Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/01/2003US20030080439 Delamination-preventing substrate and semiconductor package with the same
05/01/2003US20030080438 Semiconductor module
05/01/2003US20030080436 Such as personal computer or goggle display; an aperture portion is formed in the dielectric film, the electrode or the semiconductor layer is formed in the aperture portion; achieves smoothing without using special means
05/01/2003US20030080435 Shapes-based migration of aluminum designs to copper damascene
05/01/2003US20030080434 Solid image-pickup device and method for manufacturing the solid image pickup device
05/01/2003US20030080433 Semiconductor device
05/01/2003US20030080432 Semiconductor device having a ground plane and manufacturing method thereof
05/01/2003US20030080431 Electroplating copper through mask openings and onto the seed layer, while mechanically sweeping the surface of the masking layer to form planar conductive material deposits filling the holes in the masking layer; flat nail head structure
05/01/2003US20030080430 Creating cavities that are structured in submicrometer dimensions in a cavity layer of a semiconductor device by polymerization
05/01/2003US20030080429 Semiconductor device
05/01/2003US20030080428 Semiconductor device
05/01/2003US20030080426 Method and device for reducing the contact resistance in organic field-effect transistors by embedding nanoparticles to produce field boosting
05/01/2003US20030080425 Compliant relief wafer level packaging
05/01/2003US20030080423 CD BGA package and a fabrication method thereof
05/01/2003US20030080422 Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment
05/01/2003US20030080421 Semiconductor device, its manufacturing process, and its inspecting method
05/01/2003US20030080420 Bumps formed on the pads, wherein each of the bumps is a single layer disposed on a part of each of the pads exposed from the passivation film, and on the passivation film; bump formed by electroless plating
05/01/2003US20030080419 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
05/01/2003US20030080418 Semiconductor device having power supply pads arranged between signal pads and substrate edge
05/01/2003US20030080417 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
05/01/2003US20030080416 Sub-milliohm on-chip interconnection
05/01/2003US20030080413 Liquid immersion cooling for semiconductor device
05/01/2003US20030080412 Semiconductor device and method of manufacturing the same
05/01/2003US20030080411 Semiconductor package having thermal interface material (TIM)
05/01/2003US20030080410 Semiconductor device and method for manufacturing same
05/01/2003US20030080409 Multilayered substrate for semiconductor device
05/01/2003US20030080408 Method for fabricating semiconductor components and interconnects with contacts on opposing sides
05/01/2003US20030080407 Method of monitoring internal voltage and controlling a parameter of an integrated circuit
05/01/2003US20030080406 Power gridding scheme
05/01/2003US20030080405 Semiconductor device and method for producing the same
05/01/2003US20030080404 Semiconductor device and manufacturing method thereof
05/01/2003US20030080403 Apparatus and method for leadless packaging of semiconductor devices
05/01/2003US20030080402 Chip scale package with heat spreader and method of manufacture
05/01/2003US20030080401 Interconnection of active and passive components in substrate
05/01/2003US20030080400 Semiconductor system-in-package
05/01/2003US20030080399 Transfer wafer level packaging
05/01/2003US20030080398 Packaged integrated circuits and methods of producing thereof
05/01/2003US20030080396 Lead frame for fabricating surface mount type semiconductor devices with high reliability
05/01/2003US20030080393 Encapsulated energy-dissipative fuse for integrated circuits and method of making the same
05/01/2003US20030080392 Bumpless wafer scale device and board assembly
05/01/2003US20030080385 Silicon on insulator device and layout method of the same
05/01/2003US20030080378 Semiconductor component, trench structure transistor, trench MOSFET, IGBT, and field-plate transistor
05/01/2003US20030080364 Semiconductor device and method of manufacturing the same
05/01/2003US20030080360 Wafer treatment method for protecting fuse box of semiconductor chip
05/01/2003US20030080359 Structure with through hole, production method thereof, and liquid discharge head
05/01/2003US20030080357 Integrated circuit with internal signals immune from noises and manufacturing method thereof
