Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/13/2003US6562653 Silicon interposer and multi-chip-module (MCM) with through substrate vias
05/13/2003US6562651 Method of manufacturing a semiconductor device having contact pads
05/13/2003US6562647 Chip scale surface mount package for semiconductor device and process of fabricating the same
05/13/2003US6562641 Apparatus and methods of semiconductor packages having circuit-bearing interconnect components
05/13/2003US6562639 Utilizing electrical performance data to predict CD variations across stepper field
05/13/2003US6562637 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
05/13/2003US6562635 Method of controlling metal etch processes, and system for accomplishing same
05/13/2003US6562544 Method and apparatus for improving accuracy in photolithographic processing of substrates
05/13/2003US6562495 Nanoscale catalyst compositions from complex and non-stoichiometric compositions
05/13/2003US6562482 Liquid potting composition
05/13/2003US6562219 Forming a first copper film by means of a chemical vapor depotion on an insulating diffusion barrier film; heating the first copper film to a requiered temperature, subsequently forming second copper film on the first by plating
05/13/2003US6562188 Resist mask for measuring the accuracy of overlaid layers
05/13/2003US6561267 Heat sink and electronic circuit module including the same
05/13/2003US6561261 Cooling apparatus for electronic devices
05/13/2003US6560862 Modified pad for copper/low-k
05/13/2003US6560860 Providing multilayered low temperature co-fired ceramic assembly with constraining core to minimize shrinkage of outer ceramic layers having high density circuit features patterned thereon during firing
05/08/2003WO2003039219A1 Method for manufacturing multilayer circuit board for semiconductor device
05/08/2003WO2003038899A2 Semiconductor structure with a coil underneath the first wiring layer or between two wiring layers
05/08/2003WO2003038896A2 Ball grid array with x-ray alignment mark
05/08/2003WO2003038895A1 Wafer scribing method and wafer scribing device
05/08/2003WO2003038894A2 Chip module
05/08/2003WO2003038861A2 A method of stacking layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers
05/08/2003WO2003038492A2 Hybrid integration of electrical and optical chips
05/08/2003WO2003038459A1 Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring
05/08/2003WO2003037954A1 Phenolic resin, epoxy resin, process for producing the same, and resin composition for semiconductor encapsulation material
05/08/2003WO2003037589A1 Sealing material tablet, method of manufacturing the tablet, and electronic component device
05/08/2003WO2003005430A3 Method and apparatus for controlling a plating process
05/08/2003WO2002067318A3 Electromigration test structure for determining the reliability of wiring
05/08/2003WO2002027794A3 Integral capacitor with electromagnetic radiation reduction
05/08/2003US20030088019 Material made from a polyurethane gel, production process and uses
05/08/2003US20030088016 Having the general formula (R1SiO3/2)x(HSiO3/2)y where R1 is an alkyl group having 8 to 24 carbon atoms; used to form porous thin films on semiconductor devices.
05/08/2003US20030087538 Wiring board with built-in electronic component and method for producing the same
05/08/2003US20030087527 Method for estimating capacitance of deep trench capacitors
05/08/2003US20030087522 Method of forming reliable Cu interconnects
05/08/2003US20030087515 Method for fabricating semiconductor device
05/08/2003US20030087513 Method for manufacturing semiconductor device
05/08/2003US20030087512 Method of manufacturing a semiconductor device
05/08/2003US20030087502 Carrier for used in manufacturing semiconductor encapsulant packages
05/08/2003US20030087499 Process for forming metallized contacts to periphery transistors
05/08/2003US20030087498 Via components for integrated passive components
05/08/2003US20030087490 Method for forming an interconnection in a semiconductor element
05/08/2003US20030087485 Dielectric films for narrow gap-fill applications
05/08/2003US20030087484 Metal structures for integrated circuits and methods for making the same
05/08/2003US20030087483 Semiconductor device and method for manufacturing substrate of the same
05/08/2003US20030087479 Adhesive wafers for die attach application
05/08/2003US20030087478 Semiconductor device and a method of manufacturing the same
05/08/2003US20030087477 Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same
05/08/2003US20030087475 Method and apparatus for improving an integrated circuit device
05/08/2003US20030087473 Semiconductor package assembly and method for electrically isolating modules
05/08/2003US20030087215 Gas flow through interior cavities; heat exchanging; semiconductors
05/08/2003US20030087197 Biocompatibility protective coating; dielectrics; prevent current leakage
05/08/2003US20030087189 Photosensitive resin composition
05/08/2003US20030087136 Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same
