Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/24/2003WO2003022733A3 Nanotube films and articles
07/24/2003WO2003021672A3 An electronic package having a thermal stretching layer
07/24/2003WO2003021661A3 Process for making a mim capacitor
07/24/2003WO2003015167A3 Semiconductor module
07/24/2003WO2003009364A3 Low dielectric constant layers
07/24/2003WO2003007364A3 Method for producing a packing for semiconductor chips
07/24/2003WO2002103852A3 Method and apparatus for non-destructive testing of leaded packages
07/24/2003WO2002099848A3 Formation of printed circuit board structures using piezo microdeposition
07/24/2003WO2002075810A3 Integrated circuit comprising electric connecting elements
07/24/2003WO2002051217A3 Packaged integrated circuits and methods of producing thereof
07/24/2003WO2002047163A3 Semiconductor device having a ball grid array and method therefor
07/24/2003WO2002015209A3 Methods and apparatus for making integrated circuit package including opening exposing portion of the ic
07/24/2003US20030140317 Forming recesses in layers, forming via holes, positioning electronic components in the recesses, mettalizing the holes and connecting the hole to the elxtronic components
07/24/2003US20030140257 Encryption, authentication, and key management for multimedia content pre-encryption
07/24/2003US20030139159 Protective circuit and radio frequency device using the same
07/24/2003US20030139071 Thermally enhanced interposer and method
07/24/2003US20030139070 Surface mounted device type package using coaxial cable
07/24/2003US20030139062 Method for fabricating an ultralow dielectric constant material
07/24/2003US20030139053 Method and system to provide electroplanarization of a workpiece with a conducting material layer
07/24/2003US20030139036 Semiconductor device and method for fabricating the same
07/24/2003US20030139031 Semiconductor device and method of manufacturing the same
07/24/2003US20030139030 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad
07/24/2003US20030139029 Joining semiconductor units with bonding material
07/24/2003US20030139028 Methods of forming integrated circuit devices including fuse wires having reduced cross-sectional areas and related structures
07/24/2003US20030139021 Methods of wafer level fabrication and assembly of chip scale packages
07/24/2003US20030139020 Semiconductor die package with semiconductor die having side electrical connection
07/24/2003US20030138994 Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
07/24/2003US20030138992 Multilayered circuit substrate, semiconductor device and method of producing same
07/24/2003US20030138991 Method for forming a metal layer on an IC package
07/24/2003US20030138613 Lightweight thermal heat transfer apparatus
07/24/2003US20030138222 Optical module
07/24/2003US20030137861 Semiconductor input/output circuit arrangement
07/24/2003US20030137820 Heat sink securing means with back plate
07/24/2003US20030137812 Surface mount typed electronic circuit of small size capable of obtaining a high-Q
07/24/2003US20030137807 Heat dissipating device
07/24/2003US20030137789 Low voltage breakdown element for ESD trigger device
07/24/2003US20030137665 Pattern test device
07/24/2003US20030137062 Use of nitrides for flip-chip encapsulation
07/24/2003US20030137060 Two-stage transfer molding method to encapsulate MMC module
07/24/2003US20030137059 High density 3-D integrated circuit package
07/24/2003US20030137058 High density area array solder microjoining interconnect structure and fabrication method
07/24/2003US20030137057 Multilayer thin film wirings formed on front and back surfaces of metal/alloy, then cut to expose inner electrode pads on which chips are mounted
07/24/2003US20030137056 Circuit substrate and method for fabricating the same
07/24/2003US20030137054 Semiconductor device and method of fabricating the same
07/24/2003US20030137053 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board
07/24/2003US20030137052 Chemical mechanical polishing for flattening dielectric surfaces of films, followed by cleaning and rinsing; corrosion resistance
07/24/2003US20030137051 Semiconductor device and a method of producing the same
07/24/2003US20030137049 Semiconductor device
07/24/2003US20030137048 Stacking system and method
07/24/2003US20030137047 Cooler for an electronic device
07/24/2003US20030137046 Semiconductor device, method of fabricating the same, and printing mask
