Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/22/2003US20030094702 Multi-chip module
05/22/2003US20030094701 Semiconductor component
05/22/2003US20030094700 Light signal processing system
05/22/2003US20030094698 Semiconductor device and method for fabricating the same
05/22/2003US20030094697 Circuit substrate and its manufacturing method
05/22/2003US20030094696 Stacked fill structures for support of dielectric layers
05/22/2003US20030094695 Process for producing a semiconductor chip
05/22/2003US20030094694 High frequency ic package, high frequency unit using high frequency ic package, and manufacturing method thereof
05/22/2003US20030094693 Multi-chip module packaging device
05/22/2003US20030094692 Replaceable integrated circuit device
05/22/2003US20030094690 Substrates and assemblies including pre-applied adhesion promoter
05/22/2003US20030094689 Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
05/22/2003US20030094688 Method and apparatus for packaging photodetectors
05/22/2003US20030094687 Structure and method for wiring translation between grids with non-integral pitch ratios in chip carrier modules
05/22/2003US20030094686 Semiconductor device and method for manufacturing same
05/22/2003US20030094685 Semiconductor device and module of the same
05/22/2003US20030094684 Center pad type IC chip with jumpers, method of processing the same and multi chip package
05/22/2003US20030094683 Stackable semiconductor package and wafer level fabrication method
05/22/2003US20030094682 Semiconductor module and insulating substrate thereof
05/22/2003US20030094681 Semiconductor device having chip scale package
05/22/2003US20030094680 Packaging mold with electrostatic discharge protection
05/22/2003US20030094679 Semiconductor device
05/22/2003US20030094678 Wireless bonded semiconductor device and method for packaging the same
05/22/2003US20030094677 Suspended semiconductor package
05/22/2003US20030094676 Semiconductor package with crack-preventing member
05/22/2003US20030094675 Semiconductor device
05/22/2003US20030094674 Semiconductor wafer
05/22/2003US20030094671 Antifuses
05/22/2003US20030094670 Fuse structure
05/22/2003US20030094666 Interposer
05/22/2003US20030094665 Solid-state imaging apparatus and manufacturing method thereof
05/22/2003US20030094652 Modified contact for programmable devices
05/22/2003US20030094643 Semiconductor device and method for manufacturing the same
05/22/2003US20030094635 Semiconductor memory device including multi-layer gate structure
05/22/2003US20030094634 Bonding pad structure of a semiconductor device and method for manufacturing the same
05/22/2003US20030094632 Semiconductor device and manufacturing method of the same
05/22/2003US20030094631 Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps
05/22/2003US20030094621 Semiconductor package, manufacturing method of semiconductor package
05/22/2003US20030094609 Structure for detecting charging effects in device processing
05/22/2003US20030094608 Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure
05/22/2003US20030094307 Multilayer ceramic substrate and method for manufacturing the same
05/22/2003US20030094306 Method and apparatus for supporting a circuit component having solder column interconnects using external support
05/22/2003US20030094275 Heat sink and fin module
05/22/2003US20030094050 Pressure detecting apparatus
05/22/2003US20030093898 Solder resist opening to define a combination pin one indicator and fiducial
05/22/2003DE20304197U1 Heat dispersing device with fluid cooler for cooling a processor mounted on a base plate
05/22/2003DE20304196U1 Heat dispersing device with fluid cooler for cooling a processor mounted on a base plate
05/22/2003DE20303844U1 Multipart receiving system for fluid cooler in cooling a processor on a baseplate has heat sink pressed against upper surface of processor
05/21/2003EP1313226A1 Telecommunication device comprising a heat dissipation system
05/21/2003EP1313184A1 Semiconductor laser device
05/21/2003EP1313144A2 Passive devices and modules for transceiver
05/21/2003EP1313143A2 Perimeter anchored thick film pad
05/21/2003EP1313142A2 Method of manufacturing a rerouting layer on a semiconductor device and corresponding semiconductor device
05/21/2003EP1313140A1 Method of forming a liner for tungsten plugs
05/21/2003EP1313136A1 Semiconductor device and method for manufacturing the same
05/21/2003EP1312907A1 Pressure detecting apparatus
05/21/2003EP1312903A1 Infrared detection element and method for fabricating the same and equipment for measuring temperature
05/21/2003EP1312248A2 A cooling system
05/21/2003EP1312124A1 Optoelectronic component and method for the production thereof, module and device comprising a module of this type
05/21/2003EP1312116A1 Method for distributed shielding and/or bypass for electronic device with three-dimensional interconnection
05/21/2003EP1312115A2 Semiconductor arrangement and method for production thereof
05/21/2003EP1311586A1 Polyimides for high-frequency applications
05/21/2003EP1311190A2 Apparatus and method for collecting data useful for determining the parameters of an alert window for timing delivery of etc signals to a heart under varying cardiac conditions
05/21/2003EP1197130B1 Circuitry with integrated passive components and method for producing same
05/21/2003EP1129050B1 Paste for screenprinting electric structures onto carrier substrates
05/21/2003EP1010108B1 Method and apparatus for channel-routing of an electronic device
05/21/2003CN2552295Y Fastener structure for radiator
05/21/2003CN2552167Y Radiator
05/21/2003CN2552166Y Structure of inserting and riveting radiating fins
05/21/2003CN2552165Y Appliance for assembling power transistor assembly and radiating fins
05/21/2003CN2552066Y Elastic radiating structure
05/21/2003CN2552064Y Radiating device
05/21/2003CN2552063Y Horizontal transmission for radiating fin mfg. equipment
05/21/2003CN2552062Y Radiating device
05/21/2003CN2551959Y Radiator fastener
05/21/2003CN1419803A Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
05/21/2003CN1419401A Welding pad for printed icrcuit board and forming method thereof
05/21/2003CN1419289A Semiconductor device with fuse and making method thereof
05/21/2003CN1419288A Passivating glass conting liquid for improving high-temp. reversal property of glass passivating silicon device
05/21/2003CN1419287A Device for shielding transmission line to ground or power supply
05/21/2003CN1419286A Wire lead frame, resin steal model and semiconductor using same
05/21/2003CN1419285A Semiconductor device and making method thereof
05/21/2003CN1419284A 半导体装置 Semiconductor device
05/21/2003CN1419283A Film carried tape
05/21/2003CN1419279A Semiconductor device and making method thereof
05/21/2003CN1419157A Lcd
05/21/2003CN1418850A 介电陶瓷组合物 The dielectric ceramic composition
05/21/2003CN1109385C Socket for electronic device
05/21/2003CN1109363C Semiconductor device and method of manufacturing same
05/21/2003CN1109361C Preparation for structuralized protection layer and insulation layer
05/20/2003US6567964 Continuously variable dummy pattern density generating systems, methods and computer program products for patterning integrated circuits
05/20/2003US6567288 Methods for bi-level digit line architecture for high density DRAMS
05/20/2003US6567270 Semiconductor chip package with cooling arrangement
05/20/2003US6567269 Computer system having removable processor and modular thermal unit
05/20/2003US6566995 Protective element
05/20/2003US6566982 Lead frame set and saw filter using the same
05/20/2003US6566885 Multiple directional scans of test structures on semiconductor integrated circuits
05/20/2003US6566762 Front side coating for bump devices
05/20/2003US6566761 Electronic device package with high speed signal interconnect between die pad and external substrate pad
05/20/2003US6566760 Semiconductor storage device having memory chips in a stacked structure
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