Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/12/2003US20030109122 Thick thermal oxide layers and isolation regions in a silicon-containing substrate for high voltage applications
06/12/2003US20030109118 Integrated inductor in semiconductor manufacturing
06/12/2003US20030109113 Method of making identification code of ROM and structure thereof
06/12/2003US20030109100 Semiconductor device having capacitive element and manufacturing method thereof
06/12/2003US20030109088 Semiconductor device and method for fabricating the same
06/12/2003US20030109084 Semiconductor device and method of manufacturing the same
06/12/2003US20030109083 Interconnecting substrates for electrical coupling of microelectronic components
06/12/2003US20030109082 Back side coating of semiconductor wafers
06/12/2003US20030109080 Flip chip underfill process
06/12/2003US20030109079 Semiconductor device manufacturing method and semiconductor device
06/12/2003US20030109078 Semiconductor device, method for manufacturing the same, and method for mounting the same
06/12/2003US20030109072 Process for producing a component module
06/12/2003US20030108729 Substrate and production method therefor
06/12/2003US20030107875 Power semiconductor module
06/12/2003US20030107459 Radio frequency module and method for manufacturing the same
06/12/2003US20030107427 Temperature compensation for internal inductor resistance
06/12/2003US20030107138 Die package
06/12/2003US20030107137 Micromechanical device contact terminals free of particle generation
06/12/2003US20030107136 Chip structure and process for forming the same
06/12/2003US20030107135 Semiconductor device with analysis prevention feature
06/12/2003US20030107134 Method of extracting interconnection capacitance of semiconductor integrated chip and recording medium for recording the same
06/12/2003US20030107133 Semiconductor device
06/12/2003US20030107132 Structure of the metal bumping on the input/output connector of a substrate or wafer and method for manufacturing the same
06/12/2003US20030107131 Semiconductor device having external connecting terminals and process for manufacturing the device
06/12/2003US20030107129 Resin encapsulated BGA-type semiconductor device
06/12/2003US20030107128 Package for microwave components
06/12/2003US20030107126 High performance multi-chip flip chip package
06/12/2003US20030107124 Semiconductor package with heat dissipating structure
06/12/2003US20030107123 Memory device power distribution in memory assemblies
06/12/2003US20030107122 Memory device power distribution in electronic systems
06/12/2003US20030107121 LOC leadframe
06/12/2003US20030107120 Intelligent motor drive module with injection molded package
06/12/2003US20030107119 Stacked semiconductor chips; dielectric overcoatings
06/12/2003US20030107118 Stacked packages
06/12/2003US20030107117 Semiconductor manufacturing using modular substrates
06/12/2003US20030107116 Windowframe capacitor
06/12/2003US20030107115 Tape under frame for lead frame IC package assembly
06/12/2003US20030107113 Stress shield for microelectronic dice
06/12/2003US20030107112 Aluminum leadframes for semiconductor devices and method of fabrication
06/12/2003US20030107111 A 3-d microelectronic structure including a vertical thermal nitride mask
06/12/2003US20030107110 Protective device; controlled heat expansion
06/12/2003US20030107109 Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method
06/12/2003US20030107105 Programmable chip-to-substrate interconnect structure and device and method of forming same
06/12/2003US20030107101 Semiconductor device and method for fabricating the same
06/12/2003US20030107093 Integrated thermal difference sensor for power dissipating device
06/12/2003US20030107090 Semiconductor device and manufacturing method thereof
06/12/2003US20030107085 Electrode means, a method for its manufacture, an apparatus comprising the electrode means as well as use of the latter
06/12/2003US20030107084 Method of manufacture of silicon on insulator device with improved heat removal
06/12/2003US20030107060 Composite module and process of producing same
06/12/2003US20030107056 Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
06/12/2003US20030107054 Semiconductor device and its manufacturing method
