Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2003
06/26/2003US20030116842 Semiconductor device and manufacturing method thereof
06/26/2003US20030116840 Dielectric layer joining substrate; isothermal solidification
06/26/2003US20030116839 Multilayer; substrate, dielectric, metallized layer; corrosion resistant protective coating
06/26/2003US20030116838 Supporting frame for surface-mount diode package
06/26/2003US20030116837 Semiconductor device and manufacturing method thereof
06/26/2003US20030116836 Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same
06/26/2003US20030116835 Memory-module and a method of manufacturing the same
06/26/2003US20030116834 High density direct connect LOC assembly
06/26/2003US20030116833 Lead-frame strip and method of manufacturing semiconductor packages using the same
06/26/2003US20030116832 Apparatus for reversing lead frame
06/26/2003US20030116831 Impedance compensation for curcuit board breakout region
06/26/2003US20030116830 Method and apparatus for increasing the immunity of new generation microprocessors from ESD events
06/26/2003US20030116827 Methods, apparatus, and systems for reducing interference on nearby conductors
06/26/2003US20030116826 Interconnect structure capped with a metallic barrier layer and method fabrication thereof
06/26/2003US20030116825 Wafer-level package with silicon gasket
06/26/2003US20030116820 Post-fuse blow corrosion prevention structure for copper fuses
06/26/2003US20030116819 Connecting active transistors using slit in isolation zone; prevent leakage current
06/26/2003US20030116806 Input protection circuit connected to protection circuit power source potential line
06/26/2003US20030116790 Semiconductor chip and semiconductor device using the semiconductor chip
06/26/2003US20030116761 Ferroelectric capacitor plasma charging monitor
06/26/2003US20030116552 Heating element for microfluidic and micromechanical applications
06/26/2003US20030116535 Method and apparatus for removing coating layers from alignment marks on a wafer
06/26/2003US20030116427 Self-ionized and inductively-coupled plasma for sputtering and resputtering
06/26/2003US20030116417 MEMS device having contact and standoff bumps and related methods
06/26/2003US20030116349 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
06/26/2003US20030116348 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
06/26/2003US20030116347 Electronic component
06/26/2003US20030116312 Heat dissipating component using high conducting inserts
06/26/2003US20030116304 Structure for assembling a heat sink assembly
06/26/2003US20030116302 Tunnel-phase change heat exchanger
06/26/2003US20030116085 Apparatus for modifying the configuration of an exposed surface of a viscous fluid
06/26/2003US20030115752 Method of making an interposer with contact structures
06/26/2003US20030115750 Forming an insulator to include a recess, depositing a conductor around the insulator, and etching; integrated circuit chips
06/26/2003US20030115749 Inductive heating of microelectronic components
06/26/2003US20030115739 Device and method for package warp compensation in an integrated heat spreader
06/26/2003DE20305652U1 Heat-sink for electronic components, especially processors, has baseplate comprising large number of thin metal tubes or wires bundled together, and ribs comprising metal strips or wires
06/26/2003CA2436227A1 Processing a memory link with a set of at least two laser pulses
06/25/2003EP1322146A1 Method of electroplating solder bumps on an organic circuit board
06/25/2003EP1321984A2 Semiconductor input/output circuit arrangement
06/25/2003EP1321983A2 Wiring board and semiconductor device
06/25/2003EP1321982A2 Waferlevel method for direct bumping on copper pads in integrated circuits
06/25/2003EP1321981A2 Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors
06/25/2003EP1321980A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/25/2003EP1321979A2 Semiconductor module with increased reliability against heavy environment conditions and production method therefor
06/25/2003EP1321978A2 Contact structure
