Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/17/2003US20030132489 Determination of whether integrated circuit is acceptable or not in wafer-level burn-in test
07/17/2003US20030132479 Semiconductor integrated circuit device and method of manufacturing the same
07/17/2003US20030132476 Semiconductor integrated circuit device and the method of producing the same
07/17/2003US20030132470 Stacked memory cell having diffusion barriers
07/17/2003US20030132464 Semiconductor device and method for fabricating the same
07/17/2003US20030132430 Chip-antenna apparatus and method
07/17/2003US20030132374 Semiconductor calibration wafer with no charge effect
07/17/2003US20030132302 IC card
07/17/2003US20030132027 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor
07/17/2003US20030132026 Pad structure of semiconductor package
07/17/2003US20030132018 ZIF socket
07/17/2003US20030131975 Integrated heat spreader with mechanical interlock designs
07/17/2003US20030131973 Uniform heat dissipating and cooling heat sink
07/17/2003US20030131972 Small scale chip cooler assembly
07/17/2003US20030131971 Heat dispensing device for electronic parts
07/17/2003US20030131970 Heat sinks and method of formation
07/17/2003US20030131968 Micro-chimney and thermosiphon die-level cooling
07/17/2003US20030131937 Thermosetting resin compositions useful as underfill sealants
07/17/2003US20030131785 Pattern for monitoring epitaxial layer washout
07/17/2003US20030131687 Method for preparing metal powder
07/17/2003US20030131476 Heat conduits and terminal radiator for microcircuit packaging and manufacturing process
07/17/2003US20030131471 Manufacturing process of IC module
07/17/2003DE20307014U1 Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole
07/17/2003DE10158564C1 Leiterbahnstruktur für eine integrierte Schaltung und entsprechendes Herstellungsverfahren Interconnect structure for an integrated circuit and method of manufacture
07/17/2003DE10158563C1 Verfahren zur Herstellung eines Bauelementmoduls A method for producing a component module
07/17/2003CA2472278A1 Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices
07/16/2003EP1328144A1 Memory heat sink device
07/16/2003EP1328143A1 Flexible heat pipe
07/16/2003EP1328023A2 Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
07/16/2003EP1328021A1 Heat sink device retainer
07/16/2003EP1328020A1 Fin piece structure for heat dissipater
07/16/2003EP1328019A1 Leaf piece structure for heat dissipater
07/16/2003EP1328016A2 Wafer-level test of integrated circuits
07/16/2003EP1328012A1 Method of manufactoring an electronic device comprising an inductive mirco component
07/16/2003EP1327993A1 Memory device comprising high voltage switch circuitry
07/16/2003EP1327667A2 Curable composition for forming low bleeding gel type cured product
07/16/2003EP1327605A2 Process for forming a structure on a wafer
07/16/2003EP1327491A1 Functional alloy particles
07/16/2003EP1327264A1 Solvent assisted burnishing of pre-underfilled solder-bumped wafers for flipchip bonding
07/16/2003EP1327226A1 Module having a lead frame equipped with components on both sides
07/16/2003EP1188212A4 A multi-functional energy conditioner
07/16/2003CN2561099Y Closed circulating water cooling apparatus
07/16/2003CN2561098Y Cross-under integrated circuit radiating apparatus
07/16/2003CN2561097Y Embedded power semiconductor packaging apparatus
07/16/2003CN2561002Y Radiating fin fastening structure
07/16/2003CN1430811A Isolating energy conditioning shield assembly
07/16/2003CN1430791A Chip scale surface mounted device and its process of manufacture
07/16/2003CN1430542A Improved apparatus and method for dispensing solder
07/16/2003CN1430406A Optical device and its manufacturing method, optical module, circuit board and electronic equipment
07/16/2003CN1430286A Optical module, circuit board and its electronic machine
07/16/2003CN1430281A Semiconductor device and its manufacturing method
07/16/2003CN1430278A Double-side connection type semiconductor device
07/16/2003CN1430277A Semiconductor device and its manufacturing method, circuit base plate and electronic machine
07/16/2003CN1430276A Thin high-frequency module of less damaged IC chip
07/16/2003CN1430275A Internal connecting wire structure covered by metal barrier layer and its manufacturing method
07/16/2003CN1430274A Structure and method for isolating porous low-K dielectric film
07/16/2003CN1430273A Fuse structure of semiconductor component
07/16/2003CN1430272A Semiconductor device and its manufacturing method
07/16/2003CN1430271A Semiconductor device and its manufacturing method
07/16/2003CN1430270A Internal circuit structure for chip with weld pad array and its manufacturing method
07/16/2003CN1430269A Side-blow heat radiator
07/16/2003CN1430268A 半导体功率器件 Semiconductor power devices
07/16/2003CN1430267A Ballgrid array parkaging body
07/16/2003CN1430263A Method for forming copper lead wire in semiconductor device
07/16/2003CN1430254A Integrated circuit packaging device with heat dissipation wiring design
07/16/2003CN1430251A Manufacturing method of stack chip package
07/16/2003CN1430246A Forming method for forming film with copper diffusion preventing by alumium
07/16/2003CN1430192A Manufacturing method of transportation means, display and semiconductor device
07/16/2003CN1429873A Chemical mechanical polishing slurry for metal and method for preparing metal wire contact plug of semiconductor device by the slurry
07/16/2003CN1115089C Radiating device for electronic equipment
07/16/2003CN1114950C Semiconductor device
07/16/2003CN1114948C Semiconductor chip package having combined structure of lead-on-chip leads and standard normal leads
07/16/2003CN1114947C Electronic card chip coated with layers of insulating material and electronic card comprising the chip
07/16/2003CN1114946C Semiconductor device and manufacturing method and testing method of same
07/16/2003CN1114945C Flexible tape substrate for semiconductor chip package and method of manufacturing such package
07/16/2003CN1114944C Rediator
07/16/2003CN1114943C Semiconductor device and its manufacturing method
07/16/2003CN1114941C Method for mfg. semiconductor device
07/15/2003US6594813 Cell architecture with local interconnect and method for making same
07/15/2003US6594811 Routable high-density interfaces for integrated circuit devices
07/15/2003US6594611 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
07/15/2003US6594540 Misalignment tolerant techniques for dual damascene fabrication
07/15/2003US6594153 Circuit package for electronic systems
07/15/2003US6594151 Frame support for a printed board assembly
07/15/2003US6594149 Liquid cooled circuit device
07/15/2003US6594136 Multi-layer capacitor, wiring board, and high-frequency circuit
07/15/2003US6594128 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
07/15/2003US6594064 Electro-optical device, manufacturing method for manufacturing electro-optical device, and electronic equipment
07/15/2003US6593983 Low power consumption liquid crystal display substrate
07/15/2003US6593840 Electronic packaging device with insertable leads and method of manufacturing
07/15/2003US6593794 System for providing electrostatic discharge protection for high-speed integrated circuits
07/15/2003US6593673 Electronic device having cooling unit
07/15/2003US6593665 Protective envelope for a semiconductor integrated circuit
07/15/2003US6593664 Chip module with bond-wire connections with small loop height
07/15/2003US6593662 Stacked-die package structure
07/15/2003US6593660 Plasma treatment to enhance inorganic dielectric adhesion to copper
07/15/2003US6593659 Dual damascene structure with carbon containing SiO2 dielectric layers
07/15/2003US6593658 Chip package capable of reducing moisture penetration
07/15/2003US6593657 Contact integration article
07/15/2003US6593656 Multilevel copper interconnects for ultra large scale integration
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