Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2003
07/30/2003CN1433067A Package structure of display element
07/30/2003CN1433066A IC package capable of improving signal quality
07/30/2003CN1432966A Non-contact data carrier and its making process
07/30/2003CN1432858A Electronic circuit
07/30/2003CN1432619A Heat conducting siloxane composite and heat dissipating structure with the composite
07/30/2003CN1116790C Printed circuit board and electronic element assembly and manufacture thereof
07/30/2003CN1116697C Film carrier, its manufacture and mask used for the method
07/30/2003CN1116613C Method and apparatus for probing, testing, burning, repairing and programming of integrated circuits in closed environment using single apparatus
07/29/2003US6601225 Semiconductor device having definite size of input/output blocks and its designing method
07/29/2003US6601219 Electronic apparatus and manufacturing method for an electronic apparatus
07/29/2003US6601125 Minimizing signal stub length for high speed busses
07/29/2003US6600763 Flat side of crystal wafer active medium faces cooling chamber; optically transparent support;
07/29/2003US6600661 Method and apparatus for supporting a circuit component
07/29/2003US6600654 System for securing a processor socket
07/29/2003US6600652 Package retention module coupled directly to a socket
07/29/2003US6600651 Package with high heat dissipation
07/29/2003US6600650 Fastening device of CPU heat sink
07/29/2003US6600649 Heat dissipating device
07/29/2003US6600565 Real-time evaluation of stress fields and properties in line features formed on substrates
07/29/2003US6600541 Liquid crystal display
07/29/2003US6600364 Active interposer technology for high performance CMOS packaging application
07/29/2003US6600360 Semiconductor integrated circuit
07/29/2003US6600335 Method for ball grid array chip packages having improved testing and stacking characteristics
07/29/2003US6600333 Method and test structure for characterizing sidewall damage in a semiconductor device
07/29/2003US6600234 Mounting structure having columnar electrodes and a sealing film
07/29/2003US6600232 Flip-chip semiconductor package structure and process for fabricating the same
07/29/2003US6600231 Functional device unit and method of producing the same
07/29/2003US6600229 Planarizers for spin etch planarization of electronic components
07/29/2003US6600228 Keyhole at the top metal level prefilled with photoresist to prevent passivation damage even for a severe top metal rule
07/29/2003US6600227 System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package
07/29/2003US6600225 Semiconductor device with elongated interconnecting member and fabrication method thereof
07/29/2003US6600224 Thin film attachment to laminate using a dendritic interconnection
07/29/2003US6600223 Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure
07/29/2003US6600222 Stacked microelectronic packages
07/29/2003US6600221 Semiconductor device with stacked semiconductor chips
07/29/2003US6600218 Semiconductor device
07/29/2003US6600217 Mounting substrate and mounting method for semiconductor device
07/29/2003US6600216 Structure of a pin platform for integrated circuit
07/29/2003US6600215 Method and apparatus for coupling a semiconductor die to die terminals
07/29/2003US6600214 Electronic component device and method of manufacturing the same
07/29/2003US6600209 Mesh capacitor structure in an integrated circuit
07/29/2003US6600208 Versatile system for integrated circuit containing shielded inductor
07/29/2003US6600207 Structure to reduce line-line capacitance with low K material
07/29/2003US6600197 Thin film transistor having a heat sink that exhibits a high degree of heat dissipation effect
07/29/2003US6600181 Semiconductor integrated circuit and designing method thereof
07/29/2003US6600180 Semiconductor device, method of manufacturing the same and exposure mask for implantation
07/29/2003US6600179 Power amplifier with base and collector straps
07/29/2003US6600174 Light receiving element and semiconductor laser device
07/29/2003US6600171 Semiconductor component and system for fabricating contacts on semiconductor components
07/29/2003US6600103 Housing for an electronic device in microwave technology
07/29/2003US6600101 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
07/29/2003US6600006 Polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one
07/29/2003US6599841 Method for manufacturing a semiconductor device
07/29/2003US6599840 Material removal method for forming a structure
07/29/2003US6599833 Method and article for filling apertures in a high performance electronic substrate
07/29/2003US6599830 Semiconductor device and manufacturing method thereof
07/29/2003US6599823 Method for improving package bonding between multi-level interconnection lines and low K inter-metal dielectric
07/29/2003US6599814 Method for removal of sic
07/29/2003US6599809 Method of manufacturing semiconductor device having a marking recess
07/29/2003US6599808 Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode
07/29/2003US6599806 Method for manufacturing a capacitor of a semiconductor device
07/29/2003US6599795 Method of manufacturing semiconductor device including a step of forming a silicide layer, and semiconductor device manufactured thereby
07/29/2003US6599779 PBGA substrate for anchoring heat sink
07/29/2003US6599778 Chip and wafer integration process using vertical connections
07/29/2003US6599777 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance
07/29/2003US6599776 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
07/29/2003US6599775 Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
07/29/2003US6599774 Technique for underfilling stacked chips on a cavity MLC module
07/29/2003US6599773 Electronic part and method of fabricating thereof
07/29/2003US6599770 Process for manufacturing an optical device
07/29/2003US6599687 Applying a solution of a photosensitive polyhydroxyamide or polyhydroxyimide to a substrate and drying
07/29/2003US6599637 Power module; mechanical and thermal shock cracking resis-tance; excellent heat radiation property and heat cycle resistance
07/29/2003US6599578 Method for improving integrated circuits bonding firmness
07/29/2003US6599562 Rigid-printed wiring board and production method of the rigid-printed wiring board
07/29/2003US6599034 Sealed airtight container for optical-semiconductors and optical-semiconductors module
07/29/2003US6598667 Heat dispensing device for electronic parts
07/29/2003US6598666 CPU cooling arrangement
07/29/2003US6598409 Thermal management device
07/29/2003US6598403 Nanoscopic thermoelectric refrigerators
07/28/2003CA2390677A1 Electronic device having a getter used as a circuit element
07/24/2003WO2003061095A1 System level battery integration system
07/24/2003WO2003061029A2 Organic compositions
07/24/2003WO2003061006A2 Stacked die in die bga package
07/24/2003WO2003061004A2 Method for coding and authenticating semiconductor circuits
07/24/2003WO2003061003A1 Reverse wire bonding techniques
07/24/2003WO2003061002A1 Integration scheme for advanced beol metallization including low-k capping layer and method thereof
07/24/2003WO2003061001A1 Heat sink having high efficiency cooling capacity and semiconductor device comprising it
07/24/2003WO2003061000A1 Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
07/24/2003WO2003060999A1 Electronic component and panel and method for the production thereof
07/24/2003WO2003060998A1 Wire bond-less electronic component for use with an external circuit and method of manufacture
07/24/2003WO2003060997A1 Circuit board, semiconductor device using that circuit board, and electronic device using that circuit board
07/24/2003WO2003060993A1 Feedthrough contacts and method for producing the same
07/24/2003WO2003060990A1 Advanced process control (apc) of copper thickness for chemical mechanical planarization(cmp) optimization
07/24/2003WO2003060985A1 Semiconductor package device and method
07/24/2003WO2003060984A1 Surface mounted package with die bottom spaced from support board
07/24/2003WO2003060983A1 Bilayer hdp cvd / pe cvd cap in advanced beol interconnect structures and method thereof
07/24/2003WO2003060960A2 High density area array solder microjoining interconnect structure and fabrication method
07/24/2003WO2003060601A1 A wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same
07/24/2003WO2003060414A1 Small scale chip cooler assembly
07/24/2003WO2003041165A3 Electrically conductive thermal interface
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