Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/2014
01/16/2014US20140015030 Semiconductor devices and methods of fabricating the same
01/16/2014US20140014975 Semiconductor chip including heat radiation member, and display module
01/16/2014US20140014957 Semiconductor device including a structure for screening connectivity of a tsv
01/16/2014US20140014953 Memory device and manufacturing method the same
01/16/2014US20140014889 Semiconductor devices and methods of fabricating the same
01/16/2014US20140014871 Graphite nanoplatelets for thermal and electrical applications
01/16/2014US20140014813 Integrated circuit stack with integrated electromagnetic interference shielding
01/16/2014US20140013595 Methods for producing a bond and a semiconductor module
01/16/2014DE112012000993T5 Unschädliches Verfahren zur Herstellung von durchgehenden leitenden Leiterbahnen auf den Oberflächen eines nicht-leitenden Substrats Harmless process for the preparation of continuous conductive traces on the surfaces of a non-conductive substrate
01/16/2014DE102013213734A1 Strom-Sense-Transistor mit Einbettung von Sense-Transistorzellen Current sense transistor with embedding sense transistor cells
01/16/2014DE102013213363A1 Ball Grid Array (BGA) und Leiterplatten (PCB)-Via-Raster zum Reduzieren von Differentialmodus-Übersprechen zwischen differentiellen Sende- und Empfangs-Signalpaaren Ball Grid Array (BGA) and printed circuit boards (PCB) -Via grid to reduce differential mode crosstalk between differential transmit and receive signal pairs
01/16/2014DE102012212320A1 Carrier device for receiving component e.g. LED, has carrier that is arranged with molding material with receiving area for receiving the component, and anchoring structure is designed so that molding material with carrier is anchored
01/16/2014DE102012105176A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip
01/16/2014DE102011003205B4 Halbleitervorrichtungsmodul Semiconductor device module
01/16/2014DE102010040129A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
01/16/2014DE102009061268B3 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device
01/16/2014DE102008052898B4 Vorrichtung und Verfahren zum Temperieren von Bauteilen Apparatus and method for controlling the temperature of components
01/15/2014EP2685511A1 Semiconductor light-emitting element and method of manufacturing thereof
01/15/2014EP2685498A2 Dual anti-fuse
01/15/2014EP2685495A2 Device package with rigid interconnect structure connecting die and substrate and method thereof
01/15/2014EP2685494A1 Cooler
01/15/2014EP2685493A2 Multi-stage heat sink, cooling system with the same and method for controlling the same
01/15/2014EP2685492A1 Power semiconductor module with at least one stress-reducing adjustment element
01/15/2014EP2685491A2 3D IC method and device
01/15/2014CN203398140U Photovoltaic bypass device, and protection circuit, conjunction box and power generation system applying photovoltaic bypass device
01/15/2014CN203398119U 半导体器件 Semiconductor devices
01/15/2014CN203398116U Packaging structure for wafer-level image sensor
01/15/2014CN203398108U Chip structure
01/15/2014CN203398107U 混合集成电路装置 Hybrid integrated circuit device
01/15/2014CN203398106U 半导体器件 Semiconductor devices
01/15/2014CN203398105U Semiconductor device
01/15/2014CN203398104U Novel control electrode terminal structure
01/15/2014CN203398103U Radiating fin for lithium battery protection board
01/15/2014CN203398102U Active heat dissipation substrate
01/15/2014CN203398101U A novel semiconductor chip
01/15/2014CN203398100U A semiconductor chip with a novel heat dissipating structure
01/15/2014CN203398099U Double-chip radiator and circuit board with radiator
01/15/2014CN203398098U Thyristor quick-changing cooling fixing apparatus
01/15/2014CN203398097U Package structure of power supply chip module
01/15/2014CN203398096U Insulating bottom shell of flat-plate SCR group
01/15/2014CN203398095U Housing of metal-ceramic packaging diode
01/15/2014CN203397288U 散热模块 Thermal Module
01/15/2014CN203390988U Slot cutting machine
01/15/2014CN103518261A Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection
01/15/2014CN103518260A Symmmetrical center tap inductor structure
01/15/2014CN103518259A Arrangement and method for cooling a support
