Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/10/2003US6577503 Vertical surface mount apparatus with thermal carrier
06/10/2003US6577490 Wiring board
06/10/2003US6577149 Method and device for addressable failure site test structure
06/10/2003US6577032 Rectifier unit of vehicle AC generator
06/10/2003US6577020 High contrast alignment marks having flexible placement
06/10/2003US6577019 Alignment and orientation features for a semiconductor package
06/10/2003US6577018 Integrated circuit device having reduced bow and method for making same
06/10/2003US6577017 Bond pad having vias usable with antifuse process technology
06/10/2003US6577016 Semiconductor device having adhesive inflow preventing means
06/10/2003US6577015 Partial slot cover for encapsulation process
06/10/2003US6577013 Chip size semiconductor packages with stacked dies
06/10/2003US6577012 Laser defined pads for flip chip on leadframe package
06/10/2003US6577011 Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
06/10/2003US6577009 Use of sic for preventing copper contamination of dielectric layer
06/10/2003US6577008 Metal redistribution layer having solderable pads and wire bondable pads
06/10/2003US6577004 Solder ball landpad design to improve laminate performance
06/10/2003US6577003 Semiconductor chip carrier affording a high-density external interface
06/10/2003US6577002 180 degree bump placement layout for an integrated circuit power grid
06/10/2003US6577001 Semiconductor device and the method for manufacturing the same
06/10/2003US6577000 Premold type semiconductor package
06/10/2003US6576999 Mounting structure for an electronic component having an external terminal electrode
06/10/2003US6576998 Thin semiconductor package with semiconductor chip and electronic discrete device
06/10/2003US6576997 Semiconductor device and method for fabricating the same
06/10/2003US6576995 Housing for semiconductor chips
06/10/2003US6576994 Semiconductor device
06/10/2003US6576993 Packages formed by attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip
06/10/2003US6576992 Chip scale stacking system and method
06/10/2003US6576991 Device with integrated circuit protected against attacks made by the controlled destruction of an additional layer
06/10/2003US6576990 Stress-free silicon wafer and a die or chip made therefrom and method
06/10/2003US6576989 Locking of mold compound to conductive substrate panels
06/10/2003US6576988 Semiconductor package
06/10/2003US6576987 Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
06/10/2003US6576986 Semiconductor device with resin package
06/10/2003US6576985 Semiconductor device packaging assembly
06/10/2003US6576984 Semiconductor apparatus and electronic system
06/10/2003US6576983 Controlled impedance leads in a leadframe for high frequency applications
06/10/2003US6576982 Use of sion for preventing copper contamination of dielectric layer
06/10/2003US6576976 Semiconductor integrated circuit with an insulation structure having reduced permittivity
06/10/2003US6576970 Bonding pad structure of semiconductor device and method for fabricating the same
06/10/2003US6576961 Substrate resistance ring
06/10/2003US6576959 Device and method of low voltage SCR protection for high voltage failsafe ESD applications
06/10/2003US6576936 Bipolar transistor with an insulated gate electrode
06/10/2003US6576923 Inspectable buried test structures and methods for inspecting the same
06/10/2003US6576922 Ferroelectric capacitor plasma charging monitor
06/10/2003US6576865 Laser trimming program generation method
06/10/2003US6576848 Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
06/10/2003US6576568 Using organosilicon compound, nonionic surfactant and acid catalyst
06/10/2003US6576567 Film deposition method and apparatus for semiconductor devices
06/10/2003US6576549 Fabrication of a metalized blind via
06/10/2003US6576542 Conductive lines, coaxial lines, integrated circuitry, and methods of forming conductive lines, coaxial lines, and integrated circuitry
06/10/2003US6576541 Method and structure for producing bumps on an IC package substrate
06/10/2003US6576540 Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads
06/10/2003US6576529 Method of forming an alignment feature in or on a multilayered semiconductor structure
06/10/2003US6576510 Method of producing a semiconductor memory device using a self-alignment process
06/10/2003US6576508 Formation of a frontside contact on silicon-on-insulator substrate
06/10/2003US6576505 Method for transferring and stacking of semiconductor devices
06/10/2003US6576499 Electronic device assembly and a method of connecting electronic devices constituting the same
06/10/2003US6576498 Semiconductor device and a method of manufacturing the same
06/10/2003US6576496 Method and apparatus for encapsulating a multi-chip substrate array
06/10/2003US6576494 Recessed encapsulated microelectronic devices and methods for formation
06/10/2003US6576493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
06/10/2003US6576491 Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame
06/10/2003US6576487 Method to distinguish an STI outer edge current component with an STI normal current component
06/10/2003US6576485 Contact structure and production method thereof and probe contact assembly using same
06/10/2003US6576484 IC die analysis via back side circuit construction with heat dissipation
06/10/2003US6576481 Method of manufacturing semiconductor devices
06/10/2003US6576381 Semiconductor device
06/10/2003US6576355 Nanotechnology for electronic and opto-electronic devices
06/10/2003US6576152 Dry etching method
06/10/2003US6576057 Method and apparatus for application of spray adhesive to a leadframe for chip bonding
06/10/2003US6575354 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film
06/10/2003US6575231 Spiral step-shaped heat dissipating module
06/10/2003US6575229 Heat sink having folded fin heat exchanger core
06/10/2003US6574967 Cooling and heating apparatus using thermoelectric module
06/10/2003US6574859 Interconnection process for module assembly and rework
06/10/2003US6574858 Method of manufacturing a chip package
06/05/2003WO2003047325A1 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/05/2003WO2003046989A2 Multi-chip module semiconductor devices
06/05/2003WO2003046988A2 Electronic assembly
06/05/2003WO2003046986A2 Semiconductor device, and means for checking the authenticity
06/05/2003WO2003046985A1 Fib-protected semiconductor chip
06/05/2003WO2003046984A2 Electromagnetic shield
06/05/2003WO2003046983A1 Connection package for high-speed integrated circuit
06/05/2003WO2003046982A1 Optimised application of pcms in chillers
06/05/2003WO2003046981A1 Module structure and module comprising it
06/05/2003WO2003046980A2 Forming defect prevention trenches in dicing streets
06/05/2003WO2003046979A2 Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
06/05/2003WO2003046975A1 Single and multiple layer packaging of high-speed/high-density ics
06/05/2003WO2003046971A1 Method for forming an oxynitride spacer for a metal gate electrode using a pecvd process with a silicon-starving atmosphere
06/05/2003WO2003046956A1 An integrated circuit resistant to the formation of cracks in a passivation layer
06/05/2003WO2003046802A2 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof
06/05/2003WO2003046702A2 Active cooling system for cpu
06/05/2003WO2003046463A2 Stacked low profile cooling system and method for making same
06/05/2003WO2003046460A1 Improved heat exchanger
06/05/2003WO2003046105A1 Sealing composition and seals made by using the same
06/05/2003WO2003046098A1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/05/2003WO2003045584A1 Hot melt conductor paste composition
06/05/2003WO2003007375A3 Single package containing multiple integrated circuit devices
06/05/2003WO2002091466A3 An improved die mounting on a substrate
06/05/2003WO2002069389A3 Semiconductor wafer with process control modules
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