Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/03/2003US20030124814 Wiring substrate used for resin molding and process of manufacturing semiconductor device using the wiring substrate
07/03/2003US20030124811 Semiconductor device and manufacturing method thereof
07/03/2003US20030124775 Semiconductor device, semiconductor device manufacturing method, circuit board, and electronic device
07/03/2003US20030124773 Optical module, circuit board and electronic device
07/03/2003US20030124772 Apparatus for and method of packaging semiconductor devices
07/03/2003US20030124770 Plastic molded type semiconductor device and fabrication process thereof
07/03/2003US20030124768 Wafer level packaging and chip structure
07/03/2003US20030124767 Integrated chip package structure using ceramic substrate and method of manufacturing the same
07/03/2003US20030124766 Method for manufacturing stacked chip package
07/03/2003US20030124750 Semiconductor fuse covering
07/03/2003US20030124378 Fluxing underfill compositions
07/03/2003US20030124326 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
07/03/2003US20030124263 ULSI wiring and method of manufacturing the same
07/03/2003US20030124255 Layers are separately formed via a diffusion prevention layer with an insulating interlayer portion made of SiO2.
07/03/2003US20030123522 Low-power band-gap reference and temperature sensor circuit
07/03/2003US20030123305 Bit line landing pad and borderless contact on bit line stud with localized etch stop layer and manufacturing method thereof
07/03/2003US20030123240 Circuit package and method for making the same
07/03/2003US20030123230 EMI shield for transceiver
07/03/2003US20030123227 Rotary cooler of CPU
07/03/2003US20030123207 Programmable element programmed by changes in resistance due to phase transition
07/03/2003US20030122727 High-frequency communication apparatus and method of manufacturing the same
07/03/2003US20030122648 Inductor with an enclosed magnetic flux pattern and method of manufacturing the same
07/03/2003US20030122638 Stacked radio-frequency module
07/03/2003US20030122573 Technique to reduce reflections and ringing on CMOS interconnections
07/03/2003US20030122540 Method and apparatus for detecting bearing failure
07/03/2003US20030122522 System level battery integration system
07/03/2003US20030122279 Mold assembly and method for encapsulating semiconductor device
07/03/2003US20030122264 Bond out chip and method for making same
07/03/2003US20030122262 Semiconductor device and process for manufacturing the same
07/03/2003US20030122261 Power semiconductor submodule, and a power semiconductor module
07/03/2003US20030122260 Versatile system for diffusion limiting void formation
07/03/2003US20030122259 Current crowding reduction technique using selective current injection
07/03/2003US20030122258 Current crowding reduction technique using slots
07/03/2003US20030122256 Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
07/03/2003US20030122255 Ball grid array package
07/03/2003US20030122254 Device and method for including passive components in a chip scale package
07/03/2003US20030122253 Wafer levelpackaging and chip structure
07/03/2003US20030122252 Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same
07/03/2003US20030122250 Thin high-frequency module having integrated circuit chip with little breakage
07/03/2003US20030122248 Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips
07/03/2003US20030122247 High performance multi-chip flip chip package
07/03/2003US20030122246 Multilayer; die on silicon substrate; metal pads
07/03/2003US20030122245 Heat dissipation structure; power control circuits
07/03/2003US20030122244 Adhesion of dies onto metal substrate; patterned wire layer; bonding pad; multilayer
07/03/2003US20030122243 Integrated chip package structure using organic substrate and method of manufacturing the same
07/03/2003US20030122242 Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core
07/03/2003US20030122241 Polybenzoxazine based wafer-level underfill material
07/03/2003US20030122239 Stack semiconductor chip package and lead frame
07/03/2003US20030122238 Integrated circuit package capable of improving signal quality
07/03/2003US20030122237 Semiconductor device
07/03/2003US20030122236 Semiconductor device having multi-chip package structure
07/03/2003US20030122235 Seal ring structure for radio frequency integrated circuits
07/03/2003US20030122234 LSI package and internal connecting method used therefor
07/03/2003US20030122233 Non-contact data carrier and method of fabricating the same
07/03/2003US20030122232 Semiconductor power device
07/03/2003US20030122231 Chip package and method of manufacturing the same
07/03/2003US20030122230 Chip package and method of manufacturing the same
07/03/2003US20030122229 Devices having compliant wafer-level packages with pillars and methods of fabrication
07/03/2003US20030122228 IC package, optical transmitter, and optical receiver
07/03/2003US20030122227 Accelerometer protected by caps applied at the wafer scale
07/03/2003US20030122225 Lead frame and semiconductor device made using the lead frame
07/03/2003US20030122224 Lead frame with dual thin film coated on inner lead terminal
07/03/2003US20030122223 Semiconductor device in a recess of a semiconductor plate
07/03/2003US20030122221 Process of final passivation of an integrated circuit device
07/03/2003US20030122220 Scribe street seals in semiconductor devices and method of fabrication
07/03/2003US20030122219 Inductor for radio communication module
07/03/2003US20030122217 Fuse structure
07/03/2003US20030122216 Memory device packaging including stacked passive devices and method for making the same
07/03/2003US20030122215 Semiconductor device
07/03/2003US20030122213 Semiconductor packaging substrate and method of producing the same
07/03/2003US20030122200 Semiconductor device having fuse and its manufacture method
07/03/2003US20030122192 Low-voltage-triggered SOI-SCR device and associated ESD protection circuit
07/03/2003US20030122175 Integrated passive devices formed by demascene processing
07/03/2003US20030122173 Package for a non-volatile memory device including integrated passive devices and method for making the same
07/03/2003US20030122168 FET circuit block with reduced self-heating
07/03/2003US20030122161 Semiconductor chip, fabrication method, and device for fabricating a semiconductor chip
07/03/2003US20030122153 High frequency semiconductor device
07/03/2003US20030122138 Device for defeating reverse engineering of integrated circuits by optical means
07/03/2003US20030122137 Covering with light transmiission zones; sealing, covering;electronics, optics
07/03/2003US20030122123 Method and apparatus for determining parasitic capacitances in an integrated circuit
07/03/2003US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
07/03/2003US20030121700 Method for fabricating electrical connecting element, and electrical connecting element
07/03/2003US20030121698 Semiconductor device and printed wiring board having electrode pads
07/03/2003US20030121687 Bent metal plate for use in an electronic device
07/03/2003US20030121646 Heat pipe
07/03/2003US20030121645 Heat dissipater for a central processing unit
07/03/2003US20030121644 Heat transport device
07/03/2003US20030121643 Bi-level heat sink
07/03/2003US20030121573 Electroconductivity; tensile stresses
07/03/2003US20030121540 Positioning between insulation substrate; recesses in electroconductive pattern
07/03/2003US20030121538 Apparatus for selective removal of material from wafer alignment marks
07/03/2003US20030121146 Method for fabricating electrical connecting elements, and connecting element
07/02/2003EP1324395A2 Heating element for microfluidic and micromechanical applications
07/02/2003EP1324390A2 A high-frequency module
07/02/2003EP1324389A2 Semiconductor component in a chip format and method for the production thereof
07/02/2003EP1324388A2 Method for cooling electronic components and thermally conductive sheet for use therewith
07/02/2003EP1324387A2 Ball grid array package substrates and method of making the same
07/02/2003EP1324386A1 Semiconductor module and method of manufacturing a semiconductor module
07/02/2003EP1324383A2 Semiconductor device and method for manufacturing the same
07/02/2003EP1324261A1 Non-contact data carrier and method of fabricating the same
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