Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/14/2003EP1311029A1 High density connector and method of manufacture
05/14/2003EP1310998A2 Semiconductor device
05/14/2003EP1310995A2 Device for shielding the signal lines by the ground or power lines
05/14/2003EP1310993A2 Method for enhancing the electric connection between a power electronic device and its package
05/14/2003EP1310991A2 Composite die mounting foil for chip-scale semiconductor packages
05/14/2003EP1310988A1 Semiconductor device and method of manufacture thereof
05/14/2003EP1310966A1 Composite electronic components
05/14/2003EP1309999A2 Semiconductor component and a method for identifying a semiconductor component
05/14/2003EP1309998A1 Method for electrically connecting a semiconductor component to an electrical subassembly
05/14/2003EP1309997A2 Electrical component assembly and method of fabrication
05/14/2003EP1309996A2 Electrical assembly and method for producing said electrical assembly
05/14/2003EP1309994A2 Encapsulated organic-electronic component, method for producing the same and use thereof
05/14/2003EP1309993A1 Copper interconnects with improved electromigration resistance and low resistivity
05/14/2003EP1309940A1 Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
05/14/2003EP1309736A1 Sputtering target
05/14/2003EP1309447A1 Lead-free alloys with improved wetting properties
05/14/2003EP1238574B1 Integrated convection and conduction heat sink for multiple mounting positions
05/14/2003EP1233935B1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body
05/14/2003EP1084029A4 Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions
05/14/2003EP0819318B1 A solder bump structure for a microelectronic substrate
05/14/2003CN2550904Y Large radiator with air guide
05/14/2003CN2550903Y Coated crystal chip and coated crystal structure base plate
05/14/2003CN2550902Y Package modular group of semiconductor element
05/14/2003CN2550901Y Coated crystal package structure
05/14/2003CN2550900Y Coating crystal packaging base plate
05/14/2003CN2550899Y Lug bottom buffer metal structure
05/14/2003CN2550834Y Radiator
05/14/2003CN1418374A Vertical electrical interconnestions in stack
05/14/2003CN1418373A Apparatus and method for passive phase change thermal management
05/14/2003CN1418049A Multilayer ceramic substrate and its production process
05/14/2003CN1418048A Built-in module in element and its making process
05/14/2003CN1417859A Semiconductor device
05/14/2003CN1417858A Metal lug with high pin and its making method and apparatus
05/14/2003CN1417857A Radiation fin array cooler
05/14/2003CN1417856A Semiconductor package and its manufacture
05/14/2003CN1417855A Multilayer substrate for semiconductor device
05/14/2003CN1417854A Package structure of chip with pad array
05/14/2003CN1417852A Semiconductor device and its manufacture
05/14/2003CN1417774A Magnetoresistance sensor and its making process
05/14/2003CN1417660A Quick heat conducting heat radiator module
05/14/2003CN1417484A Buckle capable of being detached without using tool
05/14/2003CN1108636C Method and device for checking IC device shell pin
05/14/2003CN1108634C Method of wire bonding IC to ultraflexible substrate
05/14/2003CN1108539C 有源矩阵液晶显示器 An active matrix liquid crystal display
05/13/2003US6563905 Ball grid array X-ray orientation mark
05/13/2003US6563716 Heat sink clip with pressing cam
05/13/2003US6563712 Heak sink chip package
05/13/2003US6563709 Liquid-cooled heat sink and manufacturing method thereof
05/13/2003US6563688 Isolating energy conditioning shield assembly
05/13/2003US6563336 Signal shielding assignment technique for precharge based logic
05/13/2003US6563320 Mask alignment structure for IC layers
05/13/2003US6563227 Temperature control method for integrated circuit
05/13/2003US6563226 Bonding pad
05/13/2003US6563223 Interconnection component for facilitating testing of packaged integrated circuits
05/13/2003US6563222 Copper interconnects doped with palladium, zirconium, tin, magnesium, or scandium; semiconductor chips
05/13/2003US6563221 Connection structures for integrated circuits and processes for their formation
05/13/2003US6563219 Passivation integrity improvements
05/13/2003US6563218 Semiconductor device of multi-wiring structure and method of manufacturing the same
05/13/2003US6563217 Module assembly for stacked BGA packages
05/13/2003US6563216 Semiconductor device having a bump electrode
05/13/2003US6563215 Silicon carbide interconnect for semiconductor components and method of fabrication
05/13/2003US6563214 Electronic component and method of manufacturing the same
05/13/2003US6563213 Integrated circuit heat sink support and retention mechanism
05/13/2003US6563212 Semiconductor device
05/13/2003US6563211 Semiconductor device for controlling electricity
05/13/2003US6563210 Parallel plane substrate
05/13/2003US6563209 Lead frame for semiconductor device
05/13/2003US6563208 Semiconductor package with conductor impedance selected during assembly
05/13/2003US6563207 Resin encapsulation; mechanism holds and applies tension to mold release sheet
05/13/2003US6563203 Diode chip prevents reverse current
05/13/2003US6563202 Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus
05/13/2003US6563201 System carrier for a semiconductor chip having a lead frame
05/13/2003US6563200 Interface device and interface system
05/13/2003US6563199 Lead frame for semiconductor devices, a semiconductor device made using the lead frame
05/13/2003US6563198 Adhesive pad having EMC shielding characteristics
05/13/2003US6563196 Semiconductor wafer, semiconductor device and manufacturing method therefor
05/13/2003US6563192 Semiconductor die with integral decoupling capacitor
05/13/2003US6563189 Melting and flowing aluminum alloy to create current path
05/13/2003US6563188 Dielectric film covers metal wire and has opening
05/13/2003US6563162 Semiconductor memory device for reducing parasitic bit line capacitance and method of fabricating the same
05/13/2003US6563079 Method for machining work by laser beam
05/13/2003US6563058 Multilayered circuit board and method for producing the same
05/13/2003US6562734 Method of filling gaps on a semiconductor wafer
05/13/2003US6562732 Method of manufacturing a semiconductor device
05/13/2003US6562719 Solution which contains an oxidizer, phosphoric acid, organic acid, a chemical to form inhibition layer, and water.
05/13/2003US6562711 Method of reducing capacitance of interconnect
05/13/2003US6562710 Semiconductor device and method for fabricating the same
05/13/2003US6562709 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
05/13/2003US6562708 Method for incorporating silicon into CVD metal films
05/13/2003US6562699 Process for manufacturing semiconductor device
05/13/2003US6562691 Method for forming protrusive alignment-mark
05/13/2003US6562674 Semiconductor integrated circuit device and method of producing the same
05/13/2003US6562663 Microelectronic assembly with die support and method
05/13/2003US6562662 Electronic package with bonded structure and method of making
05/13/2003US6562661 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
05/13/2003US6562660 Method of manufacturing the circuit device and circuit device
05/13/2003US6562658 Method of making semiconductor device having first and second sealing resins
05/13/2003US6562657 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
05/13/2003US6562655 Heat spreader with spring IC package fabrication method
05/13/2003US6562654 Tented plated through-holes and method for fabrication thereof
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