Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/01/2003US6586277 Method and structure for manufacturing improved yield semiconductor packaged devices
07/01/2003US6586276 Method for fabricating a microelectronic device using wafer-level adhesion layer deposition
07/01/2003US6586275 Wafer level package and method for manufacturing the same
07/01/2003US6586274 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
07/01/2003US6586273 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
07/01/2003US6586267 Transient fuse for charge-induced damage detection
07/01/2003US6586143 Chemical mechanical polishing (CMP) process and automatically compensating for alignment of a wafer stepper based on the position checking is described. A wafer is provided having an alignment mark thereon for the purpose of aligning a reticle
07/01/2003US6586105 Sealed with silicon gel
07/01/2003US6585927 Methods for labeling semiconductor device components
07/01/2003US6585925 Process for forming molded heat dissipation devices
07/01/2003US6585905 Leadless plastic chip carrier with partial etch die attach pad
07/01/2003US6585904 Method for the manufacture of printed circuit boards with plated resistors
07/01/2003US6585534 Retention mechanism for an electrical assembly
07/01/2003US6585039 Composite overmolded heat pipe construction
06/2003
06/26/2003WO2003053118A2 Cooling device for a chip and method for production thereof
06/26/2003WO2003052890A1 Processing a memory link with a set of at least two laser pulses
06/26/2003WO2003052877A1 Interposer assembly for soldered electrical connections
06/26/2003WO2003052829A1 Semiconductor device and method for manufacturing the same
06/26/2003WO2003052824A2 Method for determining the esd/latch-up resistance of an integrated circuit
06/26/2003WO2003052822A2 Method for making a non-detachable microcircuit card
06/26/2003WO2003052820A2 Clamping device
06/26/2003WO2003052819A2 Apparatus and method for augmented cooling of computers
06/26/2003WO2003052818A1 Thermally conductive phase change materials
06/26/2003WO2003052817A2 Method of bonding and transferring a material to form a semiconductor device
06/26/2003WO2003052815A2 Electrode structure for use in an integrated circuit
06/26/2003WO2003052814A1 Method of manufacturing an electronic device
06/26/2003WO2003052813A2 Dual cure b-stageable underfill for wafer level
06/26/2003WO2003052809A1 Method for production of dielectric layers using polyfunctional carbosilanes
06/26/2003WO2003052805A1 Film removing device, film removing method, and substrate processing system
06/26/2003WO2003052798A2 Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
06/26/2003WO2003052780A1 Inductive component
06/26/2003WO2003052340A1 Heat dissipating component using high conducting inserts
06/26/2003WO2003052162A1 A method of depositing dielectric materials in damascene applications
06/26/2003WO2003051987A1 Elastomer formed product
06/26/2003WO2003051955A1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
06/26/2003WO2003041132A3 Gas-assisted rapid thermal processing
06/26/2003WO2003034468A3 Crosstalk reduction in a crosspoint thyristor switching array using a shielded dielectric stack
06/26/2003WO2002065547A3 METHOD OF OBTAINING LOW TEMPERATURE ALPHA-Ta THIN FILMS USING WAFER BIAS
06/26/2003WO2002056340A3 Semiconductor device with fuse, resistor, diffusion barrier or capacitor of a refractory metal-silicon-nitrogen compound
06/26/2003US20030119653 Lead-free; chemical resistance, bonding strength, shockproof, heat resistance
06/26/2003US20030119336 Insulation film on semiconductor substrate and method for forming same
06/26/2003US20030119329 Method for fabricating semiconductor device capable of improving process margin of self align contact
06/26/2003US20030119325 Method of forming a metal line in a semiconductor device
06/26/2003US20030119317 Semiconductor device and production method therefor
06/26/2003US20030119308 Sloped via contacts
06/26/2003US20030119306 Method for forming interconnect structure with low dielectric constant
06/26/2003US20030119299 Methods of ball grid array
06/26/2003US20030119298 Semiconductor device, a method of manufacturing the same and an electronic device
06/26/2003US20030119297 Metal redistribution layer having solderable pads and wire bondable pads