06/12/2003US20030107049 Semiconductor device and its manufacturing method
06/12/2003US20030107044 Semiconductor device, liquid crystal display device and method of manufacturing the semiconductor device
06/12/2003US20030107035 Semiconductor chip
06/12/2003US20030106924 Electronic circuit device and method for manufacturing the same
06/12/2003US20030106711 Solder resist opening to define a combination pin one indicator and fiducial
06/12/2003US20030106709 Interconnecting substrates for electrical coupling of microelectronic components
06/12/2003US20030106708 Heat sink securing means with back plate
06/12/2003US20030106671 Flat evaporator
06/12/2003US20030106670 Clip for heat sink
06/12/2003US20030106213 Angled flying lead wire bonding process
06/12/2003US20030106212 Method of attaching a heat sink to an IC package
06/12/2003US20030106209 Method and apparatus for manufacturing known good semiconductor die
06/12/2003DE20305516U1 Retaining means for holding a heat sink against a heat generating electronic unit
06/12/2003DE20304198U1 Heat sink for use with electronic processor modules in the form of a fluid cooling stage
06/12/2003DE20304194U1 Adapter system for a fluid cooler for cooling a electronic processor mounted on a base plate
06/12/2003DE20303390U1 Natural heat transfer cooling system uses a heat tube to transfer heat energy to heat sink
06/12/2003DE10136514C1 Verfahren zur Herstellung einer elektrisch leitenden Bondverbindung, sowie Bondverbindung A process for producing an electrically conductive bond, as well as bond
06/11/2003EP1318547A1 Power semiconductor module
06/11/2003EP1318546A1 Semiconductor device
06/11/2003EP1318545A1 Power semiconductor submodule and power semiconductor module
06/11/2003EP1318544A1 Method for manufacturing semiconductor device packages
06/11/2003EP1318531A1 Method for manufacturing electronic components and electronic component thereof
06/11/2003EP1318530A1 Inductor element having a high quality factor
06/11/2003EP1317801A2 Thick film millimeter wave transceiver module
06/11/2003EP1317776A2 Cmos transceiver having an integrated power amplifier
06/11/2003EP1317774A2 Method and apparatus for temperature gradient control in an electronic system
06/11/2003EP1317773A2 Direct build-up layer on an encapsulated die package having a moisture barrier structure
06/11/2003EP1317772A1 Semiconductor interconnection structure and method of fabrication
06/11/2003EP1317771A1 Improved semiconductor structure and method of fabrication
06/11/2003EP1317769A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component
06/11/2003EP1317701A1 Method for jamming power consumption of an integrated circuit
06/11/2003EP1204946B1 Scratchproof coating for semiconductor components
06/11/2003CN2555533Y CPU radiator
06/11/2003CN1423838A Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor
06/11/2003CN1423678A Flame retardant phosphorus element-containing epoxy resin compositions
06/11/2003CN1423674A Flame retardant epoxy molding compositions
06/11/2003CN1423375A Electric connector and its system arrangement method
06/11/2003CN1423342A Solid image-forming apparatus and making method thereof
06/11/2003CN1423335A Semiconductor memory device
06/11/2003CN1423330A 功率半导体模块 Power Semiconductor Modules
06/11/2003CN1423329A Power semiconductor secondary assembly and power semiconductor assembly
06/11/2003CN1423328A Semiconductor device of multi-layer wiring structure and making method thereof
06/11/2003CN1423327A Semiconductor device and its making method
06/11/2003CN1423326A Exposed signal line and semiconductor having gap between signal line and substrate sheet
06/11/2003CN1423325A 半导体装置 Semiconductor device
06/11/2003CN1423319A Method for making silicide film of plane unit storage element
06/11/2003CN1423315A Semiconductor module and production method thereof and module for IC card etc.
06/11/2003CA2409241A1 Process for manufacturing an electronic component incorporating an inductive microcomponent
06/10/2003US6577504 Integrated heat sink for different size components with EMI suppression features
1 ... 1638 1639 1640 1641 1642 1643 1644 1645 1646 1647 1648 1649 1650 1651 1652 1653 1654 1655 1656 1657 1658 ... 2262