Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2003
05/29/2003US20030098495 Semiconductor device
05/29/2003US20030098494 Wafer level packaging for making flip-chips
05/29/2003US20030098487 Semiconductor device with metal gate electrode and silicon oxynitride spacer
05/29/2003US20030098484 Semiconductor device and method for fabricating the same
05/29/2003US20030098473 Semiconductor device and method for fabricating the same
05/29/2003US20030098472 High-frequency module
05/29/2003US20030098470 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
05/29/2003US20030098469 Shielding arrangement to protect a circuit from stray magnetic fields
05/29/2003US20030098468 Multi-chip module semiconductor devices
05/29/2003US20030098467 Interconnect structure for an integrated circuit and corresponding fabrication method
05/29/2003US20030098179 Multi-layer wiring board and method of producing same
05/29/2003US20030098178 Printed circuit board having test points formed on sides thereof
05/29/2003US20030098177 Multi-layer circuit board
05/29/2003US20030097846 Active temperature gradient reducer
05/29/2003US20030097839 Method and apparatus for converting dissipated heat to work energy
05/29/2003US20030097750 Manufacturing method of electronic circuit including multilayer circuit board
05/29/2003CA2409237A1 Process for the manufacture of an electronic component containing an inductive micro-component
05/29/2003CA2409232A1 Process for the manufacture of an electronic component containing an inductive micro-component
05/28/2003EP1315207A2 Semiconductor module
05/28/2003EP1315206A2 Semiconductor apparatus of a plurality of semiconductor devices enclosed in a case and wiring method therefore
05/28/2003EP1315205A1 Power module and power module with heat sink
05/28/2003EP1315203A2 Semiconductor device with different bonding configurations
05/28/2003EP1314201A1 Method for producing an antifuse and antifuse for allowing selective electrical connection of neighbouring conductive zones
05/28/2003EP1314200A2 Hybrid substrate with embedded capacitors and methods of manufacture
05/28/2003EP1314199A2 Electronic assembly comprising solderable thermal interface and methods of manufacture
05/28/2003EP1314196A1 Method for making an integrated circuit capable of being surface-mounted and resulting circuit
05/28/2003EP1314191A1 Composite structure for electronic microsystems and method for production of said composite structure
05/28/2003EP1314189A2 Doped elongated semiconductors, their growth and applications
05/28/2003DE10205026C1 Semiconductor substrate used for vertical integration of integrated circuits comprises a first conductor strip on its front side, and a region formed by insulating trenches and electrically insulated from the substrate
05/28/2003CN2553593Y Easy-to-assemble-and-change top and down clamping fastening structure for radiator
05/28/2003CN2553514Y 改良型散热器 Modified radiator
05/28/2003CN2553513Y Fixed device for radiating fin
05/28/2003CN2553426Y Central processing unit radiator fastening device
05/28/2003CN2553425Y Adjustable-gap central processing unit radiating module
05/28/2003CN2553424Y Radiator combined structure
05/28/2003CN1421044A Housing assembly for electronic component
05/28/2003CN1420904A Composite of powdered fillers and polymer matrix and process for preparing them
05/28/2003CN1420718A Heat sink and mfg. method thereof
05/28/2003CN1420714A Thin circuit board and method for mfg. same
05/28/2003CN1420643A Radio Communication apparatus comprising heat dissipation system
05/28/2003CN1420637A Passive device and module of transceiver
05/28/2003CN1420585A Connector for integrated circuit and assembly used in IC
05/28/2003CN1420563A 半导体装置 Semiconductor device
05/28/2003CN1420560A Semiconductor device and mfg. method thereof
05/28/2003CN1420559A 半导体装置 Semiconductor device
05/28/2003CN1420558A Heat radiation structure
05/28/2003CN1420557A Heat radiation plate with embeded tip and package thereof
05/28/2003CN1420555A Semiconductor device and method for mfg. same
05/28/2003CN1420545A Method for design of semconductor device, and semiconductor device
05/28/2003CN1420538A Method for mfg. semiconductor device, semiconductor device and assembling method trereof
