| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/08/2003 | CA2433488A1 Ball grid array with x-ray alignment mark |
| 05/07/2003 | EP1309047A1 Housing part for an optoelectronic device and manufacturing method thereof |
| 05/07/2003 | EP1309004A1 Semiconductor device |
| 05/07/2003 | EP1309003A2 Wiring arrangement for surface mounted device |
| 05/07/2003 | EP1309002A2 Semiconductor device having fuse and its manufacturing method |
| 05/07/2003 | EP1309001A2 Semiconductor device and manufacturing method thereof |
| 05/07/2003 | EP1309000A2 Via formation in polymers |
| 05/07/2003 | EP1308997A2 Charge detector semiconductor device, system consisting of a charge detector semiconductor device and a reference semiconductor device, wafer, use of a wafer and method of the qualitative measurement of the charge up of a wafer |
| 05/07/2003 | EP1308996A2 Semiconductor device and process for fabrication thereof |
| 05/07/2003 | EP1308994A2 Method for VIA etching in organo-silica-glass |
| 05/07/2003 | EP1308741A1 Magnestoresistive sensor and manufacturing method therefor |
| 05/07/2003 | EP1308476A1 Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device |
| 05/07/2003 | EP1307931A2 Memory element and method for production of a memory element |
| 05/07/2003 | EP1307919A1 Electrical passivation of silicon-containing surfaces using organic layers |
| 05/07/2003 | EP1307918A2 Wiring through terminal via fuse window |
| 05/07/2003 | EP1307916A2 Backside contact for integrated circuit and method of forming same |
| 05/07/2003 | EP1307910A1 Micromachined sensor with insulating protection of connections |
| 05/07/2003 | EP1307905A2 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 05/07/2003 | EP1307820A1 Crosspoint switch with switch matrix module |
| 05/07/2003 | EP1222664B1 Method for identifying an integrated circuit |
| 05/07/2003 | EP1097478B1 Semiconductor component in a chip format and method for the production thereof |
| 05/07/2003 | EP0963607B1 An integrated circuit having a planar inductor |
| 05/07/2003 | CN2549592Y Heat pipe radiator |
| 05/07/2003 | CN2549591Y Fin devices of radiators |
| 05/07/2003 | CN2549590Y Radiator with stretching out ribs |
| 05/07/2003 | CN1416595A Wiring beard, semiconductor device, and method of mfg. wiring board |
| 05/07/2003 | CN1416593A 电子器件封装 Electronic device package |
| 05/07/2003 | CN1416579A Coil and coil system to be integrated in microelectronic circuit, and microelectronic circuit |
| 05/07/2003 | CN1416452A Resin compon, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
| 05/07/2003 | CN1416170A Semiconductor device and mfg. method thereof |
| 05/07/2003 | CN1416169A 树脂密封型的半导体装置 The resin sealing type semiconductor device |
| 05/07/2003 | CN1416165A Semiconductor device, its production technique and detction method |
| 05/07/2003 | CN1416160A Method for encapsulting semiconductor chip and its products |
| 05/07/2003 | CN1416158A Dielectric film forming material, delectric film method of forming delectric film and semiconductor device |
| 05/07/2003 | CN1416131A Semiconductor storage device adapting to multiple packing forms |
| 05/07/2003 | CN1415781A Method for producing material of base plate for encapsulating integrated circuit |
| 05/07/2003 | CN1415479A Constructional body with through hole, its mfg. method and liquid discharge head |
| 05/07/2003 | CN1108088C Coating for structured prodn. of conductors on surface of electrically insulating substrates |
| 05/07/2003 | CN1107979C Electrode structure, forming method and mounting body for semiconductor device, and semiconductor device |
| 05/07/2003 | CN1107978C Electronic package with thermally conductive support member |
| 05/07/2003 | CN1107977C Semiconductor device |
| 05/07/2003 | CN1107972C Mfg. method for semiconductor packed according to chip size |
| 05/07/2003 | CN1107969C Method for fabricating contact of semiconductor device |
| 05/07/2003 | CN1107968C Method of forming planarization medium layer on intermetal picture and multi-layer intermetal intermetal picture structure |
| 05/06/2003 | US6560762 Semiconductor integrated circuit and wiring method |
| 05/06/2003 | US6560134 Memory configuration with a central connection area |
| 05/06/2003 | US6560122 Chip package with molded underfill |
| 05/06/2003 | US6560121 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
| 05/06/2003 | US6560117 Packaged microelectronic die assemblies and methods of manufacture |
| 05/06/2003 | US6560113 Electronic device assembly having thermal module for heat dissipation |
