Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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01/16/2014 | US20140015030 Semiconductor devices and methods of fabricating the same |
01/16/2014 | US20140014975 Semiconductor chip including heat radiation member, and display module |
01/16/2014 | US20140014957 Semiconductor device including a structure for screening connectivity of a tsv |
01/16/2014 | US20140014953 Memory device and manufacturing method the same |
01/16/2014 | US20140014889 Semiconductor devices and methods of fabricating the same |
01/16/2014 | US20140014871 Graphite nanoplatelets for thermal and electrical applications |
01/16/2014 | US20140014813 Integrated circuit stack with integrated electromagnetic interference shielding |
01/16/2014 | US20140013595 Methods for producing a bond and a semiconductor module |
01/16/2014 | DE112012000993T5 Unschädliches Verfahren zur Herstellung von durchgehenden leitenden Leiterbahnen auf den Oberflächen eines nicht-leitenden Substrats Harmless process for the preparation of continuous conductive traces on the surfaces of a non-conductive substrate |
01/16/2014 | DE102013213734A1 Strom-Sense-Transistor mit Einbettung von Sense-Transistorzellen Current sense transistor with embedding sense transistor cells |
01/16/2014 | DE102013213363A1 Ball Grid Array (BGA) und Leiterplatten (PCB)-Via-Raster zum Reduzieren von Differentialmodus-Übersprechen zwischen differentiellen Sende- und Empfangs-Signalpaaren Ball Grid Array (BGA) and printed circuit boards (PCB) -Via grid to reduce differential mode crosstalk between differential transmit and receive signal pairs |
01/16/2014 | DE102012212320A1 Carrier device for receiving component e.g. LED, has carrier that is arranged with molding material with receiving area for receiving the component, and anchoring structure is designed so that molding material with carrier is anchored |
01/16/2014 | DE102012105176A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip |
01/16/2014 | DE102011003205B4 Halbleitervorrichtungsmodul Semiconductor device module |
01/16/2014 | DE102010040129A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
01/16/2014 | DE102009061268B3 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device |
01/16/2014 | DE102008052898B4 Vorrichtung und Verfahren zum Temperieren von Bauteilen Apparatus and method for controlling the temperature of components |
01/15/2014 | EP2685511A1 Semiconductor light-emitting element and method of manufacturing thereof |
01/15/2014 | EP2685498A2 Dual anti-fuse |
01/15/2014 | EP2685495A2 Device package with rigid interconnect structure connecting die and substrate and method thereof |
01/15/2014 | EP2685494A1 Cooler |
01/15/2014 | EP2685493A2 Multi-stage heat sink, cooling system with the same and method for controlling the same |
01/15/2014 | EP2685492A1 Power semiconductor module with at least one stress-reducing adjustment element |
01/15/2014 | EP2685491A2 3D IC method and device |
01/15/2014 | CN203398140U Photovoltaic bypass device, and protection circuit, conjunction box and power generation system applying photovoltaic bypass device |
01/15/2014 | CN203398119U 半导体器件 Semiconductor devices |
01/15/2014 | CN203398116U Packaging structure for wafer-level image sensor |
01/15/2014 | CN203398108U Chip structure |
01/15/2014 | CN203398107U 混合集成电路装置 Hybrid integrated circuit device |
01/15/2014 | CN203398106U 半导体器件 Semiconductor devices |
01/15/2014 | CN203398105U Semiconductor device |
01/15/2014 | CN203398104U Novel control electrode terminal structure |
01/15/2014 | CN203398103U Radiating fin for lithium battery protection board |
01/15/2014 | CN203398102U Active heat dissipation substrate |
01/15/2014 | CN203398101U A novel semiconductor chip |
01/15/2014 | CN203398100U A semiconductor chip with a novel heat dissipating structure |
01/15/2014 | CN203398099U Double-chip radiator and circuit board with radiator |
01/15/2014 | CN203398098U Thyristor quick-changing cooling fixing apparatus |
01/15/2014 | CN203398097U Package structure of power supply chip module |
01/15/2014 | CN203398096U Insulating bottom shell of flat-plate SCR group |
01/15/2014 | CN203398095U Housing of metal-ceramic packaging diode |
01/15/2014 | CN203397288U 散热模块 Thermal Module |
01/15/2014 | CN203390988U Slot cutting machine |
01/15/2014 | CN103518261A Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection |
01/15/2014 | CN103518260A Symmmetrical center tap inductor structure |
01/15/2014 | CN103518259A Arrangement and method for cooling a support |
