| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/09/2014 | US20140008809 Die up fully molded fan-out wafer level packaging |
| 01/09/2014 | US20140008808 Method for fabricating a semiconductor device with formation of conductive lines |
| 01/09/2014 | US20140008807 Semiconductor constructions and methods of forming semiconductor constructions |
| 01/09/2014 | US20140008806 Stair step formation using at least two masks |
| 01/09/2014 | US20140008805 Component and Method of Manufacturing a Component Using an Ultrathin Carrier |
| 01/09/2014 | US20140008804 Copper interconnects separated by air gaps and method of making thereof |
| 01/09/2014 | US20140008803 Plasma-enhanced atomic layer deposition of conductive material over dielectric layers |
| 01/09/2014 | US20140008802 Cost-Effective TSV Formation |
| 01/09/2014 | US20140008801 Submicron connection layer and method for using the same to connect wafers |
| 01/09/2014 | US20140008800 Method for manufacturing through substrate via (tsv), structure and control method of tsv capacitance |
| 01/09/2014 | US20140008799 Method for fabricating metal line and device with metal line |
| 01/09/2014 | US20140008798 Semiconductor device |
| 01/09/2014 | US20140008797 Semiconductor packages and methods of forming the same |
| 01/09/2014 | US20140008796 Semiconductor package and method for fabricating the same |
| 01/09/2014 | US20140008795 Semiconductor package and method of fabricating the same |
| 01/09/2014 | US20140008794 Substrate of semiconductor package and method of fabricating semiconductor package using the same |
| 01/09/2014 | US20140008793 Semiconductor device |
| 01/09/2014 | US20140008792 Semiconductor Device and Method of Forming Bump-on-Lead Interconnection |
| 01/09/2014 | US20140008791 Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure |
| 01/09/2014 | US20140008790 Stackable molded microelectronic packages |
| 01/09/2014 | US20140008789 Semiconductor package, semiconductor device having the same, and method of manufacturing the same |
| 01/09/2014 | US20140008788 Non-circular under bump metallization (ubm) structure, orientation of non-circular ubm structure and trace orientation to inhibit peeling and/or cracking |
| 01/09/2014 | US20140008787 Conductive bump structure and method of fabricating a semiconductor structure |
| 01/09/2014 | US20140008786 Bump-on-trace packaging structure and method for forming the same |
| 01/09/2014 | US20140008785 Package Redistribution Layer Structure and Method of Forming Same |
| 01/09/2014 | US20140008784 Stackable semiconductor assemblies and methods of manufacturing such assemblies |
| 01/09/2014 | US20140008783 Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape |
| 01/09/2014 | US20140008782 Semiconductor unit |
| 01/09/2014 | US20140008781 Semiconductor unit |
| 01/09/2014 | US20140008780 Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same |
| 01/09/2014 | US20140008779 Wafer level package, chip size package device and method of manufacturing wafer level package |
| 01/09/2014 | US20140008778 Photonic semiconductor devices in llc assembly with controlled molding boundary and method for forming same |
| 01/09/2014 | US20140008777 Thermal leadless array package with die attach pad locking feature |
| 01/09/2014 | US20140008776 Chip package and method of manufacturing the same |
| 01/09/2014 | US20140008775 Semiconductor device |
| 01/09/2014 | US20140008774 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof |
| 01/09/2014 | US20140008772 Semiconductor devices and methods of fabricating the same |
| 01/09/2014 | US20140008760 Hybrid-core through holes and vias |
| 01/09/2014 | US20140008759 Fuse of semiconductor device and method for forming the same |
| 01/09/2014 | US20140008757 Integrating through substrate vias from wafer backside layers of integrated circuits |
| 01/09/2014 | US20140008756 Deep trench heat sink |
| 01/09/2014 | US20140008702 Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof |
| 01/09/2014 | US20140008693 Light-emitting device and lead frame strip |
| 01/09/2014 | US20140008674 Mounting substrate and optical unit |
| 01/09/2014 | US20140008652 Through-substrate via structure |
| 01/09/2014 | US20140008419 Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same joint |
| 01/09/2014 | DE102013213205A1 Halbleitereinheit Semiconductor unit |
| 01/09/2014 | DE102013213204A1 Halbleitereinheit Semiconductor unit |
| 01/09/2014 | DE102013212864A1 Halbleiterchip und Verfahren zum Erkennen eines Defekts in einem Halbleiterchip Semiconductor chip and method for detecting a defect in a semiconductor chip |
| 01/09/2014 | DE102013106994A1 Bauteil und Verfahren zur Herstellung eines Bauteils mittels eines ultradünnen Trägers Component and process for producing a component by means of an ultra-thin carrier |
