Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/06/2003US6558990 SOI substrate, method of manufacture thereof, and semiconductor device using SOI substrate
05/06/2003US6558983 Semiconductor apparatus and method for manufacturing the same
05/06/2003US6558982 Semiconductor device manufacturing method and mold die
05/06/2003US6558981 Method for making an encapsulated semiconductor chip module
05/06/2003US6558980 Plastic molded type semiconductor device and fabrication process thereof
05/06/2003US6558979 Use of palladium in IC manufacturing with conductive polymer bump
05/06/2003US6558977 Semiconductor device and method for fabricating the same
05/06/2003US6558976 Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture
05/06/2003US6558966 Apparatus and methods of packaging and testing die
05/06/2003US6558859 Method of checking pattern measurement and image recognition assisting pattern
05/06/2003US6558836 Structure of thin-film lithium microbatteries
05/06/2003US6558821 Ceramic sinter, and wear resistant member and electronic component member using thereof
05/06/2003US6558812 Liquid epoxy resin composition and semiconductor device
05/06/2003US6558791 Heat-resistant adhesive sheet
05/06/2003US6558617 A copper alloy for use in electric and electronic parts comprising: Nickel: 0.1 to 1.0 mass %, iron: 0.01 to 0.3 mass %, Phosphoru: 0. 03 to 0.2 mass %, zinc 0.01 to 1.5 mass %, silicon 0.01 mass % or less, magnesium 0.001 mass %
05/06/2003US6558560 Method for the fabrication of electrical contacts
05/06/2003US6558500 Method of producing a lead frame with composite film attached, and use of the lead frame
05/06/2003US6558169 Shunt power connection for an integrated circuit package
05/06/2003US6557978 Inkjet device encapsulated at the wafer scale
05/06/2003US6557769 Smart card module, smart card with the smart card module, and method for producing the smart card module
05/06/2003US6557675 Tunable vibration damper for processor packages
05/06/2003US6557626 Heat sink retainer and Heat sink assembly using same
05/06/2003US6557625 Heat sink assembly with pivotable clip
05/06/2003US6557253 Method of making components with releasable leads
05/06/2003CA2321868C Method for controlling ic handler and control system using the same
05/02/2003EP1307078A2 High frequency circuit module
05/02/2003EP1306902A1 High-frequency module and its manufacturing method
05/02/2003EP1306901A2 Systems and methods for electrically isolating portions of wafers
05/02/2003EP1306900A2 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates
05/02/2003EP1306899A1 Wiring method and element arranging method using the same, and method of producing image display devices
05/02/2003EP1306898A1 Sub-milliohm on-chip interconnection
05/02/2003EP1306681A2 Method and system to determine the high frequency rate of active circuit elements
05/02/2003EP1306466A2 Electroless gold plating composition
05/02/2003EP1305838A2 Low-temperature fabrication of thin-film energy-storage devices
05/02/2003EP1305830A2 Electronic assembly comprising interposer with embedded capacitors and methods of manufacture
05/02/2003EP1305829A1 Solder bar for high power flip chips
05/02/2003EP1305824A1 Method of making electronic materials
05/02/2003EP1305808A1 Integrated inductor
05/02/2003EP1305700A1 Computer having cooling apparatus and heat exchanging device of the cooling apparatus
05/02/2003EP0879479B1 Separable connecting bridge (fuse) and connectable line interruption (anti-fuse) and process for producing and activating a fuse and an anti-fuse
05/01/2003WO2003037054A1 Power delivery system for integrated circuits utilizing discrete capacitors
05/01/2003WO2003037053A1 Chip scale stacking system and method
05/01/2003WO2003037048A1 Multilayer rf amplifier module
05/01/2003WO2003036719A2 Micro- or nano-electronic component comprising a power source and means for protecting the power source
05/01/2003WO2003036718A2 Pattern for improved visual inspection of semiconductor devices
05/01/2003WO2003036717A1 Thin thermally enhanced flip chip in a leaded molded package
05/01/2003WO2003036716A1 Multi-stage, high frequency, high power signal amplifier
05/01/2003WO2003036715A2 Adhesive wafers for die attach application
05/01/2003WO2003036713A1 Digital signal transmission circuit and method of designing it
05/01/2003WO2003036711A2 Fill pattern generation for spin-on glass and related self-planarization deposition
05/01/2003WO2003036710A1 Bonding wire
