Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/20/2003US6566759 Self-aligned contact areas for sidewall image transfer formed conductors
05/20/2003US6566758 Current crowding reduction technique for flip chip package technology
05/20/2003US6566757 Stabilization of low dielectric constant film with in situ capping layer
05/20/2003US6566756 Semiconductor device with porous interlayer film of a range of average diameter having partially closed holes
05/20/2003US6566755 Method of forming a high surface area interconnection structure
05/20/2003US6566752 Bonding pad and method for manufacturing it
05/20/2003US6566751 Carrier module for holding a μ-BGU type device for testing
05/20/2003US6566749 Semiconductor die package with improved thermal and electrical performance
05/20/2003US6566748 Flip-chip semiconductor device having an improved reliability
05/20/2003US6566747 Semiconductor package and production method thereof
05/20/2003US6566745 Image sensor ball grid array package and the fabrication thereof
05/20/2003US6566744 Integrated circuit packages assembled utilizing fluidic self-assembly
05/20/2003US6566743 Electronics package with specific areas having low coefficient of thermal expansion
05/20/2003US6566741 Grounding of package substrates
05/20/2003US6566740 Lead frame for a semiconductor device and method of manufacturing a semiconductor device
05/20/2003US6566739 Dual chip package
05/20/2003US6566737 Passivation structure for an integrated circuit
05/20/2003US6566736 Die seal for semiconductor device moisture protection
05/20/2003US6566735 Integrated circuit chip having anti-moisture-absorption film at edge thereof and method of forming anti-moisture-absorption film
05/20/2003US6566730 A severable horizontal portion of a fuse link is formed relative to a vertically configured structure in an IC to promote separation of the severable portion upon applying energy from a laser beam. The
05/20/2003US6566729 Semiconductor device including laser-blown links
05/20/2003US6566721 High-accuracy bleeder resistance circuit that can maintain an initial resistance value even after being packaged and can maintain an accurate voltage division ratio.
05/20/2003US6566718 Field effect transistor with an improved gate contact and method of fabricating the same
05/20/2003US6566716 Arrangements to reduce charging damage in structures of integrated circuits using polysilicon or metal plate(s)
05/20/2003US6566669 Semiconductor parts and semiconductor mounting apparatus
05/20/2003US6566601 High frequency semiconductor device housing package and mounting structure for mounting the same
05/20/2003US6566596 Magnetic and electric shielding of on-board devices
05/20/2003US6566288 Electrically insulating non-woven fabric, a prepreg and a laminate
05/20/2003US6566276 Method of making electronic materials
05/20/2003US6566262 Method for creating self-aligned alloy capping layers for copper interconnect structures
05/20/2003US6566261 Semiconductor device and method of manufacturing the same
05/20/2003US6566258 Bi-layer etch stop for inter-level via
05/20/2003US6566253 Method of making electrical interconnection for attachment to a substrate
05/20/2003US6566244 Process for improving mechanical strength of layers of low k dielectric material
05/20/2003US6566242 Dual damascene copper interconnect to a damascene tungsten wiring level
05/20/2003US6566241 Method of forming metal contact in semiconductor device
05/20/2003US6566240 Semiconductor device and method of forming a semiconductor device
05/20/2003US6566239 Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating
05/20/2003US6566238 Metal wire fuse structure with cavity
05/20/2003US6566234 Semiconductor flip-chip package and method for the fabrication thereof
05/20/2003US6566232 Method of fabricating semiconductor device
05/20/2003US6566211 Surface modified interconnects
05/20/2003US6566197 Method for fabricating connection structure between segment transistor and memory cell region of flash memory device
05/20/2003US6566188 Method of forming contact holes in semiconductor devices and method of forming capacitors using the same
05/20/2003US6566185 Method of manufacturing a plural unit high frequency transistor
05/20/2003US6566171 Fuse construction for integrated circuit structure having low dielectric constant dielectric material
05/20/2003US6566170 Method for forming a device having a cavity with controlled atmosphere
05/20/2003US6566168 Semiconductor package having implantable conductive lands and method for manufacturing the same
05/20/2003US6566167 PBGA electrical noise isolation of signal traces
05/20/2003US6566166 Method of manufacturing a cavity-down plastic ball grid array (CD-PBGA) substrate