06/26/2003US20030119296 Semiconductor device and manufacturing method for the same
06/26/2003US20030119295 Wafer and method of fabricating the same
06/26/2003US20030119293 Method for forming fuse in semiconductor device
06/26/2003US20030119274 Method of forming an alignment mark structure using standard process steps for forming vertical gate transistors
06/26/2003US20030119234 Method of filling a concave portion with an insulating material
06/26/2003US20030119230 Thin film transistor, liquid crystal display substrate, and their manufacture methods
06/26/2003US20030119227 Architecture of laser fuse box of semiconductor integrated circuit and method for fabricating the same
06/26/2003US20030119224 Semiconductor package
06/26/2003US20030119221 Trilayered beam MEMS device and related methods
06/26/2003US20030118897 Solid electrolyte cell and production method thereof
06/26/2003US20030118884 Method for fabricating membrane eletrode assemblies
06/26/2003US20030118845 Diffusion barrier
06/26/2003US20030118842 Sintered compact; low dielectric; high thermal expansion
06/26/2003US20030118835 Anhydride polymers for use as curing agents in epoxy resin-based underfill material
06/26/2003US20030118826 Thermal interface material
06/26/2003US20030118796 Method for fabricating a multi-layered dielectric layer including insulating layer having Si-CH3 bond therein
06/26/2003US20030118751 Electronic device, and method of patterning a first layer
06/26/2003US20030118065 Water getter devices for laser amplifiers and process for the manufacture thereof
06/26/2003US20030117824 Power converter enclosure
06/26/2003US20030117785 Semiconductor device and a method of manufacturing the same
06/26/2003US20030117784 Circuit board device and mounting method therefor
06/26/2003US20030117777 Blindmate heat sink assembly
06/26/2003US20030117775 Coated heat spreaders
06/26/2003US20030117774 Electrically isolated module
06/26/2003US20030117773 Thermal module
06/26/2003US20030117772 Method and apparatus for thermally controlling multiple electronic components
06/26/2003US20030117770 Carbon nanotube thermal interface structures
06/26/2003US20030117760 Active cooling system for cpu and semiconductors also enabling thermal accelaration
06/26/2003US20030117257 Electrothermal self-latching MEMS switch and method
06/26/2003US20030117214 Semiconductor device with voltage down circuit changing power supply voltage to operating voltage
06/26/2003US20030116868 Method and apparatus for encoding information in an ic package
06/26/2003US20030116867 Semiconductor device and manufacturing method thereof
06/26/2003US20030116866 Semiconductor package having substrate with multi-layer metal bumps
06/26/2003US20030116865 Semiconductor device and manufacturing method thereof
06/26/2003US20030116863 Bonding strength between semiconductor chip and support; microstructure circuits
06/26/2003US20030116862 Glueless integrated circuit system in packaging module
06/26/2003US20030116861 Multi-substrate microelectronic packages and methods for manufacture
06/26/2003US20030116859 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
06/26/2003US20030116858 Dual damascene interconnect
06/26/2003US20030116857 Circuit substrate and method for fabricating the same
06/26/2003US20030116856 Resistive vias for controlling impedance and terminating I/O signals at the package level
06/26/2003US20030116855 Low dielectric constant material reinforcement for improved electromigration reliability
06/26/2003US20030116854 Semiconductor device and method for manufacturing the same
06/26/2003US20030116853 Semiconductor device and method of fabricating the same
06/26/2003US20030116852 Multilayer; flat substrate, dielectric, connecting wires; miniaturization; damascene process
06/26/2003US20030116851 Micro-scale interconnect device with internal heat spreader and method for fabricating same
06/26/2003US20030116850 Multi-level RF passive device
06/26/2003US20030116848 MEMS device having a trilayered beam and related methods
06/26/2003US20030116845 Waferlevel method for direct bumping on copper pads in integrated circuits
06/26/2003US20030116844 High-frequency signal amplification device and method for manufacturing the same
06/26/2003US20030116843 Semiconductor device package and method of production and semiconductor device of same
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