Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/19/2003US20030113578 Heat-dissipating substrate, method for making the same, and semiconductor device including the same
06/19/2003US20030113556 Organofunctional silicone wax; conductive filler; interface material for an electronic component having a heat sink
06/19/2003US20030113076 Optical electronic device
06/19/2003US20030113072 Optical transmitter-receiver module, method of manufacturing the module, and electronic device using the module
06/19/2003US20030112714 Solid-state imaging apparatus and manufacturing method thereof
06/19/2003US20030112614 Ball grid array chip packages having improved testing and stacking characteristics
06/19/2003US20030112605 Power module and process for producing power modules
06/19/2003US20030112604 Multi-chip package with embedded cooling element
06/19/2003US20030112602 Structure and designing method of composite heat-dissipating structure
06/19/2003US20030112382 Liquid crystal display device
06/19/2003US20030112110 Embedded inductor for semiconductor device circuit
06/19/2003US20030112055 Anti-fuse circuit and method of operation
06/19/2003US20030111742 Semiconductor device
06/19/2003US20030111741 Semiconductor device capable of narrowing down failed point
06/19/2003US20030111740 Fuse structure integrated wire bonding on the low k interconnect and method for making the same
06/19/2003US20030111739 Semiconductor device and package thereof
06/19/2003US20030111738 Power/ground ring substrate for integrated circuits
06/19/2003US20030111736 Csp chip stack with flex circuit
06/19/2003US20030111735 Semiconductor devices and methods for fabricating the same
06/19/2003US20030111734 Semiconductor device, its manufacturing method, and electronic apparatus
06/19/2003US20030111733 Chip and wafer integration process using vertical connections
06/19/2003US20030111732 Superconductor device and method of manufacturing the same
06/19/2003US20030111731 Semiconductor device and method for producing the same
06/19/2003US20030111729 Method of making semiconductor device using an interconnect
06/19/2003US20030111728 Mounting material, semiconductor device and method of manufacturing semiconductor device
06/19/2003US20030111727 Semiconductor integrated circuit device and printed wired board for mounting the same
06/19/2003US20030111726 Ball grid array package substrates and method of making the same
06/19/2003US20030111725 Semiconductor device and method for manufacturing the same
06/19/2003US20030111724 Inspection device for inspecting the position of trademark on integrated circuit
06/19/2003US20030111723 Ceramic biomolecule imaging chip
06/19/2003US20030111722 Semiconductor device and method of fabricating the same
06/19/2003US20030111721 Semiconductor device, stacked type semiconductor device, and manufacturing method of semiconductor device
06/19/2003US20030111719 Electronic device and leadframe and methods for producing the electronic device and the leadframe
06/19/2003US20030111717 Semiconductor device and method of manufacturing the same
06/19/2003US20030111715 Current supply and support system for a thin package
06/19/2003US20030111714 Surface mount ceramic package
06/19/2003US20030111712 Low-dielectric constant structure with a multilayer stack of thin films with pores
06/19/2003US20030111711 Chip structure and process for forming the same
06/19/2003US20030111710 Metal core integrated circuit package with electrically isolated regions and associated methods
06/19/2003US20030111709 Packing device for embedding a capacitor on chip
06/19/2003US20030111605 Preventing the deformation of a thermopile, suppressing measurement error by coating a silicon nitride film as a first structure layer on a semiconductor substrate
06/19/2003US20030111516 Integrated quantum cold point coolers
06/19/2003US20030111441 Miniature microdevice package and process for making thereof
06/19/2003US20030111354 10-40 wt % of copper hexafluorosilicate and is used as an electrolyte
06/19/2003US20030111263 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens
06/19/2003US20030111213 Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
06/19/2003US20030111212 Capillary tube heat pipe and temperature controlling apparatus
