| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/23/2003 | CN2562423Y Electric connector fetch devices |
| 07/23/2003 | CN2562369Y Elastic electric contacts packing structure |
| 07/23/2003 | CN2562368Y Liquid cooling radiator |
| 07/23/2003 | CN2562367Y Improved radiator combining structure |
| 07/23/2003 | CN2562366Y Radiator assembly |
| 07/23/2003 | CN2562365Y 散热器 Heat sink |
| 07/23/2003 | CN2562364Y Semiconductor package shell and installation structure |
| 07/23/2003 | CN2562230Y Radiators |
| 07/23/2003 | CN2562229Y Radiator rib device of radiator |
| 07/23/2003 | CN2562228Y Multiline positioning buckle for CPU radiator |
| 07/23/2003 | CN2562225Y Radiator element |
| 07/23/2003 | CN2562224Y Rotary central microprocessor cooler |
| 07/23/2003 | CN1432195A Semiconductor component comprising surface metallization |
| 07/23/2003 | CN1432193A Method and device for fleed out control in solder bonding |
| 07/23/2003 | CN1432074A Electrolyte and method for depositing tin-silver alloy layers |
| 07/23/2003 | CN1432048A Polymer resin for ion beam or ion injection treatment to give surface conductiveness |
| 07/23/2003 | CN1432040A Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and use thereof |
| 07/23/2003 | CN1431979A Material composite and prodn. and use of material composite |
| 07/23/2003 | CN1431858A Printed circuit board with built-in passive device, its mfg. method and used substrate |
| 07/23/2003 | CN1431710A 半导体装置 Semiconductor device |
| 07/23/2003 | CN1431709A 电子器件 Electronic devices |
| 07/23/2003 | CN1431708A Wafer formed diffusion type capsulation structure and its mfg. methods |
| 07/23/2003 | CN1431707A Heat dispersion modules and their mfg. methods |
| 07/23/2003 | CN1431706A Method for mfg. contact type modules with moulded package |
| 07/23/2003 | CN1431703A Method for lowering anomaly discharges happened on interconnected wires in plasma procedure |
| 07/23/2003 | CN1431681A Method for encapsulation in chip level by use of electroplating mask of elastic body |
| 07/23/2003 | CN1431573A Computer cooling device |
| 07/23/2003 | CN1115725C Process for forming multilevel interconnection structure |
| 07/23/2003 | CN1115721C Semiconductor device testing appts. |
| 07/23/2003 | CN1115719C Alignment method |
| 07/23/2003 | CN1115243C Thermal conducting interface |
| 07/22/2003 | US6598217 Method of mounting fabrication-historical data for semiconductor device, and semiconductor device fabricated by such a method |
| 07/22/2003 | US6598206 Method and system of modifying integrated circuit power rails |
| 07/22/2003 | US6597952 Apparatus and method for setting the parameters of an alert window used for timing the delivery of ETC signals to a heart under varying cardiac conditions |
| 07/22/2003 | US6597902 Radio-frequency circuit module |
| 07/22/2003 | US6597805 Visual inspection method for electronic device, visual inspecting apparatus for electronic device, and record medium for recording program which causes computer to perform visual inspecting method for electronic device |
| 07/22/2003 | US6597583 Multilayer circuit board having a capacitor and process for manufacturing same |
| 07/22/2003 | US6597582 Semiconductor device incorporating module structure |
| 07/22/2003 | US6597575 Heat exchangers for integrated circuit pakaging comprising silicone oils and fillers as thermoconductive interfaces |
| 07/22/2003 | US6597574 Radiator plate and process for manufacturing the same |
| 07/22/2003 | US6597562 Electrically polar integrated capacitor and method of making same |
| 07/22/2003 | US6597234 Anti-fuse circuit and method of operation |
| 07/22/2003 | US6597227 System for providing electrostatic discharge protection for high-speed integrated circuits |
| 07/22/2003 | US6597187 Special contact points for accessing internal circuitry of an integrated circuit |
| 07/22/2003 | US6597182 Detector for detecting contact resistance anomaly of cathode electrode in electroplating machine |
| 07/22/2003 | US6597070 Semiconductor device and method of manufacturing the same |
| 07/22/2003 | US6597069 Flip chip metallization |
| 07/22/2003 | US6597068 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 07/22/2003 | US6597067 Self-aligned, lateral diffusion barrier in metal lines to eliminate electromigration |
| 07/22/2003 | US6597066 Hermetic chip and method of manufacture |
| 07/22/2003 | US6597065 Thermally enhanced semiconductor chip having integrated bonds over active circuits |
