Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/02/2003EP1324089A2 Optical module
07/02/2003EP1323761A1 Polyphenol resin, process for its production, epoxy resin composition and its use
07/02/2003EP1323682A2 Dielectric material and dielectric sintered body, and wiring board
07/02/2003EP0738759B1 Epoxy resin composition for sealing photosemiconductor device
07/02/2003CN2559188Y Electronic member heat radiator assembling fastener
07/02/2003CN2559187Y Combined heat radiator fin
07/02/2003CN2559099Y Covered wafer packaging substrate
07/02/2003CN2559098Y Structure for packaging integrated circuit without solder mask
07/02/2003CN2559097Y Chip size packing bare crystal protecting board on PC board
07/02/2003CN2559044Y Heat sink module
07/02/2003CN2559043Y Low-level heat sink
07/02/2003CN2559042Y Circular radiator assembly
07/02/2003CN1428069A Double-sided wiring board and its mfg. method
07/02/2003CN1427941A Channel connection for pipe block joints
07/02/2003CN1427874A Polymer composition containing clean filler incorporated therein
07/02/2003CN1427753A Fluxing under fill compositions
07/02/2003CN1427663A Heat transfer substrate and method for mfg. same
07/02/2003CN1427478A Semiconductor device of dropping circuit with conversion of power voltage into working voltage
07/02/2003CN1427477A Polysilicon boundary step resetter
07/02/2003CN1427476A Double layer silicon carbon compound barrier layer
07/02/2003CN1427475A Fuse structure for integrated wire welding on low K interconnection and its manufacturing method
07/02/2003CN1427474A Integrated circuit package device and its manufacturing method
07/02/2003CN1427473A Wire frame strip and method for encapsulating semiconductor with wire frame strip
07/02/2003CN1427472A Semiconductor device and mfg. method thereof
07/02/2003CN1427471A 半导体器件 Semiconductor devices
07/02/2003CN1427470A Manufacturing method of radiating fin
07/02/2003CN1427469A Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure
07/02/2003CN1427460A Apparatus and method for mounting electronic elements
07/02/2003CN1427458A Method for mfg. semiconductor device
07/02/2003CN1427456A Method for forming porous dielectric material layer on semiconductor device and formed device
07/02/2003CN1427421A Glass and conductive paste using this glass
07/02/2003CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof
07/02/2003CN1113589C Surface mount socket for electronic connector and contact for use therewith
07/02/2003CN1113588C Method of mounting surface of SIL hybric circuit
07/02/2003CN1113459C Electronic component
07/02/2003CN1113413C Method for packaging array with open ball grids
07/02/2003CN1113412C Semiconductor device having metal alloy for electrode
07/02/2003CN1113411C Lead frame taping apparatus and taping method
07/02/2003CN1113410C Encapsulating assembly for integrated circuit and method for assembling package of integrated circuit
07/02/2003CN1113401C Capacitor in integrated circuit and mfg. method thereof
07/02/2003CN1113400C Formation method of aluminium film for wiring
07/02/2003CN1113394C Semiconductor integrated circuit
07/02/2003CN1113390C Method of checking for presence of connection balls
07/02/2003CN1113083C Semiconductor sealing epoxy resin composition and semiconductor device using same
07/02/2003CN1112977C Method for producing cooling element and cooling element
07/01/2003US6588005 Method of manufacturing semiconductor integrated circuit device
07/01/2003US6587892 Integrated circuit memory devices having multiple data communication connections
07/01/2003US6587353 Semiconductor device
07/01/2003US6587346 Combination electrical power distribution and heat dissipating device
07/01/2003US6587345 Electronic device substrate assembly with impermeable barrier and method of making
07/01/2003US6587344 Mounting system for high-voltage semiconductor device
07/01/2003US6587343 Water-cooled system and method for cooling electronic components
07/01/2003US6587342 Snap coupling cooling fan module
07/01/2003US6587341 Heat dissipater structure
07/01/2003US6587320 Apparatus for current ballasting ESD sensitive devices