05/28/2003CN1420537A Method and device for mfg. parts after installation of electronic element
05/28/2003CN1420530A Oxygen doped Si-C compound etching stop layer
05/28/2003CN1420527A Method for mfg. semiconductor device
05/28/2003CN1110233C 半导体装置 Semiconductor device
05/28/2003CN1110097C Clock skew minimization system and method for IC
05/28/2003CN1110094C Method and apparatus for stress relieved electronic module
05/28/2003CN1110093C Transistor overload protection circuit
05/28/2003CN1110092C Method of mfg. semiconductor device with pair of radiating terminals and plurality of lead terminals
05/28/2003CN1110091C Semiconductor device free from short-circuit between bump electrodes and separation from circuit board and process of fabrication thereof
05/28/2003CN1110090C Fastening device
05/28/2003CN1110089C Semiconductor device
05/28/2003CN1110088C Improved PTFE thin film chip carrier
05/28/2003CN1110087C Clamp assembly for retention of fragile conductive trace with protective clamp
05/28/2003CN1110086C Holder structure of IC package and its manufacture method
05/28/2003CN1110084C Miniaturized contact in semiconductor substrate and method for forming same
05/28/2003CN1110083C Method for making semiconductor device
05/28/2003CN1110079C Electronic part device
05/28/2003CN1110078C Method for mounting semiconductor element
05/28/2003CN1110077C Semiconductor device assembling method and semiconductor device produced by method
05/28/2003CN1110076C Method for mfg. electronic element with organic substrate
05/28/2003CN1110075C Method of fabricating semiconductor device
05/28/2003CN1110063C Substrate with solder alloy for assembling electronic component
05/28/2003CN1109702C Epoxy resin compn. for printed wiring board and laminated board produced with use of same
05/27/2003US6571380 Integrated circuit with layout matched high speed lines
05/27/2003US6571379 Semiconductor integrated circuit and semiconductor integrated circuit wiring layout method
05/27/2003US6570781 Logic process DRAM
05/27/2003US6570776 Shielded electronics package structure with enhanced mechanical reliability
05/27/2003US6570765 Over-voltage protection for electronic circuits
05/27/2003US6570763 Heat sink securing means
05/27/2003US6570760 CPU cooling arrangement for portable computer
05/27/2003US6570642 Method and apparatus for placing identifying mark on semiconductor wafer
05/27/2003US6570477 Low inductance multilayer chip and method for fabricating same
05/27/2003US6570469 Multilayer ceramic device including two ceramic layers with multilayer circuit patterns that can support semiconductor and saw chips
05/27/2003US6570433 Laser fuseblow protection method for silicon on insulator (SOI) transistors
05/27/2003US6570362 Portable electronic device with enhanced battery life and cooling
05/27/2003US6570271 Apparatus for routing signals
05/27/2003US6570263 All the plated wires utilizing the coverage of the solder mask can be entirely cut without the pulling problem from the cutter.
05/27/2003US6570261 Method and apparatus for injection molded flip chip encapsulation
05/27/2003US6570260 Solder process and solder alloy therefor
05/27/2003US6570259 Apparatus to reduce thermal fatigue stress on flip chip solder connections
05/27/2003US6570256 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
05/27/2003US6570255 A seed layer of a first metal is first deposited into an interconnect opening; the semiconductor structure is then annealed at a temperature sufficient to grow the average grain size in the seed layer to at least the film thickness.
05/27/2003US6570251 Under bump metalization pad and solder bump connections
05/27/2003US6570249 Semiconductor package
05/27/2003US6570248 Structure and method for a high-performance electronic packaging assembly
05/27/2003US6570247 Integrated circuit device having an embedded heat slug
05/27/2003US6570245 Stress shield for microelectronic dice
05/27/2003US6570244 Multi-part lead frame with dissimilar materials
05/27/2003US6570243 At least one of the first dummy interconnect and the second dummy interconnect is connected with at least two of the dummy via holes.
05/27/2003US6570238 Preweakened on chip metal fuse using dielectric trenches for barrier layer isolation
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