| 07/22/2003 | US6597063 Package for semiconductor power device and method for assembling the same |
| 07/22/2003 | US6597060 Semiconductor device package |
| 07/22/2003 | US6597059 Thermally enhanced chip scale lead on chip semiconductor package |
| 07/22/2003 | US6597058 Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
| 07/22/2003 | US6597055 Redundancy structure in self-aligned contacts |
| 07/22/2003 | US6597054 Reduced pitch laser redundancy fuse bank structure |
| 07/22/2003 | US6597053 Integrated circuit arrangement with a number of structural elements and method for the production thereof |
| 07/22/2003 | US6597049 Conductor structure for a magnetic memory |
| 07/22/2003 | US6597045 Semiconductor raised source-drain structure |
| 07/22/2003 | US6597042 Contact with germanium layer |
| 07/22/2003 | US6597020 Process for packaging a chip with sensors and semiconductor package containing such a chip |
| 07/22/2003 | US6597019 Semiconductor light-emitting device comprising an electrostatic protection element |
| 07/22/2003 | US6597013 Low current blow trim fuse |
| 07/22/2003 | US6596964 Method of attaching a component to a connection support by welding without the addition of material |
| 07/22/2003 | US6596937 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 07/22/2003 | US6596834 Silicone resins having the general formula (R1SiO3/2)x(HSiO3/2)y where R1 is an alkyl group having 8 to 24 carbon atoms; x has a value of 0.05 to 0.7; y has a value of 0.3 to 0.95 and x+y =1. The resins are used to form porous |
| 07/22/2003 | US6596813 Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil |
| 07/22/2003 | US6596648 Material removal method for forming a structure |
| 07/22/2003 | US6596642 Material removal method for forming a structure |
| 07/22/2003 | US6596640 Method of forming a raised contact for a substrate |
| 07/22/2003 | US6596635 Method for metallization of a semiconductor substrate |
| 07/22/2003 | US6596634 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
| 07/22/2003 | US6596633 Method for manufacturing a semiconductor device |
| 07/22/2003 | US6596632 Method for forming an integrated circuit interconnect using a dual poly process |
| 07/22/2003 | US6596631 Method of forming copper interconnect capping layers with improved interface and adhesion |
| 07/22/2003 | US6596629 Method for forming wire in semiconductor device |
| 07/22/2003 | US6596628 Electrode pad in semiconductor device and method of producing the same |
| 07/22/2003 | US6596627 Very low dielectric constant plasma-enhanced CVD films |
| 07/22/2003 | US6596624 Process for making low dielectric constant hollow chip structures by removing sacrificial dielectric material after the chip is joined to a chip carrier |
| 07/22/2003 | US6596622 Semiconductor device having a multi-layer pad and manufacturing method thereof |
| 07/22/2003 | US6596621 Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate |
| 07/22/2003 | US6596620 BGA substrate via structure |
| 07/22/2003 | US6596619 Method for fabricating an under bump metallization structure |
| 07/22/2003 | US6596611 Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed |
| 07/22/2003 | US6596610 Method for reclaiming delaminated wafer and reclaimed delaminated wafer |
| 07/22/2003 | US6596606 Semiconductor raised source-drain structure |
| 07/22/2003 | US6596604 Method of preventing shift of alignment marks during rapid thermal processing |
| 07/22/2003 | US6596603 Semiconductor device and manufacturing method thereof, and registration accuracy measurement enhancement method |
| 07/22/2003 | US6596592 Structures and methods of anti-fuse formation in SOI |
| 07/22/2003 | US6596589 Method of manufacturing a high coupling ratio stacked gate flash memory with an HSG-SI layer |
| 07/22/2003 | US6596581 Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure |
| 07/22/2003 | US6596579 Method of forming analog capacitor dual damascene process |
| 07/22/2003 | US6596578 Semiconductor device and manufacturing method thereof |
| 07/22/2003 | US6596566 Conformal-coated pick and place compatible devices |
| 07/22/2003 | US6596565 Chip on board and heat sink attachment methods |
| 07/22/2003 | US6596564 Semiconductor device and method of manufacturing the same |
| 07/22/2003 | US6596563 Method for double-layer implementation of metal options in an integrated chip for efficient silicon debug |
| 07/22/2003 | US6596561 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture |
| 07/22/2003 | US6596560 Method of making wafer level packaging and chip structure |