05/01/2003WO2003036228A1 Balancing planarization of layers and the effect of underlying structure on the metrology signal
05/01/2003WO2003035763A1 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device
05/01/2003WO2003035762A1 Curable liquid silicone composition and a semiconductor device prepared using the composition
05/01/2003WO2003005438A3 Improved metal barrier behavior by sic:h deposition on porous materials
05/01/2003WO2002103268A3 Multi-purpose microchannel micro-component
05/01/2003WO2002101830A3 Electronic components with plurality of contoured microelectronic spring contacts
05/01/2003WO2002091432A3 Microelectronic structure comprising a hydrogen barrier layer
05/01/2003WO2002061825A8 Electronic assembly with high capacity thermal interface and methods of manufacture
05/01/2003WO2002023625A8 Semiconductor device and fabrication method therefor
05/01/2003US20030082934 IC socket
05/01/2003US20030082925 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
05/01/2003US20030082906 Plating pillars (photoresists) on bottom metal layer, coating over with polymer, curing, then blanket etching
05/01/2003US20030082901 Void formation monitoring in a damascene process
05/01/2003US20030082898 Ball grid array X-ray orientation mark
05/01/2003US20030082897 Method for forming bumps, semiconductor device, and solder paste
05/01/2003US20030082890 Fan out of interconnect elements attached to semiconductor wafer
05/01/2003US20030082856 Method and apparatus for a semiconductor package for vertical surface mounting
05/01/2003US20030082855 for members meeting a proper combination condition by marking inherent information on surface of a member constituting the assembly in advance and by utilizing the information; present invention can be applied to an exhaust catalyst carrier
05/01/2003US20030082854 Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same
05/01/2003US20030082852 Flip chip package and method for forming the same
05/01/2003US20030082851 Back-side through-hole interconnection of a die to a substrate
05/01/2003US20030082849 Adhesion enhanced semiconductor die for mold compound packaging
05/01/2003US20030082848 Semiconductor device and manufacturing method
05/01/2003US20030082847 Method and apparatus for wafer thinning
05/01/2003US20030082846 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
05/01/2003US20030082845 Package for multiple integrated circuits and method of making
05/01/2003US20030082836 Stress migration test structure and method therefor
05/01/2003US20030082398 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film
05/01/2003US20030082393 Graphite impregnated with molten metal
05/01/2003US20030082356 Metal filling method and member with filled metal sections
05/01/2003US20030082296 Vapor deposition using metal halide; removal by-products; using scavenger
05/01/2003US20030081443 Semiconductor memory device adaptable to various types of packages
05/01/2003US20030081392 Integrated circuit stacking system and method
05/01/2003US20030081390 IC chip package
05/01/2003US20030081385 Heat radiating structure for electronic device
05/01/2003US20030081383 Composite fins for heatsinks
05/01/2003US20030081382 Thermal module
05/01/2003US20030081371 Capacitor and method for fabricating the same
05/01/2003US20030081363 ESD protection device and method of manufacturing the device
05/01/2003US20030081136 Image capturing device
05/01/2003US20030081077 Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing LCD, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit
05/01/2003US20030080836 High frequency circuit module
05/01/2003US20030080819 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
05/01/2003US20030080773 Increasing implicit decoupling capacitance using asymmetric shieldings
05/01/2003US20030080770 Method for universal wafer carrier for wafer level die burn-in
05/01/2003US20030080766 Integrated circuit having stress migration test structure and method therefor
05/01/2003US20030080761 Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
05/01/2003US20030080441 Flip chip integrated package mount support
05/01/2003US20030080440 White contrast layer on an upper surface of a black encapsulant; a mark extends through the white contrast layer such that the black encapsulant is visible through the mark; use as advertisement or identification of electronic packages
1 ... 1651 1652 1653 1654 1655 1656 1657 1658 1659 1660 1661 1662 1663 1664 1665 1666 1667 1668 1669 1670 1671 ... 2262