07/01/2003US6586985 Methods and apparatus for trimming packaged electrical devices
07/01/2003US6586961 Structure and method of repair of integrated circuits
07/01/2003US6586847 Die; addition polymer expanding and contracting so as to reduce a range of temperature excursions occurring in power dissipation areas
07/01/2003US6586846 Low cost decal material used for packaging
07/01/2003US6586845 Semiconductor device module and a part thereof
07/01/2003US6586844 Flip chip die
07/01/2003US6586843 Integrated circuit device with covalently bonded connection structure
07/01/2003US6586842 Dual damascene integration scheme for preventing copper contamination of dielectric layer
07/01/2003US6586839 Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers
07/01/2003US6586838 Semiconductor device
07/01/2003US6586836 Encapsulated die assembly; packaging
07/01/2003US6586835 Compact system module with built-in thermoelectric cooling
07/01/2003US6586834 Die-up tape ball grid array package
07/01/2003US6586833 Packaged power devices having vertical power mosfets therein that are flip-chip mounted to slotted gate electrode strip lines
07/01/2003US6586832 Semiconductor device and fabrication process thereof
07/01/2003US6586830 Semiconductor device with an interposer
07/01/2003US6586829 Ball grid array package
07/01/2003US6586828 Integrated circuit bus grid having wires with pre-selected variable widths
07/01/2003US6586826 Integrated circuit package having posts for connection to other packages and substrates
07/01/2003US6586824 Reduced thickness packaged electronic device
07/01/2003US6586822 Integrated core microelectronic package
07/01/2003US6586821 Lead-frame forming for improved thermal performance
07/01/2003US6586815 In a fuse window
07/01/2003US6586783 Substrate for an electronic power circuit, and an electronic power module using such a substrate
07/01/2003US6586765 Wafer-level antenna effect detection pattern for VLSI
07/01/2003US6586684 Circuit housing clamp and method of manufacture therefor
07/01/2003US6586678 Ceramic header assembly
07/01/2003US6586677 Package having body of encapsulant material covering first surface and peripheral side surface, including reentrant portion, of die pad and leads, wherein second surface of die pad and leads is exposed at exterior surface of body
07/01/2003US6586513 Aqueous dispersion for electrodeposition comprising selected inorganic particles having specified mean particle size and dielectric constant, and organic particles comprised of polyimide-based resin having charge on surface
07/01/2003US6586345 Method of manufacturing a semiconductor device wiring layer having an oxide layer between the polysilicon and silicide layers
07/01/2003US6586341 Method of manufacturing semiconductor device
07/01/2003US6586334 Reducing copper line resistivity by smoothing trench and via sidewalls
07/01/2003US6586330 Method for depositing conformal nitrified tantalum silicide films by thermal CVD
07/01/2003US6586329 Semiconductor device and a method of manufacturing thereof
07/01/2003US6586327 Fabrication of semiconductor devices
07/01/2003US6586325 Process for making an electronic device having a multilevel structure
07/01/2003US6586323 Method for dual-layer polyimide processing on bumping technology
07/01/2003US6586309 High performance RF inductors and transformers using bonding technique
07/01/2003US6586308 Method for producing circuit structures on a semiconductor substrate and semiconductor configuration with functional circuit structures and dummy circuit structures
07/01/2003US6586292 Guard mesh for noise isolation in highly integrated circuits
07/01/2003US6586282 Method of manufacturing a semiconductor device
07/01/2003US6586281 Variable rotational assignment of interconnect levels in integrated circuit fabrication
07/01/2003US6586280 Method of manufacturing a semiconductor chip array with two-sided cooling
07/01/2003US6586279 Method of integrating a heat spreader and a semiconductor, and package formed thereby
07/01/2003US6586278 Method for mounting electronic component and structure having mounted thereon an electronic component
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