05/08/2003US20030087130 Magnetic recording media; masking, etching photoresist pattern
05/08/2003US20030087108 Noncracking; protective coatings; low pressure vapor deposition
05/08/2003US20030087088 Resin sealing method for semiconductors and release film used therefor
05/08/2003US20030087077 Sheet material especially useful for circuit boards
05/08/2003US20030086994 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
05/08/2003US20030086248 Interposer for semiconductor, method for manufacturing same, and semiconductor device using same
05/08/2003US20030085757 Semiconductor integrated circuit device
05/08/2003US20030085475 Prevents flowing down of thermal interface material from the original position at high temperatures; performance of the semiconductor package does not deteriorate even at high temperatures
05/08/2003US20030085474 Providing a semiconductor device; providing a switching device; forming the electrical contact devices; applying attachment element to surfaces; pressing flexible contact elements onto the contact areas, and securely connecting
05/08/2003US20030085473 Miniaturization
05/08/2003US20030085472 Apparatus and method for reducing interposer compression during molding process
05/08/2003US20030085471 Semiconductor package and method of production thereof
05/08/2003US20030085470 Semiconductor device and method of manufacturing the same
05/08/2003US20030085469 Semiconductor device having a matrix array of contacts and a fabrication process thereof
05/08/2003US20030085468 Multi-layer interconnection structure in semiconductor device and method for fabricating same
05/08/2003US20030085466 Chip-scale package and carrier for use therewith
05/08/2003US20030085465 Semiconductor device, electronic card and pad rearrangement substrate
05/08/2003US20030085464 Semiconductor packages for semiconductor devices
05/08/2003US20030085463 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method fo formation and testing
05/08/2003US20030085462 Enhanced BGA grounded heatsink
05/08/2003US20030085461 Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module
05/08/2003US20030085460 Integrated circuits and methods for their fabrication
05/08/2003US20030085459 Low profile semiconductor package
05/08/2003US20030085456 Semiconductor power package module
05/08/2003US20030085455 Thermal ring used in 3-D stacking
05/08/2003US20030085453 Flip chip semiconductor devices and heat sink assemblies, and the coupling thereof to form an electronic apparatus including a compliant support for supporting a heat sink
05/08/2003US20030085447 Beol decoupling capacitor
05/08/2003US20030085446 Semiconductor device having fuse circuit on cell region and method of fabricating the same
05/08/2003US20030085445 Semiconductor devices
05/08/2003US20030085443 Semiconductor devices and methods for manufacturing the same
05/08/2003US20030085439 Isolating, resistive, conducting (or) and/or semiconducting patterns and structures for use in electronic circuits which most particularly consist of a single or several stacked layers of thin films
05/08/2003US20030085429 Triggering of an ESD NMOS through the use of an N-type buried layer
05/08/2003US20030085428 Gate feed structure for reduced size field effect transistors
05/08/2003US20030085425 Silicon on insulator device with improved heat removal and method of manufacture
05/08/2003US20030085423 Power semiconductor module
05/08/2003US20030085403 Layered wiring line of silver or silver alloy and method for forming the same and display panel substrate using the same
05/08/2003US20030085256 Semiconductor manufacturing apparatus and method, semiconductor device and electronic device
05/08/2003US20030085208 Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic device
05/08/2003US20030085055 Substrate design and process for reducing electromagnetic emission
05/08/2003US20030085024 Control of electrolysis gases in electroosmotic pump systems
05/08/2003US20030084677 Electronic apparatus having at least two electronic parts operating at different temperatures
05/08/2003US20030084566 Chip scale package with heat spreader and method of manufacture
05/08/2003US20030084563 Semiconductor integrated circuit manufacturing method and bonding machine used for it
05/08/2003DE20303492U1 Integrated circuit used in production of circuit boards comprises a wiring conductor strip material encased by an electrically insulating inorganic material
05/08/2003DE20303391U1 Air free cooling system with heating tubes and insulating multiple layer cooling wall for cooling electronic devices such as computer processors
05/08/2003DE20217078U1 Clip for holding heat sink in contact with microprocessor has two latching parts
05/08/2003DE20121770U1 Light metal extruded section for use as a cooler for electrical components has a heat-conducting body with teeth on a front side, a flat rear side and a laser welding-joint to join together single sections abutting in a butt joint
1 ... 1649 1650 1651 1652 1653 1654 1655 1656 1657 1658 1659 1660 1661 1662 1663 1664 1665 1666 1667 1668 1669 ... 2262