| 01/09/2014 | DE102013106936A1 Chip-Baustein und Verfahren zu seiner Herstellung Chip package and process for its preparation |
| 01/09/2014 | DE102012211924A1 Halbleitermodul mit einem in einer Anschlusslasche integrierten Shunt-Widerstand und Verfahren zur Ermittlung eines durch einen Lastanschluss eines Halbleitermoduls fließenden Stromes A semiconductor module with a built-in a connecting bracket shunt resistor and method for determining a current flowing through a load terminal of a semiconductor module current |
| 01/09/2014 | DE102012109319A1 Bump-on-Trace-Baugruppenstruktur und Verfahren zur Herstellung derselben Bump-on-trace assembly structure and method of manufacturing the same |
| 01/08/2014 | EP2682986A1 Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus |
| 01/08/2014 | EP2682985A1 Semiconductor module and semiconductor module manufacturing method |
| 01/08/2014 | EP2682984A1 Semiconductor device and method of manufacturing semiconductor device |
| 01/08/2014 | EP2682499A1 Copper-titanium alloy sputtering target, semiconductor wiring line formed using the sputtering target, and semiconductor element and device each equipped with the semiconductor wiring line |
| 01/08/2014 | EP2681847A1 Cooling system and method for cooling radio unit |
| 01/08/2014 | EP2681767A1 Semiconductor structure having a capacitor and metal wiring integrated in a same dielectric layer |
| 01/08/2014 | EP2681765A2 Apparatus and methods related to wire bond pads and reducing impact of high rf loss plating |
| 01/08/2014 | EP2681764A1 Liquid displacer in led bulbs |
| 01/08/2014 | CN203386762U Mesa-type glassivation diode chip |
| 01/08/2014 | CN203386761U Diode |
| 01/08/2014 | CN203386752U Integrated block for analog quantity conversion circuit |
| 01/08/2014 | CN203386747U High maintaining voltage type electrostatic discharge protective TVS device |
| 01/08/2014 | CN203386746U Punch-through type transient voltage suppressor |
| 01/08/2014 | CN203386745U Semiconductor device having double-faced interconnect structure for Fo-WLCSP |
| 01/08/2014 | CN203386744U Bonding wire used for semiconductor |
| 01/08/2014 | CN203386743U Packaging substrate with spiral inductor |
| 01/08/2014 | CN203386742U One-chip-type structural framework |
| 01/08/2014 | CN203386741U Pin frame |
| 01/08/2014 | CN203386740U Novel diode |
| 01/08/2014 | CN203386739U Liquid-cooled apparatus and integration power semiconductor module |
| 01/08/2014 | CN203386738U Power semiconductor device cooling device |
| 01/08/2014 | CN103503591A Cooling fin structure |
| 01/08/2014 | CN103503589A Cooler and manufacturing method for cooler |
| 01/08/2014 | CN103503175A Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions |
| 01/08/2014 | CN103503134A Light emitting diodes and substrates |
| 01/08/2014 | CN103503133A Apparatus and methods related to wire bond pads and reducing impact of high RF loss plating |
| 01/08/2014 | CN103503132A 半导体装置 Semiconductor device |
| 01/08/2014 | CN103503131A Cooler for semiconductor module, and semiconductor module |
| 01/08/2014 | CN103503130A 陶瓷电路基板 A ceramic circuit substrate |
| 01/08/2014 | CN103503122A 半导体装置 Semiconductor device |
| 01/08/2014 | CN103503117A Wiring structure and display device |
| 01/08/2014 | CN103503054A Thin film transistor array apparatus and EL display apparatus using same |
| 01/08/2014 | CN103502138A Method for the wafer-level integration of shape memory alloy wires |
| 01/08/2014 | CN103501939A Composite material for heat dissipating substrate, and method for manufacturing composite material for heat dissipating substrate |
| 01/08/2014 | CN103501118A Heat tube type wind power converter power unit |
| 01/08/2014 | CN103500741A Antistatic structure of array substrate |
| 01/08/2014 | CN103500740A Chip capable of resisting invasive attack, manufacturing method thereof and attack detection method |
| 01/08/2014 | CN103500739A Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 01/08/2014 | CN103500738A Semiconductor device containing etching barrier layer as well as manufacturing method and application of semiconductor device |
| 01/08/2014 | CN103500737A Overload-resistant integral LCC (Leadless Chip Carrier) package based on LTCC (Low Temperature Co-Fired Ceramic) substrate |
| 01/08/2014 | CN103500736A Chip packaging structure and chip packaging method |
| 01/08/2014 | CN103500735A 半导体装置 Semiconductor device |
| 01/08/2014 | CN103500734A Liquid cooling insulation type radiator |
| 01/08/2014 | CN103500733A Insulation heat pipe radiator of explosive-proof structure |
| 01/08/2014 | CN103500729A Silicon pinboard structure and wafer level manufacturing method of silicon pinboard structure |
| 01/08/2014 | CN103500700A Method for manufacturing semiconductor device |
| 01/08/2014 | CN102623397B Array substrate structure for display panel and method of making the same |