| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/15/2014 | CN103515307A Semiconductor device having buried bit line and method for fabricating the same |
| 01/15/2014 | CN103515305A 3d ic stacking device and method of manufacture |
| 01/15/2014 | CN103515304A Etch damage and esl free dual damascene metal interconnect |
| 01/15/2014 | CN103515265A Method for detecting alignment deviation of through holes and lower layers of metal wires |
| 01/15/2014 | CN103515261A Method for manufacturing semiconductor device, and semiconductor device |
| 01/15/2014 | CN103515256A A method for manufacturing a chip package, a chip package and a wafer level package |
| 01/15/2014 | CN103515254A Chip arrangements and a method for forming a chip arrangement |
| 01/15/2014 | CN103515252A Semiconductor device and method of forming an embedded SOP fan-out package |
| 01/15/2014 | CN103515251A Bonding package components through plating |
| 01/15/2014 | CN103515249A Firstly-packaged secondly-etched three-dimensional system level chip front-installed bump packaged structure and technology method thereof |
| 01/15/2014 | CN103515248A Solder flow impeding feature on a lead frame |
| 01/15/2014 | CN103515246A Method of manufacturing a semiconductor device, and semiconductor device |
| 01/15/2014 | CN103515221A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515195A Substrate resistor and method of making same |
| 01/15/2014 | CN103513172A Transistor test circuit with small pin number |
| 01/15/2014 | CN103512508A Method for testing semiconductor device |
| 01/15/2014 | CN102623445B Rectifier bridge arm |
| 01/15/2014 | CN102456659B Semiconductor chip having different pad width to ubm width ratios and method of manufacturing the same |
| 01/15/2014 | CN102403275B Package on package structure and fabricating method for same |
| 01/15/2014 | CN102332438B Inductive bond-wire circuit |
| 01/15/2014 | CN102254885B Passive device, passive device-embedded circuit board and manufacturing method |
| 01/15/2014 | CN102162744B Flow sensor, method for manufacturing flow sensor and flow sensor module |
| 01/15/2014 | CN102156387B Radiation-sensitive composition and cured film |
| 01/15/2014 | CN101471317B Leadframe package and leadframe |
| 01/14/2014 | USRE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size |
| 01/14/2014 | US8629568 Semiconductor device cover mark |
| 01/14/2014 | US8629567 Integrated circuit packaging system with contacts and method of manufacture thereof |
| 01/14/2014 | US8629566 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
| 01/14/2014 | US8629565 Thin wafer protection device |
| 01/14/2014 | US8629564 Semiconductor electronic component and semiconductor device using the same |
| 01/14/2014 | US8629563 Method for packaging semiconductor dies having through-silicon vias |
| 01/14/2014 | US8629562 Techniques for modular chip fabrication |
| 01/14/2014 | US8629561 Air gap-containing interconnect structure having photo-patternable low k material |
| 01/14/2014 | US8629559 Stress reduction apparatus with an inverted cup-shaped layer |
| 01/14/2014 | US8629558 Techniques for packaging multiple device components |
| 01/14/2014 | US8629557 Structures and methods for detecting solder wetting of pedestal sidewalls |
| 01/14/2014 | US8629556 Semiconductor device |
| 01/14/2014 | US8629555 Fixture for semiconductor device and assembly of semiconductor device |
| 01/14/2014 | US8629554 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
| 01/14/2014 | US8629553 3D integrated circuit device fabrication with precisely controllable substrate removal |
| 01/14/2014 | US8629552 Top port multi-part surface mount silicon condenser microphone package |
| 01/14/2014 | US8629551 Bottom port surface mount silicon condenser microphone package |
| 01/14/2014 | US8629550 Printed wiring board with crossing wiring pattern |
| 01/14/2014 | US8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body |
| 01/14/2014 | US8629548 Clock network fishbone architecture for a structured ASIC manufactured on a 28 NM CMOS process lithographic node |
| 01/14/2014 | US8629547 Semiconductor chip package |
| 01/14/2014 | US8629546 Stacked redistribution layer (RDL) die assembly package |
| 01/14/2014 | US8629545 Stub minimization for assemblies without wirebonds to package substrate |
| 01/14/2014 | US8629544 Integrated circuit package with multiple dies and a multiplexed communications interface |