01/15/2014 | CN103517948A Epoxy resin molding material for encapsulation and electronic component device |
01/15/2014 | CN103517613A Heat radiation device |
01/15/2014 | CN103517612A Heat radiation device |
01/15/2014 | CN103517558A Package substrate, manufacture method thereof and package structure |
01/15/2014 | CN103515447A Electronic device and method of manufacturing such device |
01/15/2014 | CN103515415A Lamination structure and manufacturing method thereof, and electronic device containing lamination structure |
01/15/2014 | CN103515412A Organic light-emitting display device |
01/15/2014 | CN103515388A Semiconductor device and method of manufacturing the same |
01/15/2014 | CN103515372A Photosensor chip package structure |
01/15/2014 | CN103515371A Integrated optical sensor package |
01/15/2014 | CN103515370A Power semiconductor package and manufacturing method thereof |
01/15/2014 | CN103515365A Large power crimping type IGBT device |
01/15/2014 | CN103515363A Method and apparatus of wafer level package for heterogeneous integration technology |
01/15/2014 | CN103515362A Package on package device and method of packaging semiconductor die |
01/15/2014 | CN103515361A Packaging element having stack structure and manufacturing method thereof |
01/15/2014 | CN103515359A Latch-up free esd protection |
01/15/2014 | CN103515358A Semiconductor device and method for manufacturing semiconductor device |
01/15/2014 | CN103515357A Overlay mark and method of measuring the same |
01/15/2014 | CN103515356A Lamination type three-dimensional LTCC perpendicular-interconnection microwave module |
01/15/2014 | CN103515355A 半导体元件与其制作方法 Semiconductor device and its manufacturing method |
01/15/2014 | CN103515354A Apparatus and method for low contact resistance carbon nanotube interconnect |
01/15/2014 | CN103515353A Photoresist fill type metal interconnect structure and manufacturing method thereof |
01/15/2014 | CN103515352A Component having plating through hole, and method for production the same |
01/15/2014 | CN103515351A Device contact, electric device package and method of manufacturing electric device package |
01/15/2014 | CN103515350A A vertical metal/insulating layer/metal MIM capacitor and a manufacturing method thereof |
01/15/2014 | CN103515349A Assembled printed circuit board and lead wire support package |
01/15/2014 | CN103515348A Wiring board |
01/15/2014 | CN103515347A Assembly structure |
01/15/2014 | CN103515346A Semiconductor module and method of formation thereof |
01/15/2014 | CN103515345A Substrate structure and package structure |
01/15/2014 | CN103515344A Semiconductor package and making method thereof |
01/15/2014 | CN103515343A Electronic component module and method for manufacturing the same |
01/15/2014 | CN103515342A Package structure and method for forming the same |
01/15/2014 | CN103515341A Electroless nickel bump structure of wafer die pad, and method of manufacturing the same |
01/15/2014 | CN103515340A Power module package and method for manufacturing the same |
01/15/2014 | CN103515339A 电子装置 Electronic devices |
01/15/2014 | CN103515338A 半导体模块 Semiconductor Modules |
01/15/2014 | CN103515337A Heat dissipation system for power module |
01/15/2014 | CN103515336A Chip package, chip arrangement, circuit board, and method for manufacturing chip package |
01/15/2014 | CN103515335A Electro-thermal cooling device and method of fabrication thereof |
01/15/2014 | CN103515334A Chip package, method for forming the same, and method for forming semiconductor structure |
01/15/2014 | CN103515333A Semiconductor package structure |
01/15/2014 | CN103515332A 半导体封装件 Semiconductor package |
01/15/2014 | CN103515331A Semiconductor package and making method thereof |
01/15/2014 | CN103515330A Packaging substrate (semiconductor package) and fabrication method thereof |
01/15/2014 | CN103515329A Substrate structure and semiconductor package using the same |
01/15/2014 | CN103515328A 半导体封装件 Semiconductor package |
01/15/2014 | CN103515327A Kovar metal structure used for laser seal welding and laser welding method |
01/15/2014 | CN103515326A Package-on-package structure having polymer-based material for warpage control |
01/15/2014 | CN103515325A Semiconductor package and method of fabricating the same |
01/15/2014 | CN103515314A Integrated circuit package and method for forming the same |
01/15/2014 | CN103515311A Chip package and method for manufacturing chip package |
01/15/2014 | CN103515309A Flip-chip electronic device and production method thereof |
01/15/2014 | CN103515308A Copper interconnect structure and method for fabricating thereof |