07/24/2003US20030137045 Circuit component built-in module and method of manufacturing the same
07/24/2003US20030137044 Semiconductor device and packaging system therefore
07/24/2003US20030137043 Polybenzoxazine based wafer-level underfill material
07/24/2003US20030137042 Stacked mass storage flash memory package
07/24/2003US20030137040 Semiconductor device with co-packaged die
07/24/2003US20030137038 Grounding of package substrates
07/24/2003US20030137037 High power semiconductor device having semiconductor chips
07/24/2003US20030137036 Semiconductor package device and method
07/24/2003US20030137035 For ball grid arrays; cleanliness is determined by color variation; improved adhesion of bonding wires and encapsulants
07/24/2003US20030137034 Semiconductor device and method of manufacturing the same
07/24/2003US20030137033 Semiconductor packages and methods for manufacturing such semiconductor packages
07/24/2003US20030137032 Pre-finished leadframe for semiconductor devices and method fo fabrication
07/24/2003US20030137030 Die assembly and method for forming a die on a wafer
07/24/2003US20030137029 ESD improvement by a vertical bipolar transistor with low breakdown voltage and high beta
07/24/2003US20030136997 Thin film capacitor and method of manufacturing the same
07/24/2003US20030136993 Grinding back-side of semiconductor substrate, milling trench in back-side of substrate, exposing vertical trench fill, depositing conductive material, wherein conductive material shorts vertical trench fill to a buried plate
07/24/2003US20030136984 Semiconductor device
07/24/2003US20030136979 Bonding pad structure of a semiconductor device and method for manufacturing the same
07/24/2003US20030136967 High-isolation semiconductor device
07/24/2003US20030136814 High density raised stud microjoining system and methods of fabricating the same
07/24/2003US20030136762 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
07/24/2003US20030136581 Apparatus and method for repairing electronic packages
07/24/2003US20030136579 Electronic assembly and a method of constructing an electronic assembly
07/24/2003US20030136577 Circuit board and method for fabricating the same, and electronic device
07/24/2003US20030136573 Semiconductor device
07/24/2003US20030136550 Heat sink adapted for dissipating heat from a semiconductor device
07/24/2003US20030136548 Stacked low profile cooling system and method for making same
07/24/2003US20030136546 Heat sink assembly with guiding vanes
07/24/2003US20030136545 Heat sink for heat-susceptible electronic devices
07/24/2003US20030135998 Plastic deformable substrate using embossing tool; forming recesses, electroconductive strips
07/24/2003US20030135997 Conductive material and method for filling via-hole
07/24/2003DE10153615C1 Electronic component manufacturing method has several components formed on components sections of lead frame before separation from latter
07/24/2003CA2474042A1 Small scale chip cooler assembly
07/23/2003EP1330148A2 Electrical apparatus
07/23/2003EP1329953A1 Carbon nanotube thermal interface structures
07/23/2003EP1329951A2 Electrically isolated and thermally conductive double-sided pre-packaged component
07/23/2003EP1329949A2 Semiconductor device and method of manufacturing semiconductor device
07/23/2003EP1329946A2 Manufacturing method of semiconductor device including a laser crystallization step
07/23/2003EP1329710A2 Pattern test device
07/23/2003EP1329526A1 High purity zirconium or hafnium, sputtering target comprising the high purity zirconium or hafnium and thin film formed using the target, and method for producing high purity zirconium or hafnium and method for producing powder of high purity zirconium or hafnium
07/23/2003EP1329437A2 Method of production of boron nitride fibers and the obtained fibers
07/23/2003EP1329436A2 Method of production of boron nitride fibers starting from borylborazines
07/23/2003EP1329144A1 Module support for electrical/electronic components
07/23/2003EP1328982A2 Device enclosures and devices with integrated battery
07/23/2003EP1328974A2 Integral capacitor with electromagnetic radiation reduction
07/23/2003EP1328973A2 High-density metal capacitor using dual-damascene copper interconnect
07/23/2003EP1328971A2 Improved test structures and methods for inspecting and utilizing the same
07/23/2003EP1328373A2 Method and materials for printing particle-enhanced electrical contacts
07/23/2003CN2562542Y Holder module assembly
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