| 01/14/2014 | US8629543 Electrically interconnected stacked die assemblies |
| 01/14/2014 | US8629541 Semiconductor package for controlling warpage |
| 01/14/2014 | US8629540 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires |
| 01/14/2014 | US8629539 Methods and apparatus for magnetic sensor having non-conductive die paddle |
| 01/14/2014 | US8629538 Power module package |
| 01/14/2014 | US8629537 Padless die support integrated circuit package system |
| 01/14/2014 | US8629535 Mask for forming integrated circuit |
| 01/14/2014 | US8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof |
| 01/14/2014 | US8629481 Semiconductor integrated circuit device |
| 01/14/2014 | US8629435 Methods of extracting fin heights and overlap capacitance and structures for performing the same |
| 01/14/2014 | US8629059 Methods of forming integrated circuit chips having vertically extended through-substrate vias therein |
| 01/14/2014 | US8629053 Plasma treatment for semiconductor devices |
| 01/14/2014 | US8629050 E-fuse structure design in electrical programmable redundancy for embedded memory circuit |
| 01/14/2014 | US8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages |
| 01/14/2014 | CA2690795C Metal bonded nanotube array |
| 01/10/2014 | DE202013011130U1 Chipsystem Chip system |
| 01/09/2014 | WO2014008497A1 Sensor mems device cantilever packaging |
| 01/09/2014 | WO2014008225A1 Retention structure for heat generating component |
| 01/09/2014 | WO2014007986A1 Parasitic capacitance compensating transmission line |
| 01/09/2014 | WO2014007950A1 Liquid compression molding encapsulants |
| 01/09/2014 | WO2014007919A1 Circuit assembly |
| 01/09/2014 | WO2014007470A1 Photocurable composition, and optical member including protective layer made of said composition |
| 01/09/2014 | WO2014007354A1 Ebullient cooling device |
| 01/09/2014 | WO2014006787A1 Electronic component mounting structure, ic card, and cof package |
| 01/09/2014 | WO2014006724A1 Semiconductor device |
| 01/09/2014 | WO2014006699A1 Semiconductor package and method for manufacturing same |
| 01/09/2014 | WO2014006682A1 Semiconductor device and method for manufacturing same |
| 01/09/2014 | WO2014006655A1 Group iii nitride semiconductor element, and method for producing same |
| 01/09/2014 | WO2014006562A1 Handle for semiconductor-on-diamond wafers and method of manufacture |
| 01/09/2014 | WO2014006296A1 Method for assembling and encapsulating lithium microbatteries and microbatteries produced thereby |
| 01/09/2014 | WO2014005351A1 Backlight module and led packaging structure |
| 01/09/2014 | WO2014005246A1 Chemical nickel plating bump structure of wafer soldering pad and manufacturing method therefor |
| 01/09/2014 | WO2013171226A3 An electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle |
| 01/09/2014 | WO2008021220A3 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities |
| 01/09/2014 | US20140013411 Surgically implantable devices with a computer, a faraday cage and at least one internal flexibility sipe |
| 01/09/2014 | US20140011326 Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| 01/09/2014 | US20140011325 Method for manufacturing semiconductor package |
| 01/09/2014 | US20140011012 Resin composition and sheet using the same |
| 01/09/2014 | US20140009219 Die power structure |
| 01/09/2014 | US20140008822 Liquid compression molding encapsulants |
| 01/09/2014 | US20140008821 Sealing resin sheet, method for producing electronic component package and electronic component package |
| 01/09/2014 | US20140008820 Method for fabricating semiconductor device |
| 01/09/2014 | US20140008819 Substrate structure, semiconductor package and methods of fabricating the same |
| 01/09/2014 | US20140008818 Method and apparatus for stacked semiconductor chips |
| 01/09/2014 | US20140008817 Through silicon via (tsv) isolation structures for noise reduction in 3d integrated circuit |
| 01/09/2014 | US20140008816 Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus |
| 01/09/2014 | US20140008815 Semiconductor Devices |
| 01/09/2014 | US20140008814 Substrate for semiconductor package and process for manufacturing |
| 01/09/2014 | US20140008813 Compliant monopoloar micro device transfer head with silicon electrode |
| 01/09/2014 | US20140008811 Device package with rigid interconnect structure connecting die and substrate and method thereof |
| 01/09/2014 | US20140008810 Method for forming through silicon via with wafer backside protection |