Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/03/2003US6573170 Process for multilayer wiring connections and bonding pad adhesion to dielectric in a semiconductor integrated circuit device
06/03/2003US6573158 Methods of processing semiconductor wafer and producing IC card, and carrier
06/03/2003US6573157 Method of manufacturing semiconductor device, narrow pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device
06/03/2003US6573151 Method of forming zero marks
06/03/2003US6573148 Methods for making semiconductor inductor
06/03/2003US6573125 Method of opening repair fuse of semiconductor device
06/03/2003US6573124 Preparation of passivated chip-on-board electronic devices
06/03/2003US6573123 Semiconductor chip package and manufacturing method thereof
06/03/2003US6573121 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
06/03/2003US6573119 Semiconductor device and method of manufacture thereof
06/03/2003US6573113 Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads
06/03/2003US6573028 Reducing number of fabricating steps
06/03/2003US6572982 Electromigration-resistant copper microstructure
06/03/2003US6572980 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics
06/03/2003US6572955 Mixed oxides of silicone, aluminum, magnesium, zinc and boron ,(30-50% by weight, crystal phase containing oxides of zinc and aluminum, 5-15% of crystal phase of silica and magnesium oxide, 40 to 60% amorphous silica or silica and boron oxide)
06/03/2003US6572781 Microelectronic packaging methods and components
06/03/2003US6572672 A non-stoichiometric non-equilibrium material, especially a metal or polymer
06/03/2003US6572388 Socket for testing IC package
06/03/2003US6572387 Flexible circuit connector for stacked chip module
06/03/2003US6572279 Light-emitting module
06/03/2003US6572004 Hermetically sealed component assembly package
06/03/2003US6571859 Heat sink and process and molding tool for production of same
06/03/2003US6571595 Method of forming a package for electronic parts
06/03/2003US6571569 Method and apparatus for high heat flux heat transfer
06/03/2003US6571485 Structure of an overlay mark and its dosimetry application
06/03/2003US6571469 Method for manufacturing modular board
06/03/2003US6571468 Precise alignment of interconnect layer in semiconductors
05/2003
05/30/2003WO2003045123A1 Interposer
05/30/2003WO2003045122A1 Method of making an interposer
05/30/2003WO2003044871A1 A method of manufacturing a semiconductor device
05/30/2003WO2003044863A1 Methods of fabricating highly conductive regions in semiconductor substrates for radio frequency applications
05/30/2003WO2003044862A1 Semiconductor device
05/30/2003WO2003044859A1 Multi-chip circuit module and method for producing the same
05/30/2003WO2003044858A2 Semiconductor device and method of enveloping an integrated circuit
05/30/2003WO2003044857A1 Package for electronic component, and piezoelectric vibrating device using the package for electronic component
05/30/2003WO2003044850A1 Apparatus for molding a semiconductor wafer and process therefor
05/30/2003WO2003044843A2 Forming low k dielectric layers
05/30/2003WO2003044733A1 Method for making a module comprising at least an electronic component
05/30/2003WO2003044089A1 Thermosetting resin compositions useful as underfill sealants
05/30/2003WO2003043774A1 A wire bonder for ball bonding insulated wire and method of using same
05/30/2003WO2003024724A3 Dry thermal interface material
05/30/2003WO2002101822A3 Interconnection in semiconductor device and method for manufacturing the same
05/30/2003WO2002093649A3 Electronic module and method for assembling same
05/30/2003WO2002086970A3 Semiconductor device and method of manufacturing the same
05/30/2003WO2002080272A3 Insulated bond wire assembly process technology for integrated circuits
05/30/2003WO2002071482A3 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit
05/30/2003WO2002067325A3 High-density flip-chip interconnect
05/30/2003WO2002063687A3 Screening device for integrated circuits
05/30/2003WO2002052645A3 Enhanced die-up ball grid array packages and method for making the same
05/30/2003WO2002003461A3 Ball limiting metallurgy for input/outputs and methods of fabrication
05/30/2003CA2467815A1 Method for making a module comprising at least an electronic component
05/29/2003US20030100691 Porous low k (<2.0) thin film derived from homo-transport-polymerization
05/29/2003US20030100427 For use in parts of electric and electronic appliances; can be co-fired with silver electrodes
