Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/24/2003US6583516 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
06/24/2003US6583515 Ball grid array package for enhanced stress tolerance
06/24/2003US6583513 Integrated circuit package with an IC chip and pads that dissipate heat away from the chip
06/24/2003US6583512 Semiconductor device and method for fabricating the same
06/24/2003US6583511 Semiconductor device and a method of producing the same
06/24/2003US6583508 Integrated circuit with active regions having varying contact arrangements
06/24/2003US6583506 Semiconductor device
06/24/2003US6583505 Electrically isolated power device package
06/24/2003US6583504 Semiconductor die with attached heat sink and transfer mold
06/24/2003US6583501 Lead frame for an integrated circuit chip (integrated circuit peripheral support)
06/24/2003US6583500 Thin tin preplated semiconductor leadframes
06/24/2003US6583499 Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package
06/24/2003US6583492 Capacitor element having a contact hole structure in an electrode structure
06/24/2003US6583489 Method for forming interconnect structure with low dielectric constant
06/24/2003US6583483 Semiconductor device and its manufacturing method
06/24/2003US6583476 Electrostatic discharge protection for integrated semiconductor devices using channel stop field plates
06/24/2003US6583432 Conformal coating composed of matrix of densely packed parti-cles disbursed in binder; protecting integrated circuits or living beings
06/24/2003US6583402 Semiconductor parts and semiconductor mounting apparatus
06/24/2003US6583401 Optoelectronic component with a conductor strip element
06/24/2003US6583366 Substrate having pins
06/24/2003US6583365 Conductive pads layout for BGA packaging structure
06/24/2003US6583355 Bladder insert for encapsulant displacement
06/24/2003US6583201 Polymeric resin, a conductive filler, a curing agent, an optional (reactive) diluent, and as corrosion inhibitor, one of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene to improve contact resistance in harsh conditions
06/24/2003US6583071 Ultrasonic spray coating of liquid precursor for low K dielectric coatings
06/24/2003US6583070 Semiconductor device having a low dielectric constant material
06/24/2003US6583059 Semiconductor device and method of manufacturing the same
06/24/2003US6583058 Solid hermetic via and bump fabrication
06/24/2003US6583052 Method of fabricating a semiconductor device having reduced contact resistance
06/24/2003US6583051 Method of manufacturing an amorphized barrier layer for integrated circuit interconnects
06/24/2003US6583049 Semiconductor integrated circuit device and method for making the same
06/24/2003US6583047 Method for eliminating reaction between photoresist and OSG
06/24/2003US6583043 Dielectric between metal structures and method therefor
06/24/2003US6583041 Microdevice fabrication method using regular arrays of lines and spaces
06/24/2003US6583040 Method of making a pillar in a laminated structure for a semiconductor chip assembly
06/24/2003US6583035 Semiconductor package with a controlled impedance bus and method of forming same
06/24/2003US6583022 Methods of forming roughened layers of platinum and methods of forming capacitors
06/24/2003US6583019 Perimeter anchored thick film pad
06/24/2003US6582997 ESD protection scheme for outputs with resistor loading
06/24/2003US6582994 Passivation layer for packaged integrated circuits
06/24/2003US6582993 Method of underfilling semiconductor device
06/24/2003US6582992 Stackable semiconductor package and wafer level fabrication method
06/24/2003US6582991 Semiconductor device and method for fabricating the same
06/24/2003US6582990 Wafer level underfill and interconnect process
06/24/2003US6582983 Method and wafer for maintaining ultra clean bonding pads on a wafer
06/24/2003US6582982 Composition for wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
06/24/2003US6582979 Structure and method for fabrication of a leadless chip carrier with embedded antenna
06/24/2003US6582978 Position detection mark and position detection method
06/24/2003US6582977 Methods for determining charging in semiconductor processing
06/24/2003US6582976 Semiconductor device manufacturing method capable of reliable inspection for hole opening and semiconductor devices manufactured by the method
06/24/2003US6582777 Exposure to radiation
06/24/2003US6582616 Method for preparing ball grid array board