01/15/2014CN103517948A Epoxy resin molding material for encapsulation and electronic component device
01/15/2014CN103517613A Heat radiation device
01/15/2014CN103517612A Heat radiation device
01/15/2014CN103517558A Package substrate, manufacture method thereof and package structure
01/15/2014CN103515447A Electronic device and method of manufacturing such device
01/15/2014CN103515415A Lamination structure and manufacturing method thereof, and electronic device containing lamination structure
01/15/2014CN103515412A Organic light-emitting display device
01/15/2014CN103515388A Semiconductor device and method of manufacturing the same
01/15/2014CN103515372A Photosensor chip package structure
01/15/2014CN103515371A Integrated optical sensor package
01/15/2014CN103515370A Power semiconductor package and manufacturing method thereof
01/15/2014CN103515365A Large power crimping type IGBT device
01/15/2014CN103515363A Method and apparatus of wafer level package for heterogeneous integration technology
01/15/2014CN103515362A Package on package device and method of packaging semiconductor die
01/15/2014CN103515361A Packaging element having stack structure and manufacturing method thereof
01/15/2014CN103515359A Latch-up free esd protection
01/15/2014CN103515358A Semiconductor device and method for manufacturing semiconductor device
01/15/2014CN103515357A Overlay mark and method of measuring the same
01/15/2014CN103515356A Lamination type three-dimensional LTCC perpendicular-interconnection microwave module
01/15/2014CN103515355A 半导体元件与其制作方法 Semiconductor device and its manufacturing method
01/15/2014CN103515354A Apparatus and method for low contact resistance carbon nanotube interconnect
01/15/2014CN103515353A Photoresist fill type metal interconnect structure and manufacturing method thereof
01/15/2014CN103515352A Component having plating through hole, and method for production the same
01/15/2014CN103515351A Device contact, electric device package and method of manufacturing electric device package
01/15/2014CN103515350A A vertical metal/insulating layer/metal MIM capacitor and a manufacturing method thereof
01/15/2014CN103515349A Assembled printed circuit board and lead wire support package
01/15/2014CN103515348A Wiring board
01/15/2014CN103515347A Assembly structure
01/15/2014CN103515346A Semiconductor module and method of formation thereof
01/15/2014CN103515345A Substrate structure and package structure
01/15/2014CN103515344A Semiconductor package and making method thereof
01/15/2014CN103515343A Electronic component module and method for manufacturing the same
01/15/2014CN103515342A Package structure and method for forming the same
01/15/2014CN103515341A Electroless nickel bump structure of wafer die pad, and method of manufacturing the same
01/15/2014CN103515340A Power module package and method for manufacturing the same
01/15/2014CN103515339A 电子装置 Electronic devices
01/15/2014CN103515338A 半导体模块 Semiconductor Modules
01/15/2014CN103515337A Heat dissipation system for power module
01/15/2014CN103515336A Chip package, chip arrangement, circuit board, and method for manufacturing chip package
01/15/2014CN103515335A Electro-thermal cooling device and method of fabrication thereof
01/15/2014CN103515334A Chip package, method for forming the same, and method for forming semiconductor structure
01/15/2014CN103515333A Semiconductor package structure
01/15/2014CN103515332A 半导体封装件 Semiconductor package
01/15/2014CN103515331A Semiconductor package and making method thereof
01/15/2014CN103515330A Packaging substrate (semiconductor package) and fabrication method thereof
01/15/2014CN103515329A Substrate structure and semiconductor package using the same
01/15/2014CN103515328A 半导体封装件 Semiconductor package
01/15/2014CN103515327A Kovar metal structure used for laser seal welding and laser welding method
01/15/2014CN103515326A Package-on-package structure having polymer-based material for warpage control
01/15/2014CN103515325A Semiconductor package and method of fabricating the same
01/15/2014CN103515314A Integrated circuit package and method for forming the same
01/15/2014CN103515311A Chip package and method for manufacturing chip package
01/15/2014CN103515309A Flip-chip electronic device and production method thereof
01/15/2014CN103515308A Copper interconnect structure and method for fabricating thereof