Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/05/2003US20030102156 Ball grid array package
06/05/2003US20030102154 Methods of making anisotropic conductive elements for use in microelectronic packaging
06/05/2003US20030102118 Composite overmolded heat pipe construction
06/05/2003US20030102117 Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate
06/05/2003US20030102110 Cooling apparatus
06/05/2003US20030102109 Cooling apparatus
06/05/2003US20030102108 Cooling system for electronics with improved thermal interface
06/05/2003US20030101610 Structure of an overlay mark and its dosimetry application
06/05/2003US20030101582 Adjusting fillet geometry to couple a heat spreader to a chip carrier
06/05/2003US20030101581 Strain relief for substrates having a low coefficient of thermal expansion
06/05/2003DE20303068U1 Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fan
06/05/2003DE20302177U1 Micro-technological building block for electronic components has frame made of non-conducting material holding metal contacts for electronic circuit
06/05/2003CA2468065A1 Optimised use of pcms in cooling devices
06/04/2003EP1317001A1 A semiconductor device
06/04/2003EP1317000A2 Semiconductor device having leadless package structure
06/04/2003EP1316999A1 Method and device of contacting power electronic devices
06/04/2003EP1316998A2 Bumpless Chip Scale Device (CSP) and board assembly
06/04/2003EP1316997A2 Press contact converter
06/04/2003EP1316996A2 Semiconductor device
06/04/2003EP1316995A1 Semiconductor device and method for manufacturing the same
06/04/2003EP1316989A2 Method and apparatus for calibrating marking position in chip scale marker
06/04/2003EP1316974A1 Fabrication process for electronic component with incorporated microinductance
06/04/2003EP1316912A2 Protection of exposed semiconductor chip using thin polymer coatings
06/04/2003EP1316803A2 Lithographic contact elements
06/04/2003EP1316140A1 Portable electronic device with enhanced battery life and cooling
06/04/2003EP1316112A2 Improved chip crack stop design for semiconductor chips
06/04/2003EP1316108A1 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
06/04/2003EP1315621A1 Method for marking a device using a green laser
06/04/2003EP1135693B1 Probe card for probing wafers with raised contact elements
06/04/2003EP1135690B1 Lithographic contact elements
06/04/2003EP0812258B1 Electrical feedthroughs for ceramic circuit board support substrates
06/04/2003EP0779772B1 Printed wiring board, method of producing the same and electronic devices
06/04/2003CN2554799Y Panel vacuum superconduction radiator
06/04/2003CN2554798Y Inserted fin radiator
06/04/2003CN2554707Y Fixed module of central processing unit
06/04/2003CN1422440A Contactless interconnection system
06/04/2003CN1422418A Component provided with a description
06/04/2003CN1422108A Printed circuit board with testing point formed at side
06/04/2003CN1422071A Solid imaging apparatus and producing method thereof
06/04/2003CN1421999A Duplexer and electronic equipment using the same duplexer
06/04/2003CN1421928A Semiconductor device with embedded electric conducting layer and producing method thereof
06/04/2003CN1421927A 半导体器件 Semiconductor devices
06/04/2003CN1421925A Semiconductor assembly
06/04/2003CN1421924A Manufacture of heat pipe for heat dissipating plate
06/04/2003CN1421923A Dry fast heat radiator
06/04/2003CN1421922A 半导体器件 Semiconductor devices
06/04/2003CN1421921A Semiconductor package assembly with central lead and its packaging method
06/04/2003CN1421920A Substrate for setting passive module
06/04/2003CN1421910A Image pick-up sensor chip packing method and structure
06/04/2003CN1421899A Method for producing semiconductor equipment
06/04/2003CN1421833A Planar display and its driver chip
06/04/2003CN1421747A Superposed mark structure and its measurement application
06/04/2003CN1421723A Optical transmission receiver module and producing method, electronic device using with the same module
06/04/2003CN1110855C Semiconductor device and its passivation method
06/04/2003CN1110846C Production method of semiconductor apparatus
06/04/2003CN1110772C Chip module
06/04/2003CN1110771C Carrier structural element
06/04/2003CN1110666C Thermoelectric cooling equipment and method for operating the said equipment
06/03/2003US6574250 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
06/03/2003US6574113 Electronic package with stacked connections and method for making same
06/03/2003US6574109 Retainer device for heat sink assembly
06/03/2003US6574107 Stacked intelligent power module package
06/03/2003US6574106 Mounting structure of semiconductor device
06/03/2003US6574101 Portable electronic device capable of efficiently cooling heat-generation electronic component
06/03/2003US6574091 Multi-plate capacitor structure
06/03/2003US6574087 Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated
06/03/2003US6573804 Electronic apparatus having a printed circuit board with multi-point grounding
06/03/2003US6573652 The device includes a substrate, an environmentally sensitive display device adjacent to the substrate, and at least one first barrier stack adjacent to the environmentally sensitive display device. The barrier stack encapsulates the
06/03/2003US6573612 Resin-encapsulated semiconductor device including resin extending beyond edge of substrate
06/03/2003US6573611 Dual-lead type square semiconductor package and dual in-line memory module using the same
06/03/2003US6573610 Substrate of semiconductor package for flip chip package
06/03/2003US6573609 Microelectronic component with rigid interposer
06/03/2003US6573607 Semiconductor device and manufacturing method thereof
06/03/2003US6573606 Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect
06/03/2003US6573605 Semiconductor integrated circuit device, design method for semiconductor integrated circuit device, design aiding device for semiconductor integrated circuit device, program, and program recording medium
06/03/2003US6573604 Semiconductor device carrying memory and logic circuit on a chip and method of manufacturing the same
06/03/2003US6573603 Semiconductor device, and method of manufacturing the same
06/03/2003US6573602 Semiconductor device with a self-aligned contact and a method of manufacturing the same
06/03/2003US6573600 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
06/03/2003US6573598 Semiconductor device and method of fabricating the same
06/03/2003US6573596 Non-rectangular thermo module wafer cooling device using the same
06/03/2003US6573595 Ball grid array semiconductor package with resin coated metal core
06/03/2003US6573594 BGA semiconductor device using insulating film
06/03/2003US6573593 Integrated circuit with a housing accommodating the integrated circuit
06/03/2003US6573592 Semiconductor die packages with standard ball grid array footprint and method for assembling the same
06/03/2003US6573591 Spherical semiconductor device and method of mounting the same on a substrate
06/03/2003US6573590 Integrated circuit package with EMI containment features
06/03/2003US6573585 Electrically blowable fuse with reduced cross-sectional area
06/03/2003US6573572 Damascene structure and method of making
06/03/2003US6573568 ESD protection devices and methods for reducing trigger voltage
06/03/2003US6573567 IC card
06/03/2003US6573566 Low-voltage-triggered SOI-SCR device and associated ESD protection circuit
06/03/2003US6573565 Method and structure for providing improved thermal conduction for silicon semiconductor devices
06/03/2003US6573544 Data input/output line structure having reduced resistance
06/03/2003US6573538 Semiconductor device with internal heat dissipation
06/03/2003US6573459 Graded metallic leads for connection to microelectronic elements
06/03/2003US6573458 Printed circuit board
06/03/2003US6573211 Perovskite mixed oxide
06/03/2003US6573174 Method for reducing surface defects of semiconductor substrates
06/03/2003US6573171 Semiconductor device and manufacturing process thereof
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