06/24/2003US6582569 A DC magnetron sputter reactor for sputtering copper, its method of use, and shields and other parts promoting self-ionized plasma (SIP) sputtering. Also, a method of coating copper into a narrow and deep via or trench using SIP
06/24/2003US6582541 Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device
06/24/2003US6582238 Printed circuit board with ground corner regions
06/24/2003US6582085 Semiconductor chip and its manufacturing method
06/24/2003US6581821 Electronic package interconnect structure comprising lead-free solders
06/24/2003US6581820 Lead bonding method for SMD package
06/24/2003US6581388 Active temperature gradient reducer
06/24/2003US6581280 Method for filling high aspect ratio via holes in electronic substrates
06/24/2003US6581279 Method of collectively packaging electronic components
06/24/2003CA2222602C Electronic modules manufacturing
06/19/2003WO2003050909A1 Circuit board device and its manufacturing method
06/19/2003WO2003050870A1 Diffusion barrier
06/19/2003WO2003050858A1 Cmos process with an integrated, high performance, silicide agglomeration fuse
06/19/2003WO2003050850A2 Contacting of a semiconductor chip on a substrate using flip-chip-like technology
06/19/2003WO2003050466A1 Cooling device, electronic equipment device, and method of manufacturing cooling device
06/19/2003WO2003050465A1 Cooling device, electronic equipment device, and method of manufacturing cooling device
06/19/2003WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
06/19/2003WO2003029772A3 Imaging array
06/19/2003WO2003025475A3 Modular capillary pumped loop cooling system
06/19/2003WO2003003797A3 Structure and method for fabrication of a leadless multi-die carrier
06/19/2003WO2002095823A3 High performance air cooled heat sinks used in high density packaging applications
06/19/2003WO2002095817A3 Semiconductor component with at least one semiconductor chip on a base chip serving as substrate and method for production thereof
06/19/2003WO2002093994A3 Method and apparatus for cooling electronic components
06/19/2003WO2002061833A3 Substrate for an electric component and method for the production thereof
06/19/2003WO2002054488A3 Ic package pressure release apparatus and method
06/19/2003WO2000054331A9 Methods of forming local interconnects and conductive lines, and resulting structure
06/19/2003US20030115568 Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes
06/19/2003US20030114606 A phosphazene compound or polyphosphazenes; fireproofing
06/19/2003US20030114598 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards
06/19/2003US20030114556 Epoxy resin component, filler, initiator; filler contains silanized fused silica; processable as a one-component system
06/19/2003US20030114026 Fluted signal pin, cap, membrane, and stanchion for a ball grid array
06/19/2003US20030114017 Structure and method for fabricating GaN substrates from trench patterned GaN layers on sapphire substrates
06/19/2003US20030114013 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures
06/19/2003US20030114001 Method of bonding and transferring a material to form a semiconductor device
06/19/2003US20030114000 Method for manufacturing semiconductor integrated circuit device
06/19/2003US20030113999 Method of forming metal wire of semiconductor device
06/19/2003US20030113996 Semiconductor production device and production method for semiconductor device
06/19/2003US20030113991 Semiconductor device manufacturing method
06/19/2003US20030113990 Microelectronic spring contact repair
06/19/2003US20030113982 Method of manufacturing semiconductor devices
06/19/2003US20030113979 Process for making contact with and housing integrated circuits
06/19/2003US20030113975 Methods for use in forming a capacitor and structures resulting from same
06/19/2003US20030113974 Stacked metal-insulator-metal capacitor structures in between interconnection layers
06/19/2003US20030113958 Method of manufacturing semiconductor device having thin film SOI structure
06/19/2003US20030113955 Method for fabricating semiconductor package and semiconductor package
06/19/2003US20030113954 Method of making a semiconductor package having exposed metal strap
06/19/2003US20030113953 Method and apparatus for coupling a semiconductor die to die terminals
06/19/2003US20030113944 Semiconductor device and a manufacturing method thereof
06/19/2003US20030113941 Method of manufacturing semiconductor device for evaluation capable of evaluating crystal defect using in-line test by avoiding using preferential etching process
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