06/25/2003EP1321976A2 Method of depositing a barrier insulating layer with low dielectric constant on a copper film
06/25/2003EP1321975A2 Method for plasma depositing an insulating film with low dielectric constant for a semiconductor device
06/25/2003EP1321735A2 Capillary tube heat pipe and temperature controlling apparatus
06/25/2003EP1321480A2 Thixotropic fluorinated curable compositions and articles sealed therewith
06/25/2003EP1321441A1 Glass and conductive paste using the same
06/25/2003EP1321015A2 Microfluidic devices for heat transfer
06/25/2003EP1320889A1 Connecting device
06/25/2003EP1320888A2 Structure and process for reducing die corner and edge stresses in microelectronic packages
06/25/2003EP1320887A2 Making of fuses and antifuses with a vertical dram process
06/25/2003EP1320886A1 Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines
06/25/2003EP1320884A2 Semiconductor device and fabrication method therefor
06/25/2003EP1320880A2 Singulation of semiconductor packages by tie bar cutting
06/25/2003EP1320872A2 Fabrication of semiconductor devices
06/25/2003EP1320712A2 Multi-purpose microchannel micro-component
06/25/2003EP1320455A2 Carbon-carbon fiber composite heat spreader
06/25/2003EP0900132B1 Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets
06/25/2003EP0645807B1 Semiconductor device
06/25/2003CN2558191Y Heat sink
06/25/2003CN2558081Y Heat sink assembly
06/25/2003CN2558080Y 背板固定装置 Back fixtures
06/25/2003CN2558079Y Heat sink structure
06/25/2003CN2558078Y Embedded ball lattice array package structure
06/25/2003CN1426605A Encapsulated display device
06/25/2003CN1426600A Semiconductor device having low dielectric film and fabrication process thereof
06/25/2003CN1426599A Method for forming integrated circuit package at wafer level
06/25/2003CN1426596A Method of forming conductive coating on semiconductor device
06/25/2003CN1426271A Circuit board device and its mounting method
06/25/2003CN1426110A Semiconductor device and its producing method
06/25/2003CN1426109A 半导体集成电路装置 The semiconductor integrated circuit device
06/25/2003CN1426108A Static discharge protective circuit and method in integrated circuit
06/25/2003CN1426107A Inner connection line structure for mounting cover layer on inner metal dielectric layer and its producing method
06/25/2003CN1426106A 半导体装置 Semiconductor device
06/25/2003CN1426105A Semiconductor device and its producing method
06/25/2003CN1426104A Semiconductor device and its producing method
06/25/2003CN1426103A Chip support capable of setting passive element
06/25/2003CN1426102A Chip package base board
06/25/2003CN1426098A Test window structure for monitoring self alignment of silicide residue
06/25/2003CN1426088A Method for producing semiconductor device
06/25/2003CN1112840C Spray-cooling circuit board apparatus
06/25/2003CN1112838C Ceramic base with composite wiring structure and its method of manufacture
06/25/2003CN1112730C Refractory metal capped low resistivity metal conductor line and path device
06/25/2003CN1112729C Electric connection structure in electronic device and forming method for conductor surface material
06/25/2003CN1112728C Chip carrier modules and its producing method
06/25/2003CN1112724C Semiconductor device and method of fabricating same
06/25/2003CN1112723C Mounting structure and mounting process for semiconductor device
06/25/2003CN1112722C Method of manufacturing semiconductor device
06/24/2003US6584420 Defect examination apparatus
06/24/2003US6584332 Electronic equipment
06/24/2003US6584029 One-time programmable memory using fuse/anti-fuse and vertically oriented fuse unit memory cells
06/24/2003US6584004 Electronic circuit package
06/24/2003US6583987 Electromagnetic interference and heatsinking
06/24/2003US6583870 Simulated defective wafer and pattern defect inspection recipe preparing method
06/24/2003US6583663 Power integrated circuit with distributed gate driver
06/24/2003US6583640 Method and apparatus for evaluating insulating film
06/24/2003US6583517 Method and structure for joining two substrates with a low melt solder joint
1 ... 1634 1635 1636 1637 1638 1639 1640 1641 1642 1643 1644 1645 1646 1647 1648 1649 1650 1651 1652 1653 1654 ... 2262