Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2003
04/24/2003US20030077871 Fabrication of on-package and on-chip structure using build-up layer process
04/24/2003US20030077853 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
04/24/2003US20030077846 Positioning arrangement and method
04/24/2003US20030077478 Thermal interface material and electronic assembly having such a thermal interface material
04/24/2003US20030077449 Thermal management system
04/24/2003US20030077418 Stereolithographically marked semiconductor devices and methods
04/24/2003US20030077346 Encapsulation using microcellular foamed materials
04/24/2003US20030076715 Semiconductor memory device
04/24/2003US20030076666 Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
04/24/2003US20030076665 Electrical device allowing for increased device densities
04/24/2003US20030076663 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
04/24/2003US20030076660 Electronic device and a circuit arrangement
04/24/2003US20030076659 Multilayer RF amplifier module
04/24/2003US20030076645 ESD protection circuit for mixed-voltage I/O ports using substrated triggering
04/24/2003US20030076639 High ESD stress sustaining ESD protection circuit
04/24/2003US20030076636 On-chip ESD protection circuit with a substrate-triggered SCR device
04/24/2003US20030076565 Optical communication module
04/24/2003US20030076489 Pattern for improved visual inspection of semiconductor devices
04/24/2003US20030076173 Multi-stage, high frequency, high power signal amplifier
04/24/2003US20030076010 Apparatus having an electronic component located on a surface of a package member with a space therebetween
04/24/2003US20030075812 Package of semiconductor chip with array-type bonding pads
04/24/2003US20030075810 Method of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and integrated circuits
04/24/2003US20030075808 Semiconductor device, method for manufacturing the same, and plating solution
04/24/2003US20030075807 Interconnect structure with a cap layer on an IMD layer and a method of formation thereof
04/24/2003US20030075805 Corrosion-resistant electrode structure for integrated circuit decoupling capacitors
04/24/2003US20030075804 Wirebond structure and method to connect to a microelectronic die
04/24/2003US20030075803 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
04/24/2003US20030075802 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
04/24/2003US20030075801 Semiconductor device having line-and-space pattern group
04/24/2003US20030075798 Transcribing original substrate for a wiring pattern
04/24/2003US20030075797 Semiconductor device and method of manufacturing the same
04/24/2003US20030075796 Semiconductor device
04/24/2003US20030075795 Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device
04/24/2003US20030075794 Miniaturized device to protect the mechanical and electrical components of the Micro-Electromechanical System
04/24/2003US20030075793 Enhancement in throughput and planarity during cmp using a dielectric stack containing an hdp oxide
04/24/2003US20030075792 Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same
04/24/2003US20030075791 Semiconductor device
04/24/2003US20030075789 Semiconductor storage device having memory chips in a stacked structure
04/24/2003US20030075788 Stacked semiconductor package and fabricating method thereof
04/24/2003US20030075787 Mechanical support system for a thin package
04/24/2003US20030075786 Thin, thermally enhanced flip chip in a leaded molded package
04/24/2003US20030075785 Packaging high power integrated circuit devices
04/24/2003US20030075784 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element
04/24/2003US20030075783 Semiconductor device
04/24/2003US20030075782 Multi-layer lead frame for a semiconductor device
04/24/2003US20030075781 Chip-packaging substrate
04/24/2003US20030075764 Monolithic inductance-enhancing integrated circuits, complementary metal oxide semiconductor (cmos) inductance-enhancing integrated circuits, inductor assemblies, and inductance-multiplying methods
04/24/2003US20030075763 Hybrid diodes with excellent ESD protection capacity
04/24/2003US20030075762 Arrangements to reduce charging damage in structures of integrated circuits
04/24/2003US20030075752 Semiconductor device and method for manufacturing the same
04/24/2003US20030075744 Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer
04/24/2003US20030075743 Crosstalk reduction in a crosspoint thyristor switching array using a shielded dielectric stack
04/24/2003US20030075741 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
04/24/2003US20030075732 Shunt resistor configuration
04/24/2003US20030075728 Semiconductor device and method of manufacturing the same
04/24/2003US20030075727 Compound semiconductor device and method for controlling characteristics of the same
04/24/2003US20030075358 Microelectronic assembly formation with releasable leads
04/24/2003US20030075357 Structure of a ball-grid array package substrate and processes for producing thereof
04/24/2003US20030075356 Electronic device and method of manufacturing the same
04/24/2003US20030075311 Method for processing fluid flows in a micro component reformer system
04/24/2003US20030075274 Wafer support system
04/24/2003US20030074912 Semiconductor equipment and refrigerator
04/24/2003US20030074789 Modified pad for copper/low-k
04/24/2003DE20302732U1 Cooling system for a CPU has a metal heat sink with a coupled contact plate for the CPU
04/24/2003DE20302201U1 Cooling system for semiconductors has flow passage formed to provide uniform effect
04/24/2003DE20300303U1 Passive cooling of electronic processors relies direct contact and natural convection
04/24/2003DE10151379C1 Manufacturing integrated semiconducting circuit involves implementing short, wide range wiring in same metallization plane, showing each different form on different layer type drawing
04/23/2003EP1304909A1 High-frequency semiconductor device
04/23/2003EP1304796A1 Saw device
04/23/2003EP1304768A2 Spring structure
04/23/2003EP1304742A2 Component built-in module and method for producing the same
04/23/2003EP1304741A1 Rectangular contact used as a low voltage fuse element.
04/23/2003EP1304740A2 Circuit board, method for manufacturing same, and high-output module
04/23/2003EP1304739A1 Semiconductor device and method for fabricating the same
04/23/2003EP1304736A1 Semiconductor memory circuitry
04/23/2003EP1304543A1 Positioning with conductive indicia ( silicon optical bench )
04/23/2003EP1303898A2 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
04/23/2003EP1303880A2 Method for applying adjusting marks on a semiconductor disk
04/23/2003EP1303879A2 Electronic component and method of manufacture
04/23/2003EP1303878A2 Heat exchanger having silicon nitride substrate for mounting high power electronic components
04/23/2003EP1303876A2 Method of forming copper interconnect capping layers with improved interface and adhesion
04/23/2003EP1192592B1 Device and method for making devices comprising at least a chip fixed on a support
04/23/2003EP1177641A4 Energy conditioning circuit assembly
04/23/2003EP1138070B1 Low alpha emissive solder bumps
04/23/2003EP0864184B1 Device with circuit element and transmission line
04/23/2003CN2547097Y Hligh-density radiating fin
04/23/2003CN2547005Y Thick film circuit board with new pin
04/23/2003CN2547004Y Radiator of CPU
04/23/2003CN2547003Y Multi-opening high-efficiency electroinc element radiating module
04/23/2003CN2547002Y Surface sticking light gathering cup structure for holding optical chip
04/23/2003CN2546932Y 散热器 Heat sink
04/23/2003CN2546931Y Radiator fastening apparatus
04/23/2003CN2546838Y Fastening of radiator
04/23/2003CN1413077A Vehicle-mounted electronic equipment
04/23/2003CN1413076A 连接机构 Connecting mechanism
04/23/2003CN1412850A Three-D integrated memory
04/23/2003CN1412846A Static discharge protective circuit with function of controlling latchdown
04/23/2003CN1412845A Semiconductor device and its mfg. method
04/23/2003CN1412844A Semiconductor integrated circuit device and its manufacturing method
04/23/2003CN1412843A Lead frame, its manufacturing method and manufacturing method of semiconductor device using lead frame
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