Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/10/2003US20030127751 Alignment mark structure
07/10/2003US20030127750 Electronic chip component with an integrated circuit and fabrication method
07/10/2003US20030127748 Semiconductor package
07/10/2003US20030127747 Semiconductor device and manufacturing method thereof
07/10/2003US20030127745 Low capacitance wiring layout and method for making same
07/10/2003US20030127742 Parallel plane substrate
07/10/2003US20030127741 Aluminum-beryllium alloys for air bridges
07/10/2003US20030127740 Air gaps copper interconnect structure
07/10/2003US20030127739 Via-sea layout integrated circuits
07/10/2003US20030127737 Semiconductor device
07/10/2003US20030127735 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
07/10/2003US20030127734 Electroconductivity chips; solder blocks; masking pattern
07/10/2003US20030127733 Resin-sealed type semiconductor device
07/10/2003US20030127732 Resin-sealed type semiconductor device
07/10/2003US20030127731 Ball grid array package
07/10/2003US20030127730 Chip structure with bumps and a process for fabricating the same
07/10/2003US20030127729 Stacked semiconductor device structure
07/10/2003US20030127728 Concurrent electrical signal wiring optimization for an electronic package
07/10/2003US20030127727 Heat dissipating plates; metal projections filled with polymer melt
07/10/2003US20030127725 Metal wiring board, semiconductor device, and method for manufacturing the same
07/10/2003US20030127724 Double side connected type semiconductor apparatus
07/10/2003US20030127722 Semiconductor device and method for fabricating the same
07/10/2003US20030127718 Semiconductor component and a method for identifying a semiconductor component
07/10/2003US20030127716 Single layer wiring bond pad with optimum AL film thickness in Cu/FSG process for devices under pads
07/10/2003US20030127715 Thinned die integrated circuit package
07/10/2003US20030127714 Electronic package
07/10/2003US20030127713 Methods of fabricating multilevel leadframes and semiconductor devices
07/10/2003US20030127712 Semiconductor device
07/10/2003US20030127711 Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
07/10/2003US20030127710 Low-loss coplanar waveguides and method of fabrication
07/10/2003US20030127709 Semiconductor device and production process
07/10/2003US20030127708 Memory device with composite contact plug and method for manufacturing the same
07/10/2003US20030127704 Polyimide layer; coil; forming pattern
07/10/2003US20030127701 Semiconductor electronic device and method of manufacturing thereof
07/10/2003US20030127686 Symmetric inducting device for an integrated circuit having a ground shield
07/10/2003US20030127678 Semiconductor device
07/10/2003US20030127671 Semiconductor device having align key for defining active region and method for manufacturing the same
07/10/2003US20030127662 Utilization of die active surfaces for laterally extending die internal and external connections
07/10/2003US20030127502 Method for forming a wafer level chip scale package, and package formed thereby
07/10/2003US20030127499 Low or no-force bump flattening structure and method
07/10/2003US20030127496 Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same
07/10/2003US20030127423 Method for reconstructing an integrated circuit package using lapping
07/10/2003US20030127241 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
07/10/2003US20030127215 Cooling apparatus having low profile extrusion and method of manufacture therefor
07/10/2003US20030127182 Apparatus and methods for coverlay removal and adhesive application
07/10/2003DE10213879C1 Electronic component has semiconductor chips fitted into respective recesses in surface of electronic circuit board
07/09/2003EP1326303A2 Stacked radio-frequency module
07/09/2003EP1326276A2 Interconnection structure in semiconductor device
07/09/2003EP1326079A2 Probe card
07/09/2003EP1325519A1 Semiconductor apparatus with improved ESD withstanding voltage
07/09/2003EP1325518A1 Electronic unit and process for the production thereof
07/09/2003EP1325517A2 Method for assembling components and antennae in radio frequency identification devices
07/09/2003EP1325516A2 Integrating metal with ultra low-k dielectrics
07/09/2003EP1325280A1 Method and structure for temperature stabilization in semiconductor devices
07/09/2003EP1325053A1 Die-attaching paste and semiconductor device
07/09/2003EP1324851A1 Polymer collar for solder bumps
07/09/2003EP1301827A4 Photolithographically-patterned out-of-plane coil structures and method of making
07/09/2003EP1268054A4 Electrocatalyst powders, methods for producing powders and devices fabricated from same
07/09/2003EP1256264B1 Cooling device
07/09/2003EP0957664B1 Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
07/09/2003CN2560100Y Antimagnetic metal cover removing device
07/09/2003CN2560099Y Structure of high-density integrated circuit
07/09/2003CN2560098Y Heat tube radiating apparatus
07/09/2003CN2560097Y Improved structure of fins for radiator
07/09/2003CN2560096Y Liquid cooling device
07/09/2003CN2560022Y Liquid cooler for computer central processor
07/09/2003CN1429412A Encapsulated microelectronic devices
07/09/2003CN1429407A Embedded capacitors for assembly
07/09/2003CN1429403A Method for substrate noise distribution
07/09/2003CN1429400A Method for forming vias in silicon carbide and resulting devices and circuit
07/09/2003CN1429251A Red phosphorus fire retardant for epoxy, red phosphorus fire retardant composition for epoxy, their mfg. method, epoxy composition for semiconductor sealing materials
07/09/2003CN1428875A 热电模块 Thermoelectric Modules
07/09/2003CN1428857A Static protection circuit
07/09/2003CN1428856A Packaging component for semiconductor chip
07/09/2003CN1428855A 半导体器件 Semiconductor devices
07/09/2003CN1428854A Semiconductor device and mfg. method thereof
07/09/2003CN1428853A Semiconductor device and mfg. method thereof
07/09/2003CN1428852A Semiconductor device and its production method
07/09/2003CN1428851A Metal projection structure on input and output contact of substrate or chip and its manufacture method
07/09/2003CN1428850A Semiconductor module and mfg. method thereof
07/09/2003CN1428841A Forming method for wiring structure
07/09/2003CN1428840A Semiconductor device and mfg. method thereof
07/09/2003CN1428831A Semiconductor device and its mfg. method, circuit board and electronic device
07/09/2003CN1428830A Semiconductor package with radiator
07/09/2003CN1428829A Method for mfg. semiconductor assembly
07/09/2003CN1428818A Method for making ceramic base plate form flat surface by using porous material
07/09/2003CN1428800A Semiconductor device package and its mfg. method, and semiconductor
07/09/2003CN1114339C Liquid cooling device for high-power semiconductor module
07/09/2003CN1114338C Method for mfg. printed circuit board heat sink and radiating fin
07/09/2003CN1114253C Socket for pin grid array component
07/08/2003US6591410 Six-to-one signal/power ratio bump and trace pattern for flip chip design
07/08/2003US6591406 Semiconductor apparatus including bypass capacitor having structure for making automatic design easy, and semiconductor apparatus layout method
07/08/2003US6591155 Data processing
07/08/2003US6591091 System and method for coarse/fine PLL adjustment
07/08/2003US6590913 Barrier layer and method of making the same
07/08/2003US6590773 Heat dissipation device for enhanced power light emitting diodes
07/08/2003US6590772 CPU and circuit board mounting arrangement
07/08/2003US6590771 Heat sink assembly and method
07/08/2003US6590770 Serpentine, slit fin heat sink device
07/08/2003US6590768 Ventilating slide rail mount
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