06/19/2003US20030110981 Trivalent metallic atom complexes containig acetylacetonate and alcoholate
06/19/2003US20030110788 Method and apparatus for cooling an integrated circuit package using a cooling fluid
06/19/2003US20030110779 Apparatus and method for augmented cooling of computers
06/19/2003US20030110631 Method for fabricating a heat pipe structure in a radiating plate
06/19/2003US20030110629 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
06/19/2003US20030110627 Substrate for receiving a circuit configuration and method for producing the substrate
06/19/2003US20030110624 Solder resist opening to define a combination pin one indicator and fiducial
06/19/2003US20030110623 Electronic component mounting apparatus and electronic component mounting method
06/19/2003US20030110622 Semiconductor device and method for producing the same, and anisotropic conductive circuit board
06/19/2003US20030110621 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
06/19/2003US20030110603 Easily removed heatsink clip
06/19/2003CA2467037A1 Manufacturing method for semiconductor device
06/19/2003CA2414853A1 Optical module
06/18/2003EP1320287A1 Electrical connecting element and semi-finished product
06/18/2003EP1320286A2 Electronic module including a low temperature co-fired ceramic (LTCC) substrate with a capacitive structure embedded therein and related methods
06/18/2003EP1320132A2 Continous antifuse material in memory structure
06/18/2003EP1320131A2 antifuses
06/18/2003EP1320130A2 Semiconductor device and manufcaturing method thereof
06/18/2003EP1320129A1 Semiconductor electronic device and method of manufacturing thereof.
06/18/2003EP1320123A1 Manufacturing process of an electronic device comprising an inductive micro component
06/18/2003EP1320122A2 Electronic device
06/18/2003EP1319690A2 A thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same
06/18/2003EP1319326A1 Hermetically sealed component assembly package
06/18/2003EP1319249A2 Module, especially a wafer module
06/18/2003EP1282660A4 Rheology-controlled epoxy-based compositions
06/18/2003EP1097619B1 Integrated circuit module having springy contacts of at least two different types for reduced stress
06/18/2003EP0813750B1 Process for making a z-axis adhesive and establishing electrical interconnection therewith
06/18/2003DE20306201U1 Heat sink for use with electronic processors have series of metal pins across which air-flow occurs
06/18/2003DE20306042U1 Cooling element for electronic processors has finned body with groove for mounting clip
06/18/2003DE20305969U1 Cooling system for an electronic processor has heat pipe connected between processor and heat sink
06/18/2003CN2556788Y Side-blowing radiating module
06/18/2003CN2556787Y Radiator device
06/18/2003CN2556786Y Fastener for radiator
06/18/2003CN2556710Y Buckle of central processor
06/18/2003CN2556707Y Heat radiator module
06/18/2003CN1425199A Interconnection device and method
06/18/2003CN1425198A Active package for integrated circuit
06/18/2003CN1425197A Personalized hardware
06/18/2003CN1425196A Conductive interconnections
06/18/2003CN1425191A Semiconductor device and fabrication method thereof
06/18/2003CN1424769A Built-in protetive N-type high-voltage MOS transistors
06/18/2003CN1424763A Programmable element for programming utilizing resistance value change by phase change
06/18/2003CN1424759A Electronic devices
06/18/2003CN1424758A Semiconductor devices and manufacture thereof
06/18/2003CN1424757A Semiconductor devices and manufacture thereof
06/18/2003CN1424756A Metal wiring substrate, semiconductor device and manufacture thereof
06/18/2003CN1424755A Grid matrix packed body for enhancing electric connected ground and packing method thereof
06/18/2003CN1424751A Semiconductor element and system, wafers, its use and measuring method
06/18/2003CN1112088C Method for manufacture of certain equipment containing printed-circuit board
06/18/2003CN1112086C Perimeter matrix ball grid array circuit package and package method with populated center
06/18/2003CN1112085C Method and device for positioning and retaining micro-building-blocks
06/18/2003CN1111908C Semiconductor devices
06/18/2003CN1111907C Method for interconnecting on semiconductor device and interconnector thereof
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