| 05/06/2003 | US6560112 Fixing apparatus for heat sink |
| 05/06/2003 | US6560111 Bracket for CPU cooler |
| 05/06/2003 | US6560109 Stack of multilayer modules with heat-focusing metal layer |
| 05/06/2003 | US6560108 Chip scale packaging on CTE matched printed wiring boards |
| 05/06/2003 | US6560080 Low-voltage triggered ESD protection circuit |
| 05/06/2003 | US6559700 Semiconductor integrated circuit |
| 05/06/2003 | US6559665 Test socket for an IC device |
| 05/06/2003 | US6559549 Tape carrier package and method of fabricating the same |
| 05/06/2003 | US6559548 Wiring structure of semiconductor device |
| 05/06/2003 | US6559547 Patterning of content areas in multilayer metalization configurations of semiconductor components |
| 05/06/2003 | US6559545 Semiconductor devices and methods for manufacturing semiconductor devices |
| 05/06/2003 | US6559544 Programmable interconnect for semiconductor devices |
| 05/06/2003 | US6559543 Stacked fill structures for support of dielectric layers |
| 05/06/2003 | US6559542 Semiconductor device and method of manufacturing the same |
| 05/06/2003 | US6559540 Flip-chip semiconductor device and method of forming the same |
| 05/06/2003 | US6559538 Integrated circuit device having a built-in thermoelectric cooling mechanism |
| 05/06/2003 | US6559537 Ball grid array packages with thermally conductive containers |
| 05/06/2003 | US6559536 Semiconductor device having a heat spreading plate |
| 05/06/2003 | US6559535 Lead structure for sealing package |
| 05/06/2003 | US6559534 Thermal capacity for electronic component operating in long pulses |
| 05/06/2003 | US6559533 High-frequency package and the method for manufacturing the same |
| 05/06/2003 | US6559531 Face to face chips |
| 05/06/2003 | US6559529 Press-fit diode for universal mounting |
| 05/06/2003 | US6559528 Semiconductor device and method for the fabrication thereof |
| 05/06/2003 | US6559527 Process for forming cone shaped solder for chip interconnection |
| 05/06/2003 | US6559526 Multiple-step inner lead of leadframe |
| 05/06/2003 | US6559525 Semiconductor package having heat sink at the outer surface |
| 05/06/2003 | US6559524 Dummy leads formed in proximity of edge of opening in solder resist |
| 05/06/2003 | US6559522 Tape carrier package and an LCD module using the same |
| 05/06/2003 | US6559521 Chip carrier with magnetic shielding |
| 05/06/2003 | US6559520 Vaporizing a dialkoxydialkylsilicon for chemical vapor deposition on a semiconductor and introducing oxygen and an inert gas to activate plasma polymerisation; low dielectric constant; humidity and heat resistance |
| 05/06/2003 | US6559519 Integrated circuit device having cyanate ester buffer coat and method of fabricating same |
| 05/06/2003 | US6559516 Antifuse structure and method of making |
| 05/06/2003 | US6559508 ESD protection device for open drain I/O pad in integrated circuits with merged layout structure |
| 05/06/2003 | US6559507 Compact ballasting region design for snapback N-MOS ESD protection structure using multiple local N+ region blocking |
| 05/06/2003 | US6559485 Semiconductor device having a gate insulation film resistant to dielectric breakdown |
| 05/06/2003 | US6559484 Embedded enclosure for effective electromagnetic radiation reduction |
| 05/06/2003 | US6559483 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element |
| 05/06/2003 | US6559476 Method and structure for measuring bridge induced by mask layout amendment |
| 05/06/2003 | US6559475 Cross resistor and polycide patterns; semiconductors |
| 05/06/2003 | US6559412 Laser processing |
| 05/06/2003 | US6559409 Method for marking integrated circuits with a laser |
| 05/06/2003 | US6559390 Solder connect assembly and method of connecting a semiconductor package and a printed wiring board |
| 05/06/2003 | US6559388 Strain relief for substrates having a low coefficient of thermal expansion |
| 05/06/2003 | US6559070 Mesoporous silica films with mobile ion gettering and accelerated processing |
| 05/06/2003 | US6559063 Method for manufacturing semiconductor wafer having resist mask with measurement marks for measuring the accuracy of overlay of a photomask |
| 05/06/2003 | US6559061 Method and apparatus for forming improved metal interconnects |
| 05/06/2003 | US6559046 Insulator for integrated circuits and process |
| 05/06/2003 | US6559042 Process for forming fusible links |
| 05/06/2003 | US6559004 Method for forming three dimensional semiconductor structure and three dimensional capacitor |