces formed from copper based metal
04/22/2003US6552428 Semiconductor package having an exposed heat spreader
04/22/2003US6552427 BGA package and method of fabrication
04/22/2003US6552426 Semiconductor device and method of manufacturing same
04/22/2003US6552425 Integrated circuit package
04/22/2003US6552423 Higher-density memory card
04/22/2003US6552421 Semiconductor device and a method of manufacturing the same
04/22/2003US6552420 Redundant pinout configuration for signal enhancement in IC packages
04/22/2003US6552419 Semiconductor device and liquid crystal module using the same
04/22/2003US6552418 Resin-encapsulated semiconductor device
04/22/2003US6552417 Molded plastic package with heat sink and enhanced electrical performance
04/22/2003US6552416 Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
04/22/2003US6552409 Techniques for addressing cross-point diode memory arrays
04/22/2003US6552360 Plurality of strips for uniform polishing pressure
04/22/2003US6552267 Microelectronic assembly with stiffening member
04/22/2003US6552266 High performance chip packaging and method
04/22/2003US6552264 High performance chip packaging and method
04/22/2003US6551949 Vapor deposition; overcoating semiconductor substrate
04/22/2003US6551934 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device
04/22/2003US6551931 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
04/22/2003US6551921 Method of polishing a stack of dielectric layers including a fluorine containing silicon oxide layer
04/22/2003US6551920 Semiconductor device and fabrication method thereof
04/22/2003US6551918 Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment
04/22/2003US6551916 Bond-pad with pad edge strengthening structure
04/22/2003US6551912 Method of forming a conductive coating on a semiconductor device
04/22/2003US6551905 Wafer adhesive for semiconductor dry etch applications
04/22/2003US6551894 Stacked capacitor-type semiconductor storage device and manufacturing method thereof
04/22/2003US6551872 Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
04/22/2003US6551864 Fuse for use in a semiconductor device, and semiconductor devices including the fuse
04/22/2003US6551862 Semiconductor device and method of manufacturing the same
04/22/2003US6551861 Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
04/22/2003US6551859 Chip scale and land grid array semiconductor packages
04/22/2003US6551858 Method of producing a semiconductor device having two semiconductor chips sealed by a resin
04/22/2003US6551856 Method for forming copper pad redistribution and device formed
04/22/2003US6551854 Semiconductor device having bump electrodes and method of manufacturing the same
04/22/2003US6551846 Semiconductor memory device capable of correctly and surely effecting voltage stress acceleration
04/22/2003US6551844 Test assembly including a test die for testing a semiconductor product die
04/22/2003US6551676 Silicone-based adhesive sheet method for manufacturing same and semiconductor device
04/22/2003US6551449 Thin electronic circuit component and method and apparatus for producing the same
04/22/2003US6551442 Method of producing semiconductor device and system for producing the same
04/22/2003US6551427 Method for manufacturing ceramic substrate and non-fired ceramic substrate
04/22/2003US6551114 Semiconductor device having signal contacts and high current power contacts
04/22/2003US6550732 Heat sink retention technique
04/22/2003US6550666 Method for forming a flip chip on leadframe semiconductor package
04/22/2003US6550664 Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
04/22/2003US6550531 Vapor chamber active heat sink
04/22/2003US6550529 Heatsink device
04/22/2003US6550263 Spray cooling system for a device
04/22/2003US6550136 Method of fabricating printed wiring board
04/17/2003WO2003032697A1 Electronic parts
04/17/2003WO2003032695A1 Electrical circuit and method of formation
04/17/2003WO2003032408A1 Phonon-blocking, electron-transmitting low-dimensional structures
04/17/2003WO2003032391A2 Method for forming a package for electronic components and package for electronic components
04/17/2003WO2003032390A2 Device with power semiconductor components for controlling the power of high currents and use of said device
04/17/2003WO2003032389A1 Voltage conversion module
04/17/2003WO2003032388A1 Semiconductor device package with improved cooling
04/17/2003WO2003032387A1 Electrical or electronic component and method of producing same
04/17/2003WO2003032386A1 High-frequency module board device
04/17/2003WO2003032385A1 High frequency ic package, high frequency unit using it, and method for manufacturing the same
04/17/2003WO2003032370A2 Stacked packages
04/17/2003WO2003031994A1 Socket and contact of semiconductor package
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