05/01/2003US20030080353 Semiconductor device and an electronic device
05/01/2003US20030080349 Power amplifier with base and collector straps
05/01/2003US20030080334 Semiconductor device having test element and method of testing using same
05/01/2003US20030080316 Semiconductor device
05/01/2003US20030080266 Heat sink retention technique
05/01/2003US20030079908 Hole grid array package and socket technology
05/01/2003US20030079895 Lead frame of optical coupling device and manufacturing method of same
05/01/2003US20030079865 Heat transferring device having adiabatic unit
05/01/2003US20030079863 Cooling apparatus boiling and condensing refrigerant with improved tunnel structure
05/01/2003US20030079862 Notched finned heat sink structure
05/01/2003US20030079861 Heatsink and heatsink device using the heatsink
05/01/2003US20030079860 Cooling element
05/01/2003US20030079859 Arrayed fin cooler
05/01/2003US20030079734 Apparatus for removing tiebars after molding of semiconductor chip
05/01/2003US20030079680 Method for mounting a semiconductor device
05/01/2003CA2464108A1 Pattern for improved visual inspection of semiconductor devices
04/2003
04/30/2003DE20301227U1 Cooling elements for electronic systems uses turbulence to improve cooling effect
04/30/2003DE20120695U1 Fastening clamp for electric or electronic element to cooler
04/30/2003CN2548395Y Radiating fin structure improvement
04/30/2003CN2548263Y Optical element packing case
04/30/2003CN2548261Y 集成电路芯片模组 IC chip module
04/30/2003CN1415117A Adhesive film for semiconductor, leadframe using the same, semiconductor device and its manufacturing method
04/30/2003CN1414827A Substrate conducting wiring cutting method and device, electronic device manufacturing method and device
04/30/2003CN1414821A Circuit base board having high quality rate
04/30/2003CN1414678A Electrostatic discharge protective circuit using base trigger silicon rectifier
04/30/2003CN1414643A Packaged structure of display element and its packaging method
04/30/2003CN1414637A Nonvolatile semiconductor memory and its manufacturing method
04/30/2003CN1414633A Electronic electrostatic discharge protection device and its manufacturing method
04/30/2003CN1414630A Semiconductor chip and wiring base plate and manufactaring method, semiconductor chip, semiconductor device
04/30/2003CN1414629A Lead frame, its manufacturing method and manufacturing method for semiconductor device using it
04/30/2003CN1414628A Integrated heat dissipation device
04/30/2003CN1107365C Photoelectric element module with Peltier device
04/30/2003CN1107349C Semiconductor device lead frame and lead bonding
04/30/2003CN1107336C Multi-layer circuit substrate and mfg. method thereof
04/29/2003US6557155 Layout design method
04/29/2003US6556752 Dual thermoelectric cooler optoelectronic package and manufacture process
04/29/2003US6556658 Method for adding redundant vias on VLSI chips
04/29/2003US6556455 Ultra-low impedance power interconnection system for electronic packages
04/29/2003US6556454 High density contact arrangement
04/29/2003US6556453 Electronic circuit housing with trench vias and method of fabrication therefor
04/29/2003US6556443 Heat dissipation device coupling structure
04/29/2003US6556442 CPU cooling structure
04/29/2003US6556439 Cooling unit for cooling heat generating component and electronic apparatus equipped with the cooling unit
04/29/2003US6556420 Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board
04/29/2003US6556416 Variable capacitor and a variable inductor
04/29/2003US6556409 Integrated circuit including ESD circuits for a multi-chip module and a method therefor
04/29/2003US6555925 Semiconductor device and producing method thereof
04/29/2003US6555924 Positioning flash preventing mechanism in front of entry of an air vent, then mounting semiconductor chip, then encapsulating with a mold which rapidly absorbs heat and has increased viscosity
04/29/2003US6555923 Semiconductor chip having pads with plural junctions for different assembly methods
04/29/2003US6555922 IC bonding pad combined with mark or monitor
04/29/2003US6555921 Semiconductor package
04/29/2003US6555920 Vertical electronic circuit package
04/29/2003US6555919 Low profile stack semiconductor package
04/29/2003US6555918 Stacked semiconductor device including improved lead frame arrangement
1 ... 1652 1653 1654 1655 1656 1657 1658 1659 1660 1661 1662 1663 1664 1665 1666 1667 1668 1669 1670 1671 1672 ... 2262