05/20/2003US6566165 Method for mounting a semiconductor chip to a semiconductor chip-mounting board
05/20/2003US6566164 Exposed copper strap in a semiconductor package
05/20/2003US6566163 Method for making a contactless card with antenna connected with soldered wires
05/20/2003US6566157 Alignment marks and method of forming the same
05/20/2003US6565983 For electrically connecting an electric device and providing current transmission in an electric device
05/20/2003US6565956 Multilayer ceramic wiring board and process for producing same
05/20/2003US6565917 Depositing a paste in a via of a ceramic substrate and depositing the paste on the ceramic substrate; depositing, by a dry chemical vapor deposition (CVD) process, a nickel plating on paste, paste containing titania
05/20/2003US6565736 Supplying deionized water into an anode cell and a cathode cell of a 3-cell electrolyzer; filling intermediate cell with an electrolytic aqueous solution to perform electrolysis, cells of electrolyzer are divided by ion exchange membranes
05/20/2003US6565706 Support-frame bonding apparatus
05/20/2003US6565509 Analyte monitoring device and methods of use
05/20/2003US6565268 Optical connector and structure of optical connector-packaging/mounting portion
05/20/2003US6565008 Module card and a method for manufacturing the same
05/20/2003US6564861 Cooling unit
05/20/2003US6564859 Efficient heat pumping from mobile platforms using on platform assembled heat pipe
05/20/2003US6564458 Method for manufacturing a radiator
05/20/2003US6564454 Method of making and stacking a semiconductor package
05/20/2003US6564452 Method for creating printed circuit board substrates having solder mask-free edges
05/20/2003US6564449 Method of making wire connection in semiconductor device
05/20/2003CA2363409A1 A wire bonder for ball bonding insulated wire and method of using same
05/20/2003CA2266158C Connecting devices and method for interconnecting circuit components
05/20/2003CA2070809C Crosslinkable fluorinated polymer compositions
05/15/2003WO2003041472A1 Heat dissipating module
05/15/2003WO2003041465A1 Photoimageable dielectric material for circuit protection
05/15/2003WO2003041464A2 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
05/15/2003WO2003041169A2 Thermally balanced power transistor
05/15/2003WO2003041168A1 Silicon on insulator device with improved heat removal and method of manufacture
05/15/2003WO2003041166A2 Substrate design and process for reducing electromagnetic emission
05/15/2003WO2003041165A2 Electrically conductive thermal interface
05/15/2003WO2003041163A1 Device for the hermetic encapsulation of a component that must be protected against all stresses
05/15/2003WO2003041162A2 Method of forming reliable cu interconnects
05/15/2003WO2003041158A2 Semiconductor package device and method of formation and testing
05/15/2003WO2003041157A2 Large area silicon carbide devices and manufacturing methods therefor
05/15/2003WO2003041145A1 Plating solution, semiconductor device and method for manufacturing the same
05/15/2003WO2003041133A2 Electrothermal self-latching mems switch and method
05/15/2003WO2003041132A2 Gas-assisted rapid thermal processing
05/15/2003WO2003041127A2 Process for forming metallized contacts to periphery transistors
05/15/2003WO2003041117A2 Integrated semiconductor component for conducting high-frequency measurements and the use thereof
05/15/2003WO2003040901A1 Heat dissipating structure of liquid crystal personal computer
05/15/2003WO2003040852A2 Concept for compensating external disturbance variables on physical functional parameters in integrated circuits
05/15/2003WO2003040430A1 Substrate processing apparatus and method
05/15/2003WO2003040420A1 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
05/15/2003WO2003040338A2 Micro-scale interconnect device with internal heat spreader and method for fabricating same
05/15/2003WO2002073690A3 A method of packaging a device with a lead frame
05/15/2003WO2002059958A3 Aqueous nonferrous feedstock material for injection molding
05/15/2003WO2002041394A3 Lid and heat spreader design for a semiconductor package
05/15/2003WO2001080304A3 Improved test structures and methods for inspecting and utilizing the same
05/15/2003US20030092441 Method and apparatus for providing services in a private wireless network
05/15/2003US20030092305 Connector for integrated circuits, and assembly for use on integrated circuits
05/15/2003US20030092301 KGD carrier and an IC mounting socket mounting it
05/15/2003US20030092274 Fabrication method for an interconnect on a substrate
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