05/29/2003US20030100200 Buried solder bumps for AC-coupled microelectronic interconnects
05/29/2003US20030100195 Semiconductor device having an indium doped dielectric layer located therein and a method of manufacture therefor
05/29/2003US20030100182 Method for formation of copper diffusion barrier film using aluminum
05/29/2003US20030100181 Semiconductor device having multi-layer copper line and method of forming the same
05/29/2003US20030100178 Method for manufacturing a semiconductor device
05/29/2003US20030100176 Metal via contact of a semiconductor device and method for fabricating the same
05/29/2003US20030100175 Low dielectric constant material, process for preparing the same, insulating film comprising the same and semiconductor device
05/29/2003US20030100174 Process for making a ball grid array semiconductor package
05/29/2003US20030100154 Method for enhancing the electric connection between a power electronic device and its package
05/29/2003US20030100148 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore
05/29/2003US20030100147 Method of affixing a heat sink to a substrate and package thereof
05/29/2003US20030100146 Method of fabricating multilayer ceramic substrate
05/29/2003US20030100145 Metal plated spring structure
05/29/2003US20030100143 Forming defect prevention trenches in dicing streets
05/29/2003US20030100142 Semiconductor package and method for fabricating the same
05/29/2003US20030100137 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation
05/29/2003US20030100134 Drift region positioned on cathode comprising multiple doped epilayers
05/29/2003US20030100132 Method of forming a test pattern, method of measuring an etching characteristic using the same and a circuit for measuring the etching characteristic
05/29/2003US20030099836 Thermal management device and method of making such a device
05/29/2003US20030099767 Bumping process for chip scale packaging
05/29/2003US20030099737 Forming tool for forming a contoured microelectronic spring mold
05/29/2003US20030099557 Temperature-difference radiating apparatus
05/29/2003US20030099279 Phonon-blocking, electron-transmitting low-dimensional structures
05/29/2003US20030099144 Semiconductor memory devices having dummy active regions
05/29/2003US20030099092 Joining structure of heat-radiating plate and optoelectronic heat-emitting device
05/29/2003US20030099074 Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device
05/29/2003US20030098912 Solid-state image pickup apparatus and fabricating method thereof
05/29/2003US20030098767 Process for fabricating an electronic component incorporating an inductive microcomponent
05/29/2003US20030098766 Process for fabricating an electronic component incorporating an inductive microcomponent
05/29/2003US20030098762 Saw device
05/29/2003US20030098757 Duplexer and electronic device using the same
05/29/2003US20030098706 Charge detector semiconductor component, system comprising a charge detector semiconductor component and a reference semiconductor component, wafer, use of a wafer, and method for the qualitative and quantitative measurement of charging of a wafer
05/29/2003US20030098588 Method and apparatus for converting dissipated heat to work energy
05/29/2003US20030098514 Packages for semiconductor die
05/29/2003US20030098513 Method for bonding inner leads to bond pads without bumps and structures formed
05/29/2003US20030098512 150 degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098510 Current crowding reduction technique for flip chip package technology
05/29/2003US20030098508 120 Degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098506 Semiconductor device having a semiconductor chip and a lead substrate connected with each other through pads and patterned lead wires without short-circuiting the pads
05/29/2003US20030098505 Semiconductor module
05/29/2003US20030098504 Semiconductor memory module having double-sided stacked memory chip layout
05/29/2003US20030098503 Frame for semiconductor package
05/29/2003US20030098502 Semiconductor package substrate, semiconductor package
05/29/2003US20030098501 Semiconductor with a stress reduction layer and manufacturing method therefor
05/29/2003US20030098500 180 degree bump placement layout for an integrated circuit power grid
05/29/2003US20030098498 Leadframe and component with a leadframe
05/29/2003US20030098497 Barrier layers for protecting metal